Amplifier circuits
View Patent ↗Differential amplifier circuits for LDMOS-based amplifiers are disclosed. The differential amplifier circuits comprise a high resistivity substrate and separate DC and AC ground connections. Such amplifier circuits may not require thru-substrate vias for ground connection.
1. A differential amplifier circuit for an LDMOS-based amplifier, the circuit comprising a high resistivity substrate and separate DC and AC ground connections that do not require thru-substrate vias.
2. The circuit of claim 1 , wherein the AC ground connection comprises a virtual ground connection.
3. The circuit of claim 2 , wherein the circuit comprises first and second transistors, the source of the first transistor being electrically connected to the source of the second transistor by a source-to-source connection, and wherein the virtual ground connection is provided by the source-to-source connection.
4. The circuit of claim 3 , wherein the source-to-source connection is formed from an intermediate layer of metal.
5. The circuit of claim 1 , wherein the DC ground connection comprises a plurality of wire bond connections or a microstrip connection.
6. The circuit of claim 1 , wherein the high resistivity substrate comprises silicon.
7. The circuit of claim 1 , wherein the high resistivity substrate has a resistivity greater than 50 Ω*cm.
8. The circuit of claim 7 , wherein the high resistivity substrate has a resistivity greater than 100 Ω*cm.
9. The circuit of claim 7 , wherein the high resistivity substrate has a resistivity greater than or equal to 1 KΩ*cm.
10. An LDMOS amplifier circuit comprising a differential amplifier circuit according to claim 1 .
11. A packaged high-power radio frequency, RF, amplifier circuit comprising:
an amplifier circuit according to claim 1 .
12. An integrated circuit comprising an amplifier circuit according to claim 1 .
13. A mobile base station comprising an amplifier circuit according to claim 1 .