Granted Patent B2

US 9,324,926 · App. 14/439,368 · Granted Apr 26, 2016

Abstract

Claims (25)

1. A method comprising:

providing a plurality of LEDs attached to a mount;

forming a wavelength converting layer over the LEDs and the mount;

forming a protective layer over the wavelength converting layer;

removing a portion of the wavelength converting layer and the protective layer; and

after said removing the wavelength converting layer and the protective layer, forming a reflective layer in the region where a portion of the wavelength converting layer and the protective layer were removed

wherein the reflective material is in direct contact with a side surface of an LED.

2. The method of claim 1 wherein removing a portion of the wavelength converting layer and the protective layer comprise removing a portion of the wavelength converting layer and the protective layer from regions between the LEDs.

3. The method of claim 1 wherein the mount comprises metal pads disposed on the mount adjacent to the LEDs and removing a portion of the wavelength converting layer and the protective layer comprise removing a portion of the wavelength converting layer and the protective layer from regions over the metal pads.

4. The method of claim 1 wherein forming a wavelength converting layer comprises laminating a film of wavelength converting material disposed in a transparent material over the plurality of LEDs and the mount.

5. The method of claim 1 wherein forming a protective layer over the wavelength converting layer comprises laminating a silicone layer over the wavelength converting layer.

6. The method of claim 1 wherein removing the wavelength converting layer and the protective layer comprises sawing the wavelength converting layer and the protective layer.

7. The method of claim 6 wherein sawing terminates on the mount.

8. The method of claim 6 wherein sawing terminates on a metal pad disposed on the mount.

9. The method of claim 6 wherein sawing terminates within the wavelength converting layer.

10. The method of claim 1 wherein forming a reflective layer comprises forming a reflective layer over the protective layer formed over the LEDs, the method further comprising thinning the reflective layer to expose a top surface of the protective layer.

11. The method of claim 1 further comprising planarizing a top surface, the top surface comprising a top surface of the protective layer in regions where the LEDs are located and a top surface of the reflective layer in regions between the LEDs.

12. A method comprising:

providing a plurality of semiconductor light emitting devices attached to a mount;

forming a wavelength converting layer over the semiconductor light emitting devices and the mount, the wavelength converting layer comprising a wavelength converting material disposed in a transparent material;

forming a transparent layer over the wavelength converting layer;

sawing away a portion of the wavelength converting layer and the transparent layer;

forming a reflective layer over the transparent layer and in a region where the portion of the wavelength converting layer and the transparent layer are sawn away; and

removing a portion of the reflective layer to form a planar surface

wherein the reflective material is in direct contact with a side surface of an LED.

Assignments (6)