Optoelectronic component with integrated protection diode and method of producing same
View Patent ↗An optoelectronic component includes an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged, wherein the first surface adjoins a molded body, a first pin and a second pin are embedded in the molded body and electrically conductively connect to the first contact and the second contact, and a protection diode is embedded in the molded body and electrically conductively connect to the first contact and the second contact.
1. An optoelectronic component comprising:
an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged, wherein the first surface adjoins a molded body;
a first pin and a second pin that are galvanically grown, embedded in the molded body and electrically conductively connect to the first contact and the second contact; and
a protection diode is embedded in the molded body and electrically conductively connects to the first contact and the second contact, and the protection diode is at least partially embedded in the first pin and the second pin.
2. The optoelectronic component according to claim 1 , wherein the protection diode has a first terminal and a second terminal, and the first terminal and the second terminal face toward the first surface of the semiconductor chip.
3. The optoelectronic component according to claim 1 , wherein the protection diode has a first terminal and a second terminal, and the first terminal and the second terminal face away from the first surface of the semiconductor chip.
4. The optoelectronic component according to claim 1 , wherein the first pin and the second pin comprise copper.
5. The optoelectronic component according to claim 1 , wherein the molded body comprises a plastic.
6. The optoelectronic component according to claim 1 , wherein the semiconductor chip has a second surface opposite to the first surface, and the semiconductor chip emits electromagnetic radiation through the second surface.
7. The optoelectronic component according to claim 1 , wherein the first pin and the second pin serve as a chip carrier for the optoelectronic semiconductor chip.
8. The optoelectronic component according to claim 1 , wherein the first and second pins terminate flush with the molded body on a side of the first and second pins facing away from the semiconductor chip.
9. An optoelectronic component comprising:
an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged, wherein the first surface adjoins a molded body;
a first pin and a second pin are embedded in the molded body and electrically conductively connect to the first contact and the second contact; and
a protection diode is embedded in the first pin, the second pin and the molded body, and electrically conductively connects to the first contact and the second contact.