Controlling temperatures in optical circuits
Controlling temperatures in optical circuits includes using a device with a waveguide located between a base cladding and an over cladding. The base cladding is deposited over a substrate and the over cladding is made of a thermally conductive dielectric material.
1. A device for controlling temperatures in optical circuits, comprising:
a waveguide structure located between a base cladding and an over cladding;
said base cladding being deposited over a substrate; and
said over cladding being made from diamond, having nitrogen vacancy centers, as a thermally conductive dielectric material.
2. The device of claim 1 , wherein said thermally conductive dielectric material comprises a thermal conductivity higher than silicon dioxide.
3. The device of claim 1 , wherein said thermally conductive dielectric material further comprises aluminum nitride, beryllium oxide, or combinations thereof.
4. The device of claim 1 , wherein said thermally conductive dielectric material is in uniform contact with a top surface and each side surface of said waveguide structure.
5. The device of claim 1 , wherein said waveguide structure is part of an optical integrated circuit incorporated in said device.
6. The device of claim 1 , wherein said waveguide structure comprises a semiconductor material.
7. The device of claim 1 , wherein said thermally conductive dielectric material passively reduces joule heating within said waveguide structure when said waveguide structure is subjected to an active electric field.
8. The device of claim 1 , wherein said thermally conductive dielectric material is a thermal guide that directs heat from a heat source circuit component towards said waveguide structure.
9. The device of claim 1 , wherein said over cladding is deposited over multiple waveguides and said thermally conductive dielectric material distributes heat from a heat source circuit component across said multiple waveguides.
10. A method for forming thermally controlled optical circuits, comprising:
forming a base cladding over a substrate;
forming a layer of waveguide material over said base cladding;
forming an over cladding made of diamond, having nitrogen vacancy centers, over an entire exposed surface of said waveguide material.
11. The method of claim 10 , further comprising removing a portion of said layer of said waveguide material to form a waveguide prior to depositing said over cladding.
12. The method of claim 11 , further comprising forming the over cladding over multiple waveguides.
13. The method of claim 12 , further comprising forming a circuit component as a heat source above the multiple waveguides.
14. The method of claim 13 , further comprising forming the heat source in a location to thermally control multiple waveguides.
15. A system, comprising:
an integrated circuit comprising:
a base cladding formed over a substrate;
a waveguide formed over said base cladding, where said waveguide comprises an outer surface; and
an over cladding made of diamond, having nitrogen vacancy centers, is formed continuously across said outer surface of said waveguide.
16. The system of claim 15 , wherein said waveguide is located between a pair of electrodes that is electrically insulated from said waveguide with said over cladding.
17. The system of claim 15 , where said diamond is a thermally conductive dielectric material that directs heat from a heat source circuit component towards said waveguide.
18. The system of claim 15 , wherein said over cladding is deposited over multiple waveguides and said diamond is a thermally conductive dielectric material that distributes heat from hot spots across said multiple waveguides.