Curable silicone composition, cured product thereof, and optical semiconductor
View Patent ↗The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and represented by the average unit formula; (B) a straight chain organopolysiloxane having at least two alkenyl groups in a molecule and having no silicon-bonded hydrogen atoms; (C) an organosiloxane i) represented by the general formula, an organopolysiloxane (C 2 ) having at least two silicon-bonded hydrogen atoms in a molecule and represented by the average unit formula, or a mixture of components (C 1 ) and (C 2 ); and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having a high refractive index and a low gas permeability.
1. A curable silicone composition comprising:
(A) an organopolysiloxane having at least two alkenyl groups in a molecule and represented by the following average unit formula:
(R 1 R 2 2 SiO 1/2 ) a (R 3 2 SiO 2/2 ) b (R 4 SiO 3/2 ) c
wherein, R 1 is an alkenyl group having from 2 to 12 carbons; each R 2 is the same or different, and are each an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, or an aralkyl group having from 7 to 20 carbons; each R 3 is the same or different, and are each an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, or a phenyl group; R 4 is an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons; and a, b, and c are numbers that satisfy the following conditions: 0.01≦a≦0.5, 0≦b≦0.7, 0.1≦c<0.9, and a+b+c=1;
(B) a straight chain organopolysiloxane having at least two alkenyl groups in a molecule and having no silicon-bonded hydrogen atoms, in an amount of 0 to 70% by mass of this composition;
(C) an organosiloxane (C 1 ) represented by the following general formula:
HR 5 R 6 SiO(R 7 2 SiO) n SiR 5 R 6 H
wherein, each R 5 is the same or different, and are each an alkyl group having from 1 to 12 carbons; each R 6 is the same or different, and are each an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons; each R 7 is the same or different, and are each an alkyl group having from 1 to 12 carbons or a phenyl group; and n is a number from 0 to 100,
an organopolysiloxane (C 2 ) having at least two silicon-bonded hydrogen atoms in a molecule and represented by the following average unit formula:
(HR 5 R 6 SiO 1/2 ) d (HR 5 2 SiO 1/2 ) e (R 7 2 SiO 2/2 ) f (R 6 SiO 3/2 ) g
wherein, R 5 , R 6 , and R 7 are as defined above; and d, e, f, and g are numbers that satisfy the following conditions: 0.01≦d≦0.7, 0≦e≦0.5, 0≦f≦0.7, 0.1≦g<0.9, and d+e+f+g=1, or
a mixture of components (C 1 ) and (C 2 ), in an amount such that the number of silicon-bonded hydrogen atoms in this component is from 0.1 to 5 moles per 1 mol of total alkenyl groups in components (A) and (B); and
(D) an effective quantity of a hydrosilylation reaction catalyst.
2. The curable silicone composition according to claim 1 , wherein R 4 in component (A) is a phenyl group or a naphthyl group.
3. The curable silicone composition according to claim 1 , wherein R 6 in component (C) is a phenyl group or a naphthyl group.
4. The curable silicone composition according to claim 1 , wherein in the mixture of components (C 1 ) and (C 2 ), a mass ratio of component (C 1 ) to component (C 2 ) is from 0.5:9.5 to 9.5:0.5.
5. The curable silicone composition according to claim 1 , wherein n in component (C 1 ) is a number from 1 to 10 and at least one R 7 in a molecule is a phenyl group.
6. The curable silicone composition according to claim 1 , further comprising (E) an adhesion-imparting agent, being comprised at a quantity of 0.01 to 10 parts by mass per 100 parts total mass of components (A) to (D).
7. A cured product obtained by curing the curable silicone composition of claim 1 .
8. An optical semiconductor device comprising an optical semiconductor element sealed by a cured product of the curable silicone composition of claim 1 .
9. The curable silicone composition according to claim 2 , further comprising (E) an adhesion-imparting agent, being comprised at a quantity of 0.01 to 10 parts by mass per 100 parts total mass of components (A) to (D).
10. The curable silicone composition according to claim 3 , further comprising (E) an adhesion-imparting agent, being comprised at a quantity of 0.01 to 10 parts by mass per 100 parts total mass of components (A) to (D).
11. The curable silicone composition according to claim 4 , further comprising (E) an adhesion-imparting agent, being comprised at a quantity of 0.01 to 10 parts by mass per 100 parts total mass of components (A) to (D).
12. The curable silicone composition according to claim 5 , further comprising (E) an adhesion-imparting agent, being comprised at a quantity of 0.01 to 10 parts by mass per 100 parts total mass of components (A) to (D).
13. The curable silicone composition according to claim 1 , wherein each of R 4 in component (A) and each R 6 in component (C) is independently a phenyl group or a naphthyl group.
14. The curable silicone composition according to claim 1 , wherein R 1 in component (A) is a vinyl group, wherein each R 2 in component (A) is a vinyl group, wherein each R 3 in component (A) is a methyl group, wherein R 4 in component (A) is a phenyl group or a naphthyl group, wherein each R 5 in component (C) is a methyl group, wherein each R 6 in component (C) is a phenyl group or a naphthyl group, and wherein each R 7 in component (C) is a methyl group.
15. A cured product obtained by curing the curable silicone composition of claim 2 .
16. An optical semiconductor device comprising an optical semiconductor element sealed by a cured product of the curable silicone composition of claim 2 .