Pane having an electrical connection element
A pane having a connection element, having; a substrate having an electrically conductive structure on at least a subregion of the substrate, the electrical connection element on at least a subregion of the electrically conductive structure, and a lead-free soldering compound which connects the electrical connection element to the electrically conductive structure in at least a subregion, wherein the lead-free soldering compound contains 58 to 62% by weight indium, 35 to 38% by weight tin, 1 to 3.5% by weight silver and 0.5 to 2% by weight copper.
1. A pane with at least one connection element at least comprising:
a substrate with an electrically conductive structure on at least one subregion of the substrate,
at least one electrical connection element on at least one subregion of the electrically conductive structure, and
a leadfree soldering compound, which connects the electrical connection element to the electrically conductive structure in at least one subregion,
wherein the leadfree soldering compound contains 58 wt.-% to 62 wt.-% indium, 35 wt.-% to 38 wt.-% tin, 1 wt.-% to 3.5 wt.-% silver, and 1.2 wt.-% to 1.7 wt.-% copper.
2. The pane according to claim 1 , wherein the leadfree soldering compound contains 59 wt.-% to 61 wt.-% indium, and 35 wt.-% to 38 wt.-% tin.
3. The pane according to claim 1 , wherein the leadfree soldering compound contains 1.5 wt.-% to 3 wt.-% silver.
4. The pane according to claim 1 , wherein the leadfree soldering compound contains up to 1 wt.-% nickel.
5. The pane according to claim 1 , wherein the substrate contains glass or polymers, and/or mixtures thereof.
6. The pane according to claim 1 , wherein the connection element contains copper, zinc, titanium, iron, nickel, cobalt, molybdenum, tin, manganese, and/or chromium and/or alloys thereof.
7. The pane according to claim 6 , wherein the connection element contains steel.
8. The pane according to claim 1 , wherein the electrically conductive structure contains silver.
9. The pane according to claim 1 , wherein the connection element is connected over its entire area to a subregion of the electrically conductive structure via a contact surface.
10. The pane according to claim 1 , wherein the layer thickness of the leadfree soldering compound is less than or equal to 600 μm.
11. A method for producing the pane according to claim 1 , comprising:
applying the leadfree soldering compound to the bottom of the connection element,
applying an electrically conductive structure to a substrate,
arranging the connection element with the soldering compound on the electrically conductive structure, and
soldering the connection element to the electrically conductive structure.
12. A method comprising:
using the pane according to claim 1 as a pane for motor vehicles, aircraft, ships, architectural glazing, and structural glazing.
13. The pane according to claim 1 , wherein the leadfree soldering compound contains 1.4 wt.-% to 1.6 wt.-% copper.
14. The pane according to claim 4 , wherein the leadfree soldering compound contains up to 0.1 wt.-% to 0.2 wt.-% nickel.
15. The pane according to claim 5 , wherein the glass is flat glass, float glass, quartz glass, borosilicate glass or soda lime glass.
16. The pane according to claim 5 , wherein the polymer is polyethylene, polypropylene, polycarbonate or polymethyl methacrylate.
17. The pane according to claim 7 , wherein the connection element contains stainless steel.
18. The method according to claim 12 , further comprising:
using the pane according to claim 1 as a pane with heating conductors and/or antenna conductors.