Heat conductor device and method of forming a heat conductor device
The invention provides a heat conductor device ( 10 ) for removing heat from an electrical component ( 12 ) operating in a frequency range, the device comprising a body ( 13 ) having a first thermal conductivity, characterized in that the body ( 13 ) is provided with a heat spreader ( 14 ) comprising a pattern of thermally conducting tiles ( 20, 50, 51, 52, 61 ) separated by gaps ( 21 ), the tiles having a second thermal conductivity higher than the first thermal conductivity, wherein each tile has at most a maximum area value and the gaps have at least a minimum gap width, and the maximum area and the minimum width are dimensioned for conforming to a predetermined electromagnetic interference characteristic of the heat conductor device when combined with the electrical component operating in the frequency range. The invention also provides a method for forming a heat conductor device.
1. Heat conductor device for removing heat from an electrical component, the electrical component operating in a frequency range, the heat conductor device comprising:
a body having a first thermal conductivity, the body is provided with a heat spreader comprising a pattern of thermally conducting tiles separated by gaps, the tiles having a second thermal conductivity higher than the first thermal conductivity, wherein each tile has dimensions (a,b) small enough to not act as an antenna in the frequency range, and the size of the gaps (g) is small enough to maintain the thermal conductivity and large enough to maintain electrical isolation between the tiles in the frequency range,
wherein each tile has the dimensions (a,b) that are at most 10% of an electromagnetic wavelength corresponding to the frequency range.
2. Heat conductor device according to claim 1 , wherein each tile has the dimensions (a,b) that are at most 5% of an electromagnetic wavelength corresponding to the frequency range.
3. Heat conductor device according to claim 1 , wherein each tile has the dimensions (a,b) that are at most 1% of an electromagnetic wavelength corresponding to the frequency range.
4. Heat conductor device for removing heat from an electrical component, the electrical component operating in a frequency range, the heat conductor device comprising:
a body having a first thermal conductivity, the body is provided with a heat spreader comprising a pattern of thermally conducting tiles separated by gaps, the tiles having a second thermal conductivity higher than the first thermal conductivity, wherein each tile has dimensions (a,b) small enough to not act as an antenna in the frequency range, and the size of the gaps (g) is small enough to maintain the thermal conductivity and large enough to maintain electrical isolation between the tiles in the frequency range,
wherein the size (g) of each gap is at least 0.1% of an electromagnetic wavelength corresponding to the frequency range.
5. Heat conductor device according to claim 4 , wherein the size (g) of each gap is at least 0.5% of an electromagnetic wavelength corresponding to the frequency range.
6. Heat conductor device according to claim 4 , wherein the size (g) of each gap is at least 1% of an electromagnetic wavelength corresponding to the frequency range.
7. Heat conductor device according to claim 1 , in which the pattern is a regular grid.
8. Heat conductor device for removing heat from an electrical component, the electrical component operating in a frequency range, the heat conductor device comprising:
a body having a first thermal conductivity, the body is provided with a heat spreader comprising a pattern of thermally conducting tiles separated by gaps, the tiles having a second thermal conductivity higher than the first thermal conductivity, wherein each tile has dimensions (a,b) small enough to not act as an antenna in the frequency range, and the size of the gaps (g) is small enough to maintain the thermal conductivity and large enough to maintain electrical isolation between the tiles in the frequency range,
wherein the dimensions (a,b) of each tile are between 0.5 mm and 5 mm and each gap (g) is between 0.1 mm and 1.2 mm.
9. Heat conductor device according to claim 1 , in which the first heat conductivity is at most 50 W/mK and the second heat conductivity is at least 50 W/mK.
10. Heat conductor device according to claim 1 , in which the tiles are made of graphite.
11. Heat conductor device according to claim 1 , in which the body comprises a polymer or ceramic.
12. Film for adhering to a body of a heat conductor device, the film comprising thermally conducting tiles separated by gaps so as to form islands of heat spreader material.
13. A combination of the heat conductor device according to claim 1 , with an electrical component, in thermal contact with each other.
14. The combination according to claim 13 , wherein the heat spreader is adjacent to the electrical component.