Sensor chip and method for storing sensor chip
A sensor chip includes: a transparent support; a metal thin film formed on one surface of the transparent support; and a reaction section in which a ligand is immobilized on an other surface of the metal thin film that is not in contact with the transparent support, wherein the sensor chip also includes a closed space-forming member which forms a closed space such that at least the reaction section is housed in the closed space, and water content in the closed space is adjusted to satisfy: X/Y<10 (μg/mm 2 ) (wherein, X represents the water content in the closed space; and Y represents the surface area of the metal thin film in the closed space).
1. A sensor chip, comprising:
a transparent support;
a metal thin film formed on one surface of the transparent support;
a reaction section in which a ligand is immobilized on a surface of the metal thin film that is not in contact with the transparent support; and
a closed space-forming member which forms a closed space such that at least the reaction section is housed in the closed space, wherein the closed space-forming member comprises a moisture barrier material and has a structure such that a water content in the closed space is maintained,
wherein the water content in the closed space is adjusted such that the following Formula (1) is satisfied:
X/Y< 10 (μg/mm 2 ) (1)
where:
X represents the water content in the closed space; and
Y represents a surface area of the metal thin film in the closed space,
wherein the closed space is formed by the transparent support and the closed space-forming member, and
wherein the closed space-forming member comprises a top cover and a plurality of side walls which, together with the transparent support, enclose the closed space.
2. The sensor chip according to claim 1 , wherein the closed space-forming member comprises a polyvinylidene chloride film, a polypropylene film, or a polyacrylonitrile film.
3. The sensor chip according to claim 1 , wherein the closed space-forming member comprises a multilayer film including a plurality of resin films.
4. The sensor chip according to claim 1 , wherein the closed space-forming member comprises a composite film including a metal thin film and a resin film.
5. The sensor chip according to claim 1 , wherein the closed space-forming member comprises a glass or ceramic plate.
6. The sensor chip according to claim 1 , wherein the side walls of the closed space-forming member contact the metal thin film formed on the transparent substrate.
7. A method of storing a sensor chip which comprises: a transparent support; a metal thin film formed on one surface of the transparent support; and a reaction section in which a ligand is immobilized on a surface of the metal thin film that is not in contact with the transparent support, the method comprising:
providing a closed-space forming member on the transparent support to form a closed space such that at least the reaction section is housed in the closed space, wherein the closed space-forming member comprises a moisture barrier material and has a structure such that a water content in the closed space is maintained; and
adjusting the water content in the closed space such that the following Formula (1) is satisfied:
X/Y< 10 (μg/mm 2 ) (1)
where:
X represents the water content in the closed space; and
Y represents a surface area of the metal thin film in the closed space,
wherein the closed space is formed by the transparent support and the closed space-forming member, and
wherein the closed space-forming member comprises a top cover and a plurality of side walls which, together with the transparent support, enclose the closed space.
8. The method according to claim 7 , wherein the closed space-forming member comprises a polyvinylidene chloride film, a polypropylene film, or a polyacrylonitrile film.
9. The method according to claim 7 , wherein the closed space-forming member comprises a multilayer film including a plurality of resin films.
10. The method according to claim 7 , wherein the closed space-forming member comprises a composite film including a metal thin film and a resin film.
11. The method according to claim 7 , wherein the closed space-forming member comprises a glass or ceramic plate.
12. The method according to claim 7 , wherein the closed-space forming member is provided on the transparent support such that the side walls of the closed space-forming member contact the metal thin film formed on the transparent substrate.
13. A sensor chip, comprising:
a transparent support;
a metal thin film formed on one surface of the transparent support;
a reaction section in which a ligand is immobilized on a surface of the metal thin film that is not in contact with the transparent support;
a reaction space-forming member which contacts the metal thin film, forms a reaction space above the reaction section, and has at least one opening for a sample solution; and
a closed space-forming member which contacts the reaction space-forming member and closes the at least one opening in the reaction space forming member, to form a closed space in which at least the reaction section is housed,
wherein the closed space-forming member comprises a high moisture barrier film or a high moisture barrier plate, such that a water content in the closed space is maintained, and
wherein the water content in the closed space is adjusted such that the following Formula (1) is satisfied:
X/Y< 10 (μg/mm 2 ) (1)
where:
X represents the water content in the closed space; and
Y represents a surface area of the metal thin film in the closed space.
14. The sensor chip according to claim 13 , wherein the reaction space-forming member comprises a flow path member which has a plurality of openings and which, together with the transparent substrate, forms a flow path; and
wherein the closed space-forming member contacts the flow path member and closes the plurality of openings in the flow path member.
15. The sensor chip according to claim 13 , wherein the reaction space-forming member comprises a well member which has an opening; and
wherein the closed space-forming member contacts the well member and closes the plurality of openings in the well member.
16. The sensor chip according to claim 13 , wherein the closed space-forming member comprises a polyvinylidene chloride film, a polypropylene film, or a polyacrylonitrile film.
17. The sensor chip according to claim 13 , wherein the closed space-forming member comprises a multilayer film including a plurality of resin films.
18. The sensor chip according to claim 13 , wherein the closed space-forming member comprises a composite film including a metal thin film and a resin film.
19. The sensor chip according to claim 13 , wherein the closed space-forming member comprises a glass or ceramic plate.