IP Library Granted Patent US 9,888,576
Granted Patent B2
US 9,888,576 · App. 14/431,846 · Granted Feb 6, 2018

Method for working an apparatus having at least one electrical layer structure, and component arrangement for working an apparatus having at least one electrical layer structure

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,888,576
App. No.
14/431,846
Granted
Feb 6, 2018
Kind
B2
Abstract

Various embodiments may relate to a method for working an apparatus having at least one electrical layer structure. The electrical layer structure includes a dielectric layer in physical contact with an electrically conductive layer and the electrical layer structure has a first electrical conductivity. The method may include forming an electrical connection to the dielectric layer of the electrical layer structure, and forming an electrical voltage profile at the electrical connection in such a way that a second electrical conductivity is formed; wherein the second electrical conductivity is greater than the first electrical conductivity. The electrical layer structure has the second electrical conductivity after the reduction of the electrical voltage profile.

Claims (39)

1. A method for working an apparatus having at least one electrical layer structure, wherein the electrical layer structure comprises a dielectric layer in physical contact with an electrically conductive layer and the electrical layer structure has a first electrical conductivity, the method comprising:

forming an electrical connection to the dielectric layer of the electrical layer structure;

forming an electrical voltage profile at the electrical connection in such a way that a second electrical conductivity is formed; wherein the second electrical conductivity is greater than the first electrical conductivity; and

reducing the electrical voltage profile at the electrical connection, wherein the electrical layer structure has the second electrical conductivity after the reduction of the electrical voltage profile,

wherein in at least one region of the electrical layer structure a part of the dielectric layer of the electrical layer structure is removed before the electrical connection is formed.

2. The method as claimed in claim 1 ,

wherein the dielectric layer includes a substance or a substance mixture, wherein the applied electrical voltage profile has a maximum magnitude of the voltage which is greater than the breakdown voltage of the substance or of the substance mixture of the dielectric layer.

3. The method as claimed in claim 1 ,

wherein the apparatus comprises an electronic component unit, wherein the electrical layer structure is formed as a region of the electronic component unit or is electrically connected to a region of the electronic component unit.

4. The method as claimed in claim 3 ,

wherein the electrically conductive layer of the electrical layer structure is designed as an electrical bus which is electrically connected to the electronic component unit.

5. The method as claimed in claim 3 ,

wherein the electrically conductive layer of the electrical layer structure is designed as an electrode or a contact pad of the electronic component unit.

6. The method as claimed in claim 1 ,

wherein the dielectric layer of the electrical layer structure is designed as a thin-film encapsulation and/or comprises a dielectric metal oxide.

7. The method as claimed in claim 1 ,

wherein the magnitude of the voltage of the electrical voltage profile is temporally modulated.

8. The method as claimed in claim 7 ,

wherein the maximum magnitude of the electrical voltage profile has a magnitude of greater than approximately 1 V.

9. The method as claimed in claim 1 ,

wherein removing a part of the dielectric layer comprises ballistically removing the dielectric layer.

10. The method as claimed in claim 1 ,

wherein the electrical connection to the electrical layer structure is formed in the region of the removed dielectric layer.

11. The method as claimed in claim 1 ,

wherein the dielectric layer is at least partly removed from at least two regions of the electrical layer structure.

12. The method as claimed in claim 1 ,

wherein the apparatus is formed as a component which provides electromagnetic radiation; or

wherein the apparatus is formed as a component which takes up electromagnetic radiation.

13. A component arrangement for working an apparatus having at least one electrical layer structure having a first electrical conductivity, the component arrangement comprising:

an apparatus having at least one electrical layer structure, wherein the electrical layer structure comprises a dielectric layer in physical contact with an electrically conductive layer and the electrical layer structure has a first electrical conductivity, and wherein in at least one region of the electrical layer structure a part of the dielectric layer of the electrical layer structure is removed;

a voltage source designed for providing a modulatable voltage profile, wherein the voltage source is electrically connected to the electrical layer structure in such a way that the electrical circuit is closed by the electrical layer structure and that the electrical connection with the electrical layer structure is formed in the region of the removed dielectric layer;

a control unit designed for controlling the voltage profile of the voltage source; and

a measuring device for measuring the electrical conductivity of the electrical layer structure, wherein the measuring device is designed in such a way that the measured electrical conductivity is communicated to the control unit;

wherein the control unit is designed in such a way that the voltage profile is controlled depending on the measured electrical conductivity.

14. The component arrangement as claimed in claim 13 , wherein the measuring device is designed for measuring the electrical resistance of the electrical layer structure.

15. The component arrangement as claimed in claim 13 , wherein the measuring device is designed for measuring the electrical voltage drop across the electrical layer structure.

16. The component arrangement as claimed in claim 13 , wherein the measuring device is designed for measuring the electric current through the electrical layer structure.

17. The component arrangement as claimed in claim 13 , wherein the control unit is designed as a phase dimmer, wherein the control signal for phase chopping control or phase gating control is a function of the measured conductivity.

18. The component arrangement as claimed claim 13 , wherein the control unit is designed as a pulse modulator, wherein the control signal for pulse modulation is a function of the measured conductivity.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2020
From: OSRAM OLED GMBH
To: DOLYA HOLDCO 5 LIMITED
Reel/Frame 053464/0374 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 11/658.772 REPLACED 11/658.772 PROPERTY NUMBERS PREVIOUSLY RECORDED AT REEL: 053464 FRAME: 0395. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 11, 2020
From: DOLYA HOLDCO 5 LIMITED
To: PICTIVA DISPLAYS INTERNATIONAL LIMITED
Reel/Frame 053464/0395 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2015
From: LANG, ERWIN; SCHWAMB, PHILIPP
To: OSRAM OLED GMBH
Reel/Frame 035281/0325 →