IP Library Granted Patent US 9,030,872
Granted Patent B2
US 9,030,872 · App. 14/448,757 · Granted May 12, 2015

Method of maintaining the state of semiconductor memory having electrically floating body transistor

Inventors: Yuniarto Widjaja (San Jose, CA); Zvi Or-Bach (San Jose, CA)
Assignee: Zeno Semiconductor, Inc.
G11C7/00G11C11/404G11C11/565G11C14/0018G11C16/0416G11C2211/4016H01L27/108H01L27/10802H01L29/66825H01L29/66833H01L29/7841H01L29/7881G11C11/4094
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Quick Facts
Patent No.
US 9,030,872
App. No.
14/448,757
Granted
May 12, 2015
Kind
B2
Abstract

Methods of maintaining a state of a memory cell without interrupting access to the memory cell are provided, including applying a back bias to the cell to offset charge leakage out of a floating body of the cell, wherein a charge level of the floating body indicates a state of the memory cell; and accessing the cell.

Claims (37)

1. An integrated circuit comprising:

an array of memory cells formed in a semiconductor having at least one surface, the array comprising:

a plurality of memory cells arranged in a plurality of rows and a plurality of columns, each said memory cell comprising:

a floating body region;

a first region in electrical contact with said floating body region;

a second region in electrical contact with said floating body region and spaced apart from said first region;

a gate positioned between said first and second regions; and

a back-bias region;

wherein applying a voltage to said back-bias region results in at least two stable floating body charge levels; and

a control circuit configured to provide electrical signals to at least one of said back bias region and said first or second regions.

2. The integrated circuit of claim 1 , wherein said electrical signals have an amplitude or polarity dependent on an operation of said array of memory cells.

3. The integrated circuit of claim 1 , wherein said control circuit is configured to provide electrical signals to one of said first or second regions.

4. The integrated circuit of claim 1 , wherein said control circuit is configured to provide electrical signals to said back bias region.

5. The integrated circuit of claim 1 , wherein said control circuit comprises a first control circuit configured to provide electrical signals to one of said first or second regions, said integrated circuit further comprising a second control circuit configured to provide electrical signals to said back bias region.

6. The integrated circuit of claim 4 wherein said control circuit comprises a voltage generator circuit.

7. The integrated circuit of claim 6 , further comprising a multiplexer electrically connected between said voltage generator circuit and said back bias region, said multiplexer configured to apply periodic pulses of positive voltage to said back bias region.

8. The integrated circuit of claim 1 , wherein said control circuit comprises a reference generator circuit configured to sense potential of said floating body region.

9. The integrated circuit of claim 1 , wherein said control circuit comprises a read circuit connected to one of said first or second region and configured to read a state of said memory cell.

10. The integrated circuit of claim 9 , further comprising a reference generator circuit connected to said read circuit.

11. An integrated circuit comprising:

an array of memory cells formed in a semiconductor having at least one surface, the array comprising:

a plurality of said memory cells arranged in a plurality of rows and a plurality of columns, each said memory cell comprising:

a floating body region;

a first region in electrical contact with said floating body region;

a second region in electrical contact with said floating body region and spaced apart from said first region;

a gate positioned between said first and second regions; and

a back bias region, wherein said back-bias region is commonly connected to at least two of said memory cells and configured to inject charge into or extract charge out of said floating body region of each of said memory cells connected thereto, to maintain states of said at least two of said memory cells in parallel; and

a control circuit configured to provide electrical signals to at least one of said back bias region and said first or second regions.

12. The integrated circuit of claim 11 , wherein said electrical signals have an amplitude or polarity dependent on an operation of said array of memory cells.

13. The integrated circuit of claim 11 , wherein said control circuit is configured to provide electrical signals to one of said first or second regions.

14. The integrated circuit of claim 11 , wherein said control circuit is configured to provide electrical signals to said back bias region.

15. The integrated circuit of claim 11 , wherein said control circuit comprises a first control circuit configured to provide electrical signals to one of said first or second regions, said integrated circuit further comprising a second control circuit configured to provide electrical signals to said back bias region.

16. The integrated circuit of claim 14 , wherein said control circuit comprises a voltage generator circuit.

17. The integrated circuit of claim 16 , further comprising a multiplexer electrically connected between said voltage generator circuit and said back bias region, said multiplexer configured to apply periodic pulses of positive voltage to said back bias region.

18. The integrated circuit of claim 11 , wherein said control circuit comprises a reference generator circuit configured to sense potential of said floating body region.

19. The integrated circuit of claim 11 , wherein said control circuit comprises a read circuit connected to one of said first or second region and configured to read a state of said memory cell.

20. The integrated circuit of claim 19 , further comprising a reference generator circuit connected to said read circuit.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2021
From: SILICON STORAGE TECHNOLOGY, INC.
To: ZENO SEMICONDUCTOR, INC.
Reel/Frame 056681/0744 →
DECLARATION SUPPORTING CORRECTION OF ERRONEOUSLY FILED REEL/FRAME NO. 037009/0792 Recorded May 10, 2018
From: ZENO SEMICONDUCTOR, INC.
To: ZENO SEMICONDUCTOR, INC.
Reel/Frame 047012/0922 →
INVENTION ASSIGNMENT AGREEMENT Recorded Oct 30, 2015
From: WIDJAJA, YUNIARTO
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 037009/0792 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 16, 2014
From: WIDJAJA, YUNIARTO; OR-BACH, ZVI
To: ZENO SEMICONDUCTOR, INC.
Reel/Frame 033963/0181 →
Continuity (12)
Continuation 13941475 · Jul 13, 2013
Continuation 13478014 · May 22, 2012
Continuation 13244855 · Sep 26, 2011
Continuation 12797334 · Jun 9, 2010
Continuation In Part 12552903 · Sep 2, 2009
Continuation In Part 11998311 · Nov 29, 2007
Continuation In Part 12533661 · Jul 31, 2009
Continuation In Part 12545623 · Aug 21, 2009
Provisional Application 61093726 · Sep 3, 2008
Provisional Application 61094540 · Sep 5, 2008
Provisional Application 61309589 · Mar 2, 2010
Related Publication 20140340972A1 · Nov 20, 2014