WAFER CLAMP ASSEMBLY FOR HOLDING A WAFER DURING A DEPOSITION PROCESS

1 . A method fabricating dies on a wafer during a semiconductor process, said method comprising:

providing a plurality of substantially flat planar finger member mounted in an annular step defining a depression of a wafer clamp assembly;

providing an outer annular member, coupled to the plurality of finger members and the wafer clamp assembly, the outer annular member having

a) a first annular projection, and

b) a second annular projection;

contacting said wafer during the semiconductor fabrication process with the plurality of substantially flat finger members, wherein each of the finger members include:

a) a first portion with an essentially rectangular cross-section; and

b) a second portion, the second portion having a free end that includes a contact portion, the second portion having a rounded tip;

a central recess defined by the first annular projection,

wherein the central recess has a diameter that is greater than d, the diameter of the wafer, and

wherein the wafer can be clamped so that the wafer is not contacted by the outer annular member during a deposition process of the semiconductor,

wherein the contact portion overhangs the wafer to be clamped;

wherein the contact portion of each finger member overhangs the wafer to be clamped only at selected areas,

wherein the finger members contact the wafer only at the selected areas where the finger members overhang the wafer, thereby reducing an edge exclusion of the wafer, and

wherein the contact portion has a hemispherical shape thereby establishing a point contact surface with the wafer,

wherein said outer annular member has radially-spaced first and second annular projections directed downwardly therefrom; and said finger members are screw-mounted at said first and second annular projections; and

wherein said dies are manufactured on said wafer.

2 . The method of claim 1 , wherein said contact portion is downwardly directed.

3 . The method of claim 2 , wherein said second portion has a horizontal cross-section that decreases radially inwardly from a first width value which matches a width value of a corresponding essentially rectangular horizontal cross-section of said first portion, down to a second width value which is zero.

4 . A method for fabricating an integrated circuit by holding a wafer during a semiconductor process, said method comprising:

providing an outer annular member defining a central recess that has a diameter slightly greater than the diameter of said wafer; and

contacting said wafer during a semiconductor fabrication process with a plurality of finger members carried by said outer annular member and extending radially inwardly from said outer annular member into said central recess; and

sputtering the wafer.

5 . The method of claim 4 , wherein each of said finger members has a contact portion that is provided at a bottom surface of said respective finger member facing said wafer and contacting said wafer during the semiconductor fabrication process.

6 . The method of claim 5 , wherein said contact portion contacting said wafer is provided at a radially inwardly directed end of said respective finger member.

7 . The method of claim 5 , wherein said contact portion contacting said wafer has a hemispherical shape.

8 . The method of claim 7 , wherein the contact portion is connected to a wafer clamp assembly.

9 . The method of claim 8 , wherein the wafer contains a plurality of dies.

10 . The method of claim 9 , wherein a lesser amount of heat flux from a wafer clamp assembly is produced through the finger members.

11 . An method for fabricating dies on a wafer by holding the wafer during a semiconductor process, said method comprising:

providing an outer annular member means defining a central recess that has a diameter slightly greater than the diameter of said wafer; and

contacting said wafer during a semiconductor fabrication process with a plurality of finger members carried by said outer annular member and extending radially inwardly from said outer annular member into said central recess; and

sputtering the wafer, wherein a heat flows through the finger members during this sputtering; and

generating dies on the wafer.

12 . The method of claim 11 , wherein each of said finger members has a contact portion that is provided at a bottom surface of said respective finger member facing said wafer and contacting said wafer during the semiconductor fabrication process.

13 . The method of claim 12 , wherein said contact portion contacting said wafer is provided at a radially inwardly directed end of said respective finger member.

14 . The method of claim 13 , wherein said contact portion contacting said wafer has a hemispherical shape.

15 . The method of claim 14 , wherein the contact portion is connected to a wafer clamp assembly.