IP Library Granted Patent US 9,685,589
Granted Patent B2
US 9,685,589 · App. 14/427,687 · Granted Jun 20, 2017

Optoelectronic component with a layer structure

Inventors: Werner Bergbauer (Windberg, DE); Philipp Drechsel (Regensburg, DE); Peter Stauss (Regensburg, DE); Patrick Rode (Regensburg, DE)
Assignee: OSRAM Opto Semiconductors GmbH
H01L33/325H01L21/0254H01L21/02381H01L21/02458H01L21/02488H01L21/02505H01L33/007H01L33/025H01L33/12H01L33/32
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Quick Facts
Patent No.
US 9,685,589
App. No.
14/427,687
Granted
Jun 20, 2017
Kind
B2
Abstract

An optoelectronic component includes a layer structure which has a first gallium nitride layer and an aluminum-containing nitride intermediate layer. In this case, the aluminum-containing nitride intermediate layer adjoins the first gallium nitride layer. The layer structure has an undoped second gallium nitride layer which adjoins the aluminum-containing nitride intermediate layer.

Claims (33)

1. A nitride semiconductor component comprising a layer structure having a first gallium nitride layer and an aluminum-containing nitride intermediate layer,

wherein the aluminum-containing nitride intermediate layer adjoins the first gallium nitride layer,

the layer structure has an undoped second gallium nitride layer adjoining the aluminum-containing nitride intermediate layer,

the layer structure has a third gallium nitride layer,

the third gallium nitride layer has a silicon doping which is variable perpendicular to the layer plane,

the third gallium nitride layer adjoins the second gallium nitride layer,

doping of the third gallium nitride layer increases proceeding from an interface with the second gallium nitride layer,

the layer structure has a fourth gallium nitride layer,

the fourth gallium nitride layer has a silicon doping,

the fourth gallium nitride layer adjoins the third gallium nitride layer,

the layer structure comprises an LED layer structure adjoining the fourth gallium nitride layer, and

a proportion of aluminum increases throughout the aluminum-containing nitride intermediate layer in a direction of the undoped second gallium nitride layer.

2. The nitride semiconductor component according to claim 1 , wherein the undoped second gallium nitride layer has a thickness of 30 nm to 2000 nm.

3. The nitride semiconductor component according to claim 1 , wherein the third gallium nitride layer has a thickness of 20 nm to 500 nm.

4. The nitride semiconductor component according to claim 1 , wherein the first gallium nitride layer has a thickness of 500 nm to 2000 nm.

5. The nitride semiconductor component according to claim 1 , further comprising a masking layer comprising silicon nitride embedded into the first gallium nitride layer.

6. The nitride semiconductor component according to claim 1 , wherein the aluminum-containing nitride intermediate layer has a thickness of 5 nm to 100 nm.

7. The nitride semiconductor component according to claim 1 , wherein the proportion of aluminum in the aluminum-containing nitride intermediate layer is at least doubled between the first gallium nitride layer and the undoped second gallium nitride layer.

8. The nitride semiconductor component according to claim 1 , wherein the layer structure has a plurality of first gallium nitride layers and aluminum-containing nitride intermediate layers which alternately follow one another.

9. The nitride semiconductor component according to claim 1 , wherein the layer structure is arranged on a silicon substrate.

10. A nitride semiconductor component comprising a layer structure having a first gallium nitride layer and an aluminum-containing nitride intermediate layer,

wherein the aluminum-containing nitride intermediate layer adjoins the first gallium nitride layer,

the layer structure has an undoped second gallium nitride layer adjoining the aluminum-containing nitride intermediate layer,

the layer structure has a third gallium nitride layer,

the third gallium nitride layer has a silicon doping which is variable perpendicular to the layer plane,

the third gallium nitride layer adjoins the second gallium nitride layer,

doping of the third gallium nitride layer increases proceeding from an interface with the second gallium nitride layer,

the layer structure has a fourth gallium nitride layer,

the fourth gallium nitride layer has a silicon doping,

the fourth gallium nitride layer adjoins the third gallium nitride layer,

the layer structure comprises an LED layer structure adjoining the fourth gallium nitride layer,

the fourth gallium nitride layer has a thickness of 1000 nm to 3000 nm, and

a proportion of aluminum increases throughout the aluminum-containing nitride intermediate layer in a direction of the undoped second gallium nitride layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: BERGBAUER, WERNER; DRECHSEL, PHILIPP; STAUSS, PETER; RODE, PATRICK
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 035498/0586 →
Priority Claims (1)
DE 10 2012 217 631 · Sep 27, 2012 · national
Continuity (1)
Related Publication 20150228858A1 · Aug 13, 2015