Optoelectronic semiconductor chip having a plurality of active regions arranged alongside one another
View Patent ↗An optoelectronic semiconductor chip is disclosed. The optoelectronic semiconductor chip includes a semiconductor layer sequence having an active zone suitable for emitting radiation, a carrier substrate, and a mirror layer, the mirror layer being arranged between the semiconductor layer sequence and the carrier substrate, wherein the semiconductor layer sequence is subdivided into a plurality of active regions arranged alongside one another, wherein the plurality of active regions are separated from one another in each case by a trench in the semiconductor layer sequence, wherein the trench in each case severs the semiconductor layer sequence and the mirror layer, wherein the mirror layer has side surfaces facing a trench and side surfaces facing an outer side of the semiconductor chip, wherein the side surfaces of the mirror layer that face an outer side of the semiconductor chip have a metallic encapsulation layer.
1. An optoelectronic semiconductor chip comprising:
a semiconductor layer sequence having an active zone suitable for emitting radiation;
a carrier substrate; and
a mirror layer arranged between the semiconductor layer sequence and the carrier substrate,
wherein the semiconductor layer sequence is subdivided into a plurality of active regions arranged alongside one another, wherein the plurality of active regions are separated from one another in each case by a trench in the semiconductor layer sequence, wherein the trench in each case severs the semiconductor layer sequence and the minor layer,
wherein the mirror layer has side surfaces facing trenches and side surfaces facing outer sides of the semiconductor chip, wherein the side surfaces of the mirror layer that face the outer sides of the semiconductor chip comprise a metallic encapsulation layer, wherein at least one portion of the side surfaces of the mirror layer that face the trenches comprises a dielectric encapsulation layer, and wherein the dielectric encapsulation layer partially fills the trenches.
2. The optoelectronic semiconductor chip according to claim 1 , wherein all the side surfaces of the mirror layer facing the trenches comprise the dielectric encapsulation layer.
3. The optoelectronic semiconductor chip according to claim 1 , wherein the active regions comprise at least one inner active region, in which all the side surfaces of the mirror layer in each case face the trenches, and outer active regions, in which at least one side surface of the mirror layer faces an outer side of the semiconductor chip.
4. The optoelectronic semiconductor chip according to claim 3 , wherein side surfaces of the mirror layer in the outer active regions facing the trenches and being adjacent to the outer side of the semiconductor chip comprise the metallic encapsulation layer in an outer region adjacent to the outer side and comprise the dielectric encapsulation layer in an inner region.
5. The optoelectronic semiconductor chip according to claim 4 , wherein the outer region which is adjacent to the outer side and which comprises the metallic encapsulation layer has a width of between 5 μm and 10 μm.
6. The optoelectronic semiconductor chip according to claim 3 , wherein in the outer active regions all the side surfaces of the mirror layer facing the trenches and being adjacent to the outer side of the semiconductor chip at one side comprises the metallic encapsulation layer.
7. The optoelectronic semiconductor chip according to claim 3 , wherein in the outer active regions all the side surfaces of the mirror layer comprises the metallic encapsulation layer.
8. The optoelectronic semiconductor chip according to claim 1 , wherein the dielectric encapsulation layer contains an aluminum oxide or a silicon oxide.
9. The optoelectronic semiconductor chip according to claim 1 , wherein the dielectric encapsulation layer is free of pores.
10. The optoelectronic semiconductor chip according to claim 1 , wherein the metallic encapsulation layer comprises at least one layer composed of a metal or a metal alloy.
11. The optoelectronic semiconductor chip according to claim 1 , wherein the metallic encapsulation layer comprises at least one of platinum, titanium or gold.
12. The optoelectronic semiconductor chip according to claim 1 , wherein the mirror layer has a smaller lateral extent than the semiconductor layer sequence, and partial regions of at least one of the dielectric encapsulation layer and the metallic encapsulation layer extends below the semiconductor layer sequence.
13. The optoelectronic semiconductor chip according to claim 1 , wherein the semiconductor layer sequence is completely covered by the dielectric encapsulation layer.
14. The optoelectronic semiconductor chip according to claim 1 , wherein the plurality of active regions form a matrix composed of a plurality of rows and columns.
15. The optoelectronic semiconductor chip according to claim 1 , wherein the plurality of active regions are connected in series.