Adhesives and related methods

1. A cure in place pressure sensitive adhesive consisting of:

20-80 wt % of a pre-polymerized acrylic backbone base polymer having a molecular weight (Mw) of 100,000 to 1,000,000;

0-30 wt % of tackifier;

5-40 wt % of at least one liquid reactive oligomer;

0-30 wt % of at least one of an acrylic-epoxy functional component;

0-30 wt % epoxy functional olefin;

0-2 wt % of at least one of a metal chelate crosslinker-catalyst and external catalyst; and

at least one structural diluent, wherein the structural diluent is selected from the group consisting of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (S-21), Bis[(3,4-epoxycyclohexyl)methyl]adipate (S-28), difunctional bisphenol A/epichlorohydrin derived liquid epoxy resin (Epon 828), Bisphenol A epoxy resin having a weight per epoxide of 235-263 g/eg as measured by ASTM D1652(Epon 834), beta-(3,4-epoxycyclohexyl)ethyltrimethoxysilane (A-186), gamma-glycidoxypropyltrimethoxysilane (A-187), glycidyl ester of neodecanoic acid (EP-10), isocyanate-functional urethane acrylate (Desmolux D100), isocyanate-bearing urethane acrylate (Desmolux D200), aliphatic polyisocyanate (low-viscosity hexamethylene diisocyanate (HDI) biuret) (Desmodur N3200), aliphatic polyisocyanate (hexamethylene diisocyanate (HDI) biuret) (Desmodur N100), aliphatic polyisocyanate (hexamethylene diisocyanate (HDI) trimer) (Desmodur N3300), poly(propylene oxide) (PPO) oligomer having a molecular weight (Mw) of less than 5,000 daltons, trimethylolpropane oxetane (TMPO), poly(ethylene oxide) (PEO) oligomer having a molecular weight (Mw) of less than 5,000 daltons, ethyl hexyl oxetane (2EH oxetane), difunctional oxetane, ethoxylated bisphenol A diacrylate of the following formula (7) in which n+m=3, ethoxylated trimethylolpropane triacrylate of the following formula (8), bisphenol A diglycidyl ether diacrylate of the following formula (9), 1,2-cyclic ethers, 1,3-cyclic ethers, 1,4-cyclic ethers, anhydrides, lactones, lactams, cyclic ethers, siloxanes, oxazolines, oxalidines, and bismaleimides;

2. The adhesive of claim 1 wherein the acrylic backbone base polymer has a Mw of 250,000 to 750,000.

3. The adhesive of claim 1 wherein a stimulus for promoting polymerization is selected from the group consisting of radiation, heat, moisture, pressure, ultrasound, chemical exposure, and combinations thereof.

4. The adhesive of claim 1 wherein the acrylic backbone base polymer comprises an acrylic block base polymer, the acrylic block base polymer comprising two functional end segments and one non-reactive middle segment, the reactive segments include one or more monomers of the non-reactive segment.

5. The adhesive of claim 1 wherein the structural diluent is selected from the group consisting of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (S-21), Bis[(3,4-epoxycyclohexyl)methyl]adipate (S-28), difunctional bisphenol A/epichlorohydrin derived liquid epoxy resin (Epon 828), Bisphenol A epoxy resin having a weight per epoxide of 235-263 g/eg as measured by ASTM D1652(Epon 834), beta-(3,4epoxycyclohexyl)ethyltrimethoxysilane (A-186), gamma-glycidoxypropyltrimethoxysilane (A-187), glycidyl ester of neodecanoic acid (EP10), isocynate-functional urethane acrylate (Desmolux D100), isocyanate-bearing urethane acrylate (Desmolux D200), aliphatic polyisocyanate (low-viscosity hexamethylene diisocynate (HDI) biuret) (Desmodur N3200), aliphatic polyisocyanate (hexamethylene diisocynate (HDI) biuret) (Desmodur N100), aliphatic polyisocyanate (hexamethylene diisocynate (HDI) trimer) (Desmodur N3300), poly(propylene oxide) (PPO) oligomer having a molecular weight (MW) of less than 5,000 daltons, trimethylolpropane oxetane (TMPO), poly(ethylene oxide) (PEO) oligomer having a molecular weight (Mw) of less than 5,000 daltons, ethyl hexyl oxetane (2EH oxetane), difunctional oxetane, ethoxylated bisphenol A diacrylate of the following formula (7) in which n+m=3, ethoxylated trimethylolpropane triacrylate of the following formula (8), bisphenol A diglycidyl ether diacrylate of the following formula (9), 1,2-cyclic ethers, 1,3-cyclic ethers, 1,4-cyclic ethers, butyrolactone, valerolactone, caprolactone, methy-butyrolactone, butyrolactam, valerolactam, caprolactam, cyclic ethers, siloxanes, oxazolines, oxalidines, bismaleimides,

and

lactones of the following formulas (10)-(12)

wherein n is 4 or 5, h, i, k, and m are independently 1 or 2 and each R is independently chosen from H or hydrocarbyl containing up to 12 carbon atoms.

6. The adhesive of claim 1 wherein the at least one liquid reactive oligomer is a silane terminated polyether (STPE).

7. The adhesive of claim 4 wherein the non-reactive segment is non-reactive with the reactive functional group of the reactive segments.

8. The adhesive of claim 1 wherein the acrylic backbone base polymer comprises an acrylic block base polymer, the acrylic block base polymer comprising one functional end segment and one non-reactive middle segment.

9. The adhesive of claim 8 wherein the non-reactive segment is non-reactive with the reactive functional group of the reactive segment.

10. The adhesive of claim 8 wherein the reactive segment includes one or more monomers of the non-reactive segment.

11. A cure in place pressure sensitive adhesive comprising:

20-80 wt % of a pre-polymerized acrylic base polymer having a molecular weight (Mw) of 100,000 to 1,000,000;

0-30 wt % of tackifier;

5-40 wt % of at least one liquid reactive oligomer, the at least one liquid reactive oligomer is a silane terminated polyether (STPE);

0-30 wt % of at least one of an acrylic-epoxy functional component;

0-30 wt % epoxy functional olefin;

0-2 wt % of at least one of a metal chelate crosslinker-catalyst and external catalyst; and

at least one structural diluent, the structural diluent is selected from the group consisting of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (S-21), Bis[(3,4-epoxycyclohexyl)methyl]adipate (S-28), difunctional bisphenol A/epichlorohydrin derived liquid epoxy resin (Epon 828), Bisphenol A epoxy resin having a weight per epoxide of 235-263 g/eq as measured by ASTM D1652 (Epon 834), beta-(3,4-epoxycyclohexyl)ethyltrimethoxysilane (A-186), gamma-glycidoxypropyltrimethoxysilane (A-187), glycidyl ester of neodecanoic acid (EP-10), isocyanate-functional urethane acrylate (Desmolux D100), isocyanate-bearing urethane acrylate (Desmolux D200), aliphatic polyisocyanate (low-viscosity hexamethylene diisocyanate (HDI) biuret) (Desmodur N3200), aliphatic polyisocyanate (hexamethylene diisocyanate (HDI) biuret) (Desmodur N100), aliphatic polyisocyanate (hexamethylene diisocyanate (HDI) trimer) (Desmodur N3300), poly(propylene oxide) (PPO) oligomer having a molecular weight (Mw) of less than 5,000 daltons, trimethylolpropane oxetane (TMPO), poly(ethylene oxide) (PEO) oligomer having a molecular weight (Mw) of less than 5,000 daltons, ethyl hexyl oxetane (2EH oxetane), difunctional oxetane, trimethylolpropane triacrylate (TMPTA) of the following formula (5), tripropyleneglycol diacrylate (TPGDA) of the following formula (6), ethoxylated bisphenol A diacrylate of the following formula (7) in which n+m=3, ethoxylated trimethylolpropane triacrylate of the following formula (8), bisphenol A diglycidyl ether diacrylate of the following formula (9), 1,2-cyclic ethers, 1,3-cyclic ethers, 1,4-cyclic ethers, anhydrides, lactones, lactams, cyclic ethers, siloxanes, oxazolines, oxalidines, and bismaleimides;

12. The adhesive of claim 11 wherein the acrylic backbone base polymer includes an acrylic block base polymer, the acrylic block base polymer including two functional end segments and one non-reactive middle segment.

13. The adhesive of claim 12 wherein the non-reactive segment is non-reactive with the reactive functional group of the reactive segments.

14. The adhesive of claim 12 wherein the reactive segments include one or more monomers of the non-reactive segment.

15. The adhesive of claim 11 wherein the acrylic backbone base polymer includes an acrylic block base polymer, the acrylic block base polymer including one functional end segment and one non-reactive middle segment.

16. The adhesive of claim 15 wherein the non-reactive segment is non-reactive with the reactive functional group of the reactive segment.

17. The adhesive of claim 15 wherein the reactive segment includes one or more monomers of the non-reactive segment.