Ultrasonic probe
View Patent ↗A body-cavity-insertion-type probe wherein an electronic circuit board is provided via a relay board on a back surface side of an oscillator unit. A backing member is joined to a center region of a back surface of the electronic circuit board. A wiring sheet is joined to a peripheral region of the back surface. A rear wing and a front wing of the wiring sheet surround a backing case, and a right wing and a left wing of an exhaust heat sheet protrude outward via two slits formed in a heat dissipation shell and are fixed on an outer surface of the heat dissipation shell. Heat generated by the electronic circuit board is transmitted to the heat dissipation shell via the exhaust heat sheet or the backing case, and heat is dissipated by the heat dissipation shell as a whole.
1. An ultrasonic probe, comprising:
an array transducer having a plurality of transducer elements which are arranged two-dimensionally;
an electronic circuit board provided on a side of a back surface of the array transducer and having an electronic circuit which is electrically connected to the plurality of transducer elements; and
a heat dissipation member which is a heat conductive member joined to a heat conductive region on a back surface of the electronic circuit board and which discharges heat from the back surface side of the electronic circuit board to a heat discharge structure, and wherein:
the heat conductive region and an ultrasound propagation region are set on the back surface of the electronic circuit board,
the ultrasonic probe further comprises a backing member joined to the ultrasound propagation region,
the ultrasound propagation region is a center region of the electronic circuit board,
the heat conductive region is an entirety of or a part of a peripheral region of the electronic circuit board surrounding the center region,
the heat dissipation member is a sheet-shaped member having an opening corresponding to the ultrasound propagation region,
the backing member is a block-shaped member having a protrusion joined to the ultrasound propagation region through the opening, and
the heat dissipation member is sandwiched between the electronic circuit board and the backing member.
2. The ultrasonic probe according to claim 1 , wherein
the heat dissipation member comprises a plurality of wings extending from the heat conductive region and having flexibility, and
at least one wing of the plurality of wings is joined to the heat discharge structure.
3. The ultrasonic probe according to claim 2 , wherein
at least one slit is formed on the heat discharge structure, and
the at lest one wing is inserted to the at least one slit, and an inserted portion of the at least one slit is folded and joined to an outer surface of the heat discharge structure.
4. The ultrasonic probe according to claim 2 , further comprising:
a backing case that houses the backing member and that is formed by a heat conductive member, wherein
at least one wing of the plurality of wings is folded and joined to the backing case, and
the backing case is joined to the heat discharge structure.
5. The ultrasonic probe according to claim 1 , wherein
the heat dissipation member is a block-shaped member having an opening corresponding to the ultrasound propagation region, and
the backing member is housed in the opening.
6. The ultrasonic probe according to claim 1 , wherein
the heat discharge structure is a heat conductive container that houses an inner assembly including the array transducer and the electronic circuit board.
7. The ultrasonic probe according to claim 6 , wherein
the heat conductive container is a probe head case that defines an outer shape of a probe head.
8. The ultrasonic probe according to claim 1 , wherein
the electronic circuit board is a semiconductor material board on a surface of which the electronic circuit is formed.