IP Library Granted Patent US 9,882,109
Granted Patent B2
US 9,882,109 · App. 14/440,842 · Granted Jan 30, 2018

Bi-polar organic semiconductors for thermoelectric power generation

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Quick Facts
Patent No.
US 9,882,109
App. No.
14/440,842
Granted
Jan 30, 2018
Kind
B2
Abstract

Disclosed are bi-polar semiconductor composites that include at least one organic p-type semiconductor; and at least one organic n-type semiconductor, and methods of making and using them. In particular, collagen based semiconductors may be used. The composite may be used to generate electricity from heat loss via industrial processes, such as heat lost via pipes, heat sinks, and so on.

Claims (41)

1. A method to prepare an organic bipolar semiconductor, the method comprising:

providing a thin film organic n-type semiconductor material;

providing a thin film organic p-type semiconductor material,

wherein the thin film organic p-type semiconductor material comprises a first base organic material selected from at least one of collagen, chitosan, gelatin, cellulose, sodium alginate, and combinations thereof, and wherein the first base organic material is doped with at least one of Na, F, Cl, Br, I, Bi, a hyperhalogen, and combinations thereof; and

joining the thin film organic n-type semiconductor material to the thin film organic p-type semiconductor material, wherein the providing the thin film organic n-type semiconductor material includes:

preparing the thin film organic n-type semiconductor material by:

contacting a second base organic material with an acidic solution to yield a colloidal solution;

adding a donor solution comprising a multivalent transition metal to the colloidal solution to yield the organic n-type semiconductor material; and

forming the organic n-type semiconductor material into a thin film.

2. The method of claim 1 , wherein the adding the donor solution comprising the multivalent transition metal includes:

adding a donor solution that comprises a multivalent transition metal, which is selected from a group consisting of Cd, Cu, Mg, W, Ti, Mo, P, Te, Fe, and combinations thereof, to the colloidal solution to yield the n-type organic semiconductor material.

3. An organic bipolar semiconductor prepared according to the method of claim 1 .

4. A method to prepare an organic bipolar semiconductor, the method comprising:

providing a thin film organic n-type semiconductor material,

wherein the providing the thin film organic n-type semiconductor material includes preparing the thin film organic n-type semiconductor material by:

contacting collagen with an acidic solution to yield a colloidal solution;

adding a donor solution comprising Cd to the colloidal solution to yield the organic n-type semiconductor material; and

forming the organic n-type semiconductor material into a thin film;

providing a thin film organic p-type semiconductor material,

wherein the organic p-type semiconductor material comprises a first base organic material selected from a group consisting of collagen, chitosan, gelatin, cellulose, conductive polymers, sodium alginate, and combinations thereof, and wherein the first base organic material is doped with at least one of Na, F, Cl, Br, I, Bi, a hyperhalogen, and combinations thereof; and

joining the thin film organic n-type semiconductor material to the thin film organic p-type semiconductor material.

5. An organic bipolar semiconductor prepared according to the method of claim 4 .

6. A method to prepare an organic bipolar semiconductor, the method comprising:

providing a thin film organic n-type semiconductor material;

providing a thin film organic p-type semiconductor material,

wherein the thin film organic p-type semiconductor material comprises a first base organic material selected from at least one of collagen, chitosan, gelatin, cellulose, sodium alginate, and combinations thereof, and wherein the first base organic material is doped with at least one of Na, F, Cl, Br, I, Bi, a hyperhalogen, and combinations thereof; and

joining the thin film organic n-type semiconductor material to the thin film organic p-type semiconductor material, wherein the providing the thin film organic p-type semiconductor material includes:

preparing the thin film organic p-type semiconductor material by:

contacting the first base organic material with an acidic solution to yield a colloidal solution;

adding an acceptor solution, which comprises at least one of Na, F, Cl, Br, I, Bi, a hyperhalogen, and a combination thereof, to the colloidal solution to yield the organic p-type semiconductor material; and

forming the organic p-type semiconductor material into a thin film.

7. The method of claim 6 , wherein the joining comprises:

wetting a surface of one of the thin film organic n-type semiconductor material or the thin film organic p-type semiconductor material; and

contacting the wetted surface with a surface of another of the organic n-type semiconductor material or the thin film organic p-type semiconductor material to form the organic bipolar semiconductor.

8. A method to prepare an organic bipolar semiconductor, the method comprising:

providing a thin film organic n-type semiconductor material;

providing a thin film organic p-type semiconductor material,

wherein the thin film organic p-type semiconductor material comprises a first base organic material selected from at least one of collagen, chitosan, gelatin, cellulose, sodium alginate, and combinations thereof, and wherein the first base organic material is doped with at least one of Na, F, Cl, Br, I, Bi, a hyperhalogen, and combinations thereof;

drying either or both of the organic n-type semiconductor material or the organic p-type semiconductor material; and

joining the thin film organic n-type semiconductor material to the thin film organic p-type semiconductor material, wherein the drying is performed prior to the joining, and wherein the drying comprises drying either or both of the organic n-type semiconductor material or the organic p-type semiconductor material by lyophilization.

9. An organic bipolar semiconductor prepared according to the method of claim 8 .

Assignments (2)
SECURITY INTEREST Recorded Jan 29, 2019
From: EMPIRE TECHNOLOGY DEVELOPMENT LLC
To: CRESTLINE DIRECT FINANCE, L.P.
Reel/Frame 048373/0217 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2015
From: THEVASAHAYAM, AROCKIADOSS
To: EMPIRE TECHNOLOGY DEVELOPMENT LLC
Reel/Frame 035659/0576 →