IP Library Granted Patent US 9,444,421
Granted Patent B2
US 9,444,421 · App. 14/444,736 · Granted Sep 13, 2016

Combiner circuit for a class-E outphasing power amplifier

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,444,421
App. No.
14/444,736
Granted
Sep 13, 2016
Kind
B2
Abstract

Lumped-element based class-E Chireix combiners are disclosed that are equivalents of a quarter-wave transmission line combiner. The proposed class-E equivalent power amplifier circuits that are used can be derived from a parallel tuned class-E implementation. The proposed low-pass equivalents can behave similarly in terms of class-E performance, but absorb the 90 degree transmission line.

Claims (33)

1. A combiner circuit for a class-E outphasing power amplifier comprising first and second branch amplifiers, the combiner circuit comprising:

a first input node, for receiving an output signal of the first branch amplifier;

a second input node, for receiving an output signal of the second branch amplifier;

an output node, for supplying a combined output signal to a load;

a first inductor connected in series at the first input node, the first inductor having an input terminal connected to the first input node and an output terminal;

a second inductor connected in series at the second input node, the second inductor having an input terminal connected to the second input node and an output terminal;

a compensation inductor connected in series with the first inductor and directly connected to the output node;

a compensation capacitor connected in series with the second inductor and directly connected to the output node;

a first capacitor, with a first terminal connected to the output terminal of the first inductor and a second terminal connected to ground; and

a second capacitor, with a first terminal connected the output terminal of the second inductor and a second terminal connected to ground;

wherein the second capacitor and the compensation capacitor are implemented as Metal-Insulator-Metal capacitors together on a single die, and wherein each of the capacitors and/or inductors is implemented as a lumped element component.

2. The combiner circuit of claim 1 , wherein:

the compensation inductor is directly connected to the output terminal of the first inductor; and

the compensation capacitor is directly connected to the output terminal of the second inductor.

3. The combiner circuit of claim 1 , further comprising a connection at the output terminal of the second inductor for connecting a DC-bias supply.

4. The combiner circuit of claim 1 , further comprising a matching circuit between the output node and the load.

5. A class-E outphasing power amplifier module, comprising:

the combiner circuit of claim 1 in combination with the first and second branch amplifiers of claim 1 , wherein the combiner circuit is arranged to combine the output signals of the first and second branch amplifiers.

6. A combiner circuit for a class-E outphasing power amplifier comprising first and second branch amplifiers, the combiner circuit comprising:

a first input node, for receiving an output signal of the first branch amplifier;

a second input node, for receiving an output signal of the second branch amplifier;

an output node, for supplying a combined output signal to a load;

a first inductor connected in series at the first input node, the first inductor having an input terminal connected to the first input node and an output terminal;

a second inductor connected in series at the second input node, the second inductor having an input terminal connected to the second input node and an output terminal;

a compensation inductor connected in shunt between the second input node and ground;

a further compensation inductor connected in series with the first inductor and directly connected to the output node;

a second capacitor, with a first terminal connected to the output terminal of the first inductor and a second terminal connected to ground; and

wherein the further compensation inductor is directly connected to the output terminal of the first inductor, and wherein each of the capacitors and/or inductors is implemented as a lumped element component.

7. The combiner circuit of claim 6 , further comprising a first capacitor connected in shunt between the output node and ground.

8. The combiner circuit of claim 6 , further comprising a compensation capacitor connected in shunt between the first input node and ground.

9. The combiner circuit of claim 6 , wherein:

one or more of the capacitors are implemented as Metal-Oxide-Semiconductor capacitors; and/or

one or more of the inductors are implemented as bond wires.

Assignments (13)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
CHANGE OF NAME Recorded Feb 22, 2016
From: SAMBA HOLDCO NETHERLANDS B.V.
To: AMPLEON NETHERLANDS B.V.
Reel/Frame 037876/0873 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2015
From: NXP B.V.
To: SAMBA HOLDCO NETHERLANDS B.V.
Reel/Frame 036630/0574 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2014
From: VAN DER HEIJDEN, MARK PIETER
To: NXP, B.V.
Reel/Frame 033404/0707 →