IP Library Granted Patent US 9,837,727
Granted Patent B2
US 9,837,727 · App. 14/424,939 · Granted Dec 5, 2017

Pane having an electrical connection element

Inventors: Klaus Schmalbuch (Aachen, DE); Bernhard Reul (Herzogenrath, DE); Mitja Rateiczak (Wuerselen, DE); Lothar Lesmeister (Landgraaf, NL)
Assignee: SAINT-GOBAIN GLASS FRANCE
H01R4/187H01Q1/3291H01R4/183H05B3/84H05K1/0212H05K2201/0323H05K2201/0326H05K2201/068Y10T29/49149
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Quick Facts
Patent No.
US 9,837,727
App. No.
14/424,939
Granted
Dec 5, 2017
Kind
B2
Abstract

A pane having an electrical connection element, said pane having: a substrate; an electrically conductive structure in a region of the substrate; and a connection element in a region of the electrically conductive structure, the connection element containing at least a chromium-containing steel. The connection element has a region which is crimped about a connecting cable and connected to the electrically conductive structure by means of a solder.

Claims (38)

1. A pane, comprising:

a substrate,

on a region of the substrate, an electrically conductive structure,

on a region of the electrically conductive structure, an electrical connection element that comprises at least a chromium-containing steel,

wherein the electrical connection element comprises at least 66.5 wt.-% to 89.5 wt.-% iron, 10.5 wt.-% to 20 wt.-% chromium, 0 wt.-% to 1 wt.-% carbon, 0 wt.-% to 5 wt.-% nickel, 0 wt.-% to 2 wt.-% manganese, 0 wt.-% to 2.5 wt.-% molybdenum, 0 wt.-% to 2 wt.-% niobium, and 0 wt.-% to 1 wt.-% titanium,

wherein a coefficient of thermal expansion of the connection element is from 9×10 −6 /° C. to 13×10 −6 /° C. in a temperature range from 0° C. to 300 ° C.,

wherein a difference between a coefficient of thermal expansion of the substrate and a coefficient of thermal expansion of the electrical connection element is less than 5×10 −6 /°C.,

wherein the electrical connection element has a region crimped around a connection cable wherein a lead-free solder material is disposed between the crimped region and the electrically conductive structure so that the crimped region of the electrical connection element is directly connected to the electrically conductive structure via the lead-free solder material, and

wherein the connection cable includes a stranded wire conductor.

2. The pane according to claim 1 , wherein a material thickness of the electrical connection element is from 0.1 mm to 2 mm.

3. The pane according to claim 2 , wherein the material thickness of the connection element is from 0.2 mm to 1 mm.

4. The pane according to claim 2 , wherein the material thickness of the connection element is from 0.3 mm to 0.5 mm.

5. The pane according to claim 1 , wherein the electrical connection element comprises at least 77 wt.-% to 84 wt.-% iron, 16 wt.-% to 18.5 wt.-% chromium, 0 wt.-% to 0.1 wt.-% carbon, 0 wt.-% to 1 wt.-% manganese, 0 wt.-% to 1 wt.-% niobium, 0 wt.-% to 1.5 wt.-% molybdenum, and 0 wt.-% to 1 wt.-% titanium.

6. The pane according to claim 1 , wherein the substrate contains glass.

7. The pane according to claim 6 , wherein the substrate contains flat glass, float glass, quartz glass, borosilicate glass, or soda lime glass.

8. The pane according to claim 1 , wherein the electrically conductive structure contains at least silver and has a layer thickness of 5 μm to 40 μm.

9. The pane according to claim 8 , wherein the electrically conductive structure contains silver particles and glass frits.

10. The pane according to claim 1 , wherein a layer thickness of the lead-free solder material is less than or equal to 6.0 ×10 −4 m.

11. The pane according to claim 1 , wherein the lead-free solder material contains 35 wt.-% to 69 wt.-% bismuth, 30 wt.-% to 50 wt.-% tin, 1 wt.-% to 10 wt.-% silver, and 0 wt.-% to 5 wt.-% copper.

12. The pane according to claim 1 , wherein the lead-free solder material contains 90 wt.-% to 99.5 wt.-% tin, 0.5 wt.-% to 5 wt.-% silver, and 0 wt.-% to 5 wt.-% copper.

13. The pane according to claim 1 , wherein the electrical connection element is coated with nickel, tin, copper, or silver.

14. A method comprising:

applying the pane according to claim 1 , in buildings or in means of transportation for travel on land, in the air, or on water.

15. The method of claim 14 , comprising:

applying the pane in rail vehicles or motor vehicles.

16. The method of claim 14 , comprising:

applying the pane in buildings or in means of transportation as a windshield, rear window, side window, or glass roof.

17. The method of claim 14 , comprising:

applying the pane as a heatable pane or as a pane with an antenna function.

18. The pane according to claim 1 , wherein the lead-free solder material contains tin and bismuth, indium, zinc, copper, silver, or compositions thereof.

19. A method for production of a pane, comprising:

connecting an electrical connection element that contains at least a chromium-containing steel to a connection cable by crimping in a region, wherein the connection cable includes a stranded wire conductor,

wherein the electrical connection element comprises at least 66.5 wt.-% to 89.5 wt.-% iron, 10.5 wt.-% to 20 wt.-% chromium, 0 wt.-% to 1 wt.-% carbon, 0 wt.-% to 5 wt.-% nickel, 0 wt.-% to 2 wt.-% manganese, 0 wt.-% to 2.5 wt.-% molybdenum, 0 wt.-% to 2 wt.-% niobium, and 0 wt.-% to 1 wt.-% titanium,

wherein a coefficient of thermal expansion of the connection element is from 9×10 −6 /° C. to 13×10 −6 /° C. in a temperature range from 0 ° C. to 300 ° C.,

wherein a difference between a coefficient of thermal expansion of the substrate and a coefficient of thermal expansion of the electrical connection element is less than 5×10 −6 /° C.,

applying lead-free solder material on the bottom of the crimped region of the connection element, wherein the lead-free solder material is disposed between the crimped region and the electrically conductive structure,

disposing the electrical connection element with the lead-free solder material on a region of an electrically conductive structure that is applied on a region of a substrate, and

connecting the electrical connection element with energy input, to the electrically conductive structure.

Assignments (2)
NUNC PRO TUNC ASSIGNMENT Recorded May 16, 2025
From: SAINT-GOBAIN GLASS FRANCE
To: SAINT-GOBAIN SEKURIT FRANCE
Reel/Frame 071969/0743 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2015
From: SCHMALBUCH, KLAUS; REUL, BERNHARD; RATEICZAK, MITJA; LESMEISTER, LOTHAR
To: SAINT-GOBAIN GLASS FRANCE
Reel/Frame 036270/0905 →
Priority Claims (1)
EP 12184408 · Sep 14, 2012 · regional
Continuity (1)
Related Publication 20150236431A1 · Aug 20, 2015