Power conversion apparatus having a metal plate for heat dissipation
View Patent ↗An inverter ( 300 ) is disposed toward an opening in a motor side metal housing ( 201 ). A power module ( 301 ) is disposed on a metal cover ( 207 ) that is in contact with the metal housing ( 201 ). The power module ( 301 ) includes a semiconductor element, a metal terminal connected to the semiconductor element, and resin that seals the semiconductor element and the metal terminal. A metal plate ( 306 ) is disposed on a surface of the power module ( 301 ) that is positioned opposite the metal cover ( 207 ). Heat generated by the power module ( 301 ) is dissipated from the metal cover ( 207 ) and from the metal plate ( 306 ). This improves the heat dissipation performance. Thus, the size of the power module can be reduced.
1. A power conversion apparatus comprising:
a motor; and
an inverter;
wherein at least one power module for the inverter is disposed on a metal housing for the motor; and
wherein a metal plate for heat dissipation is disposed on a surface of the power module that is positioned opposite a surface of the power module that is in contact with the metal housing;
wherein the power module includes semiconductor elements, a metal wiring connected to electrodes of the semiconductor elements, and insulating resin that seals the semiconductor elements and the metal wiring; and wherein a surface of the motor that is in contact with the metal housing and a surface of the motor that is in contact with the metal plate are covered with the insulating resin; and
wherein the resin of the power module is provided with a window that exposes the metal wiring sealed with the resin; and wherein a wiring connected to a winding of the motor is inserted into the window and joined to the metal wiring.
2. The power conversion apparatus according to claim 1 , wherein the semiconductor elements in the power module include an upper arm side semiconductor element, a lower arm side semiconductor element, and a motor output side semiconductor element, the motor output side semiconductor element being connected between a phase output terminal and a common connection point for the upper and lower arm side semiconductor elements.
3. A power conversion apparatus comprising:
a semiconductor element;
a metal wiring that is connected at one end to an electrode of the semiconductor element;
a power module having insulating resin that seals the semiconductor element and the metal wiring; and
a heat dissipation fin disposed on both surfaces of the power module;
wherein the power module and the heat dissipation fin are in contact with each other through the resin;
wherein the other end of the metal wiring is routed outward from the power module;
wherein the metal wiring routed from the drain and source electrodes of the semiconductor element is connected to a capacitor; and
wherein the metal wiring routed from the gate electrode of the semiconductor element is connected to a circuit board on which a part for controlling the semiconductor element is mounted, the capacitor and the circuit board being integrally housed in a case formed of resin.
4. The power conversion apparatus according to claim 3 , wherein a spacer is disposed between the heat dissipation fins disposed on either surface of the power module.