Method of manufacturing an integrated piece comprising a convex cured product and a substrate
View Patent ↗The present invention relates to a method of manufacturing an integrated piece comprising a convex cured product and a substrate, the method comprising a step of: depositing dropwise or dispensing a curable silicone composition onto the pre-heated substrate, the composition reaching a torque value of 1 dN·m within 60 seconds from immediately after beginning measurement as measured using a curelastometer according to JIS K 6300-2, at the temperature to which the substrate is heated, and having a viscosity at said temperature of at least 0.05 Pa·s. The method allows for the efficient manufacture of a hemispherical, hemicylindrical, dome-shaped, or similar convex cured product upon a substrate using a curable silicone composition.
1. A method of manufacturing an integrated piece comprising a convex cured product and a substrate, the method comprising depositing dropwise or dispensing a curable silicone composition onto the substrate that is pre-heated, the composition reaching a torque value of 1 dN·m within 60 seconds from immediately after beginning measurement using a curelastometer according to JIS K 6300-2, at a temperature to which the substrate is pre-heated, and having a viscosity at the temperature of at least 0.05 Pa·s.
2. The method according to claim 1 , wherein the temperature is at least 50° C.
3. The method according to claim 2 , wherein the ratio of the viscosity of the curable silicone composition at the temperature to which the substrate is pre-heated to the viscosity of the curable silicone composition at 25° C. is at least 0.01.
4. The method according to claim 2 , wherein the substrate is a semiconductor device or a substrate for a semiconductor device.
5. The method according to claim 4 , wherein the semiconductor device is an optical semiconductor device.
6. The method according to claim 1 , wherein the ratio of the viscosity of the curable silicone composition at the temperature to which the substrate is pre-heated to the viscosity of the curable silicone composition at 25° C. is at least 0.01.
7. The method according to claim 6 , wherein the substrate is a semiconductor device or a substrate for a semiconductor device.
8. The method according to claim 7 , wherein the semiconductor device is an optical semiconductor device.
9. The method according to claim 1 , wherein the substrate is a semiconductor device or a substrate for a semiconductor device.
10. The method according to claim 9 , wherein the semiconductor device is an optical semiconductor device.
11. The method according to claim 1 , wherein the viscosity at 25° C. of the curable silicone composition is at least 2.0 Pa·s.
12. The method according to claim 1 , wherein the refractive index at 25° C. of the curable silicone composition is less than 1.50.
13. The method according to claim 1 , wherein the curable silicone composition is hydrosilylation reaction-curable.
14. The method according to claim 1 , wherein the integrated piece further comprises a semiconductor element and the convex cured product seals the semiconductor element upon the substrate.
15. The method according to claim 14 , wherein the semiconductor element is an optical semiconductor element.
16. The method according to claim 15 , wherein the optical semiconductor element is an LED.
17. An optical device comprising the integrated piece obtained according to the method claim 1 .