Backside through silicon vias and micro-channels in three dimensional integration
View Patent ↗Technologies are generally described related to electrical connectivity and heat mitigation in three dimensional integrated circuit (IC) integration through backside through silicon vias (TSVs) and micro-channels. In some examples, micro-channels may be formed in a wafer using a reactive ion etching (RIE) or similar fabrication process. Upon alignment and bonding of two wafers, selected micro-channels may be converted into TSVs by a further RIE or similar process and filled.
1. A three-dimensionally integrated semiconductor device comprising:
a first wafer that includes:
micro-channels distributed within a substrate of the first wafer based on an expected heat profile of semiconductor circuitry in the first wafer and a second wafer, and
one or more through silicon vias (TSVs) within the substrate and an insulating layer of the first wafer, wherein each of the micro-channels have a vertical depth with respect to a thickness of the first wafer in a range from about 1 μm to about 1 mm; and
the second wafer, wherein the one or more TSVs are configured to contact the second wafer and at least a portion of the one or more TSVs is configured to overlap with corresponding micro-channels.
2. The semiconductor device of claim 1 , wherein the first wafer and the second wafer are arranged such that the insulating layer of the first wafer is in contact with a substrate of the second wafer.
3. The semiconductor device of claim 1 , wherein the first wafer and the second wafer include one or more conductive connections within their respective insulating layers and a portion of the conductive connections are in proximity of a portion of the micro-channels.
4. The semiconductor device of claim 3 , wherein the conductive connections include a metal, and wherein the metal includes Aluminum, Nickel, Copper, Titanium, Molybdenum, Tantalum, of Tungsten.
5. The semiconductor device of claim 1 , wherein the distribution of the micro-channels is selected further based on a distribution of the conductive connections.
6. The semiconductor device of claim 1 , wherein the one or more TSVs are configured to provide electrical coupling between a first set of semiconductor circuitry of the first wafer and a second set of semiconductor circuitry of the second wafer.
7. The semiconductor device of claim 1 , further comprising:
a third wafer that includes micro-channels within a substrate of the third wafer and one or more TSVs of the third wafer located within the substrate and an insulating layer of the third wafer, wherein the one or more TSVs of the third wafer are configured to contact the second wafer and at least a portion of the one or more TSVs of the third wafer is configured to overlap with corresponding micro-channels.
8. The semiconductor device of claim 1 , wherein each of the one or more TSVs have one of the cylindrical shape, the elliptical shape, and the polygonal shape.
9. The semiconductor device of claim 1 , wherein the micro-channels each have a cross-sectional diameter in a range from about 1 nm to about 1000 μm.
10. The semiconductor device of claim 1 , wherein the one or more TSVs have a depth in a range from about 10 μm to about 10 mm.
11. The semiconductor device of claim 1 , wherein the one or more TSV's have a cross-sectional diameter in a range from about 10 nm to about 1000 μm.
12. A three-dimensionally integrated semiconductor device comprising:
a first wafer that includes:
micro-channels distributed within a substrate of the first wafer based on an expected heat profile of semiconductor circuitry in the first wafer and a second wafer, and
one or more through silicon vias (TSVs) within the substrate and an insulating layer of the first wafer, wherein each of the micro-channels have a vertical depth with respect to a thickness of the first wafer in a range from about 1 μm to about 1 mm; and
the second wafer, wherein
the one or more TSVs are configured to contact the second wafer and at least a portion of the one or more TSVs is configured to overlap with corresponding micro-channels, and
the first wafer and the second wafer are arranged such that the insulating layer of the first wafer is in contact with a substrate of the second wafer.
13. The semiconductor device of claim 12 , wherein the insulating layer includes one or more conductive connections effective to couple integrated circuits within the first wafer and the second wafer to one or more of external components, other devices, and test circuitry.
14. A three-dimensionally integrated semiconductor device comprising:
a first wafer that includes:
micro-channels distributed within a substrate of the first wafer based on an expected heat profile of semiconductor circuitry in the first wafer and a second wafer,
an insulating layer, and
one or more through silicon vias (TSVs) within the substrate and the insulating layer of the first wafer, wherein each of the micro-Channels have a vertical depth with respect to a thickness of the first wafer in a range from about 1 μm to about 1 mm; and
the second wafer, wherein
the one or more TSVs are configured to contact the second wafer and at least a portion of the one or more TSVs is configured to overlap with corresponding micro-channels,
the first wafer and the second wafer include one or more conductive connections within the insulating layer of the first wafer and the insulating layer of the second wafer, and
a portion of the one or more conductive connections are in proximity of a portion of the micro-channels.
15. The semiconductor device of claim 14 , wherein the micro-channels are formed as elongated channels that extend from a surface of the substrate of the first wafer into a body of the substrate of the first wafer in a substantially orthogonal direction with respect to a planar surface of the substrate of the first wafer.