IP Library Granted Patent US 9,829,390
Granted Patent B2
US 9,829,390 · App. 14/438,064 · Granted Nov 28, 2017

High-temperature chip with high stability

Inventors: Karlheinz Wienand (Aschaffenburg, DE); Matsvei Zinkevich (Goldbach, DE); Margit Sander (Karlstein, DE)
Assignee: Heraeus Sensor Technology GmbH
G01K7/18F02D41/1446G01K1/08G01K13/02G01K2013/024G01K2205/04
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Quick Facts
Patent No.
US 9,829,390
App. No.
14/438,064
Granted
Nov 28, 2017
Kind
B2
Abstract

The invention relates to temperature sensors, in particular high-temperature sensors, having an optionally coated substrate, at least one resistor structure, and at least two connection contacts. The connection contacts electrically contact the resistor structure, and the substrate is made of zirconium oxide or a zirconium oxide ceramic stabilized with oxides of a trivalent metal and a pentavalent metal. The substrate is coated with an insulation layer and the resistor structure and the free regions of the insulation layer, on which no resistor structure is disposed, are at least partially coated with a ceramic intermediate layer. A protective layer and/or a cover is disposed on the ceramic intermediate layer. At least one electrode may be disposed, at least at one connection contact, alongside the resistor structure on the substrate. The invention also relates an exhaust-gas system for controlling and/or regulating an engine, particularly a motor vehicle engine, containing these temperature sensors.

Claims (20)

1. A temperature sensor comprising a coated substrate, at least one resistor structure, and at least two connection contacts, wherein the connection contacts directly electrically contact the resistor structure, the substrate comprises zirconium oxide or a zirconium oxide ceramic stabilized with oxides of a trivalent metal and a pentavalent metal, the substrate is coated with an insulation layer, and the resistor structure and free regions of the insulation layer on which no resistor structure is disposed are at least partially coated with a ceramic intermediate layer, and wherein at least one of a protective layer and a cover is disposed on the ceramic intermediate layer, wherein at least one electrode frames at least one side of the resistor structure.

2. The temperature sensor according to claim 1 , wherein the resistor structure is completely coated with the ceramic intermediate layer and at least the regions of the insulation layer adjacent to the resistor structure are covered with the ceramic intermediate layer.

3. The temperature sensor according to claim 1 , wherein the resistor structure comprises meanders, and wherein the ceramic intermediate layer covers the free regions of the insulation layer between the meanders.

4. The temperature sensor according to claim 1 , wherein the zirconium oxide or the zirconium oxide in the zirconium oxide ceramic is stabilized with 5 to 20 mol % of oxides of the trivalent metal and the pentavalent metal.

5. The temperature sensor according to claim 1 , wherein the at least one electrode is disposed at least at one connection contact alongside the resistor structure on the insulation layer, and wherein the at least one electrode is formed integrally with the resistor structure.

6. The temperature sensor according to claim 1 , wherein the insulation layer is a metal oxide layer.

7. The temperature sensor according to claim 1 , wherein the at least one electrode is disposed at least at one connection contact alongside the resistor structure on the substrate, wherein the at least one electrode is formed integrally with the resistor structure.

8. The temperature sensor according to claim 1 , wherein at least two sides of the resistor structure are framed by at least two electrodes or at least two opposing sides of the resistor structure are framed by two electrodes.

9. The temperature sensor according to claim 1 , wherein the ceramic intermediate layer has a porosity of 1% to 20%.

10. The temperature sensor according to claim 1 , wherein the ceramic intermediate layer has a thickness between 1 μm and 50 μm.

11. The temperature sensor according to claim 1 , wherein the protective layer comprises glass and/or the cover is a ceramic chip.

12. The temperature sensor according to claim 1 , wherein the resistor structure comprises platinum or a platinum alloy.

13. An exhaust-gas system for controlling and/or regulating an engine comprising the temperature sensor according to claim 1 .

14. A temperature sensor having a substrate, at least one resistor structure, and at least two connection contacts, wherein the connection contacts directly electrically contact the resistor structure and at least one electrode is disposed at least at one connection contact alongside the resistor structure on the substrate, wherein the at least one electrode is formed integrally with the resistor structure, and the resistor structure and free regions of the substrate, on which the resistor structure is not disposed, are at least partially coated with a ceramic intermediate layer, and wherein at least one of a protective layer and a cover is disposed on the ceramic intermediate layer, wherein the at least one electrode frames the resistor structure at least in certain regions.

15. The temperature sensor according to claim 14 , wherein at least two sides of the resistor structure are framed by at least two electrodes or at least two opposing sides of the resistor structure are framed by two electrodes.

16. The temperature sensor according to claim 14 , wherein the ceramic intermediate layer has a porosity of 1% to 20%.

17. The temperature sensor according to claim 14 , wherein the ceramic intermediate layer has a thickness between 1 μm and 50 μm.

18. The temperature sensor according to claim 14 , wherein the protective layer comprises glass and/or the cover is a ceramic chip.

19. The temperature sensor according to claim 14 , wherein the resistor structure comprises platinum or a platinum alloy.

20. An exhaust-gas system for controlling and/or regulating an engine comprising the temperature sensor according to claim 14 .

Assignments (2)
CHANGE OF NAME Recorded Apr 29, 2019
From: HERAEUS SENSOR TECHNOLOGY GMBH
To: HERAEUS NEXENSOS GMBH
Reel/Frame 049020/0658 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2015
From: WIENAND, KARLHEINZ; ZINKEVICH, MATSVEI; SANDER, MARGIT
To: HERAEUS SENSOR TECHNOLOGY GMBH
Reel/Frame 035486/0100 →
Priority Claims (1)
DE 10 2012 110 210 · Oct 25, 2012 · national
Continuity (1)
Related Publication 20150292955A1 · Oct 15, 2015