Electronic device
An electronic device includes a mounting substrate, a first semiconductor component including a first semiconductor chip that operates in synchronization with a first clock signal and being mounted on a first semiconductor component mounting area of the mounting substrate, a second semiconductor component including a second semiconductor chip that operates in synchronization with a second clock signal and being mounted on a second semiconductor component mounting area of the mounting substrate, the second semiconductor component mounting area being next to the first semiconductor component mounting area, and a third semiconductor component including a third semiconductor chip that controls the first and second semiconductor chips and being mounted on a third semiconductor component mounting area of the mounting substrate, the third semiconductor component mounting area being next to the first and the second semiconductor component mounting areas.
1. An electronic device, comprising:
a mounting substrate;
a first semiconductor component including a first semiconductor chip that operates in synchronization with a first clock signal and being mounted on a first semiconductor component mounting area of the mounting substrate;
a second semiconductor component including a second semiconductor chip that operates in synchronization with a second clock signal and being mounted on a second semiconductor component mounting area of the mounting substrate, the second semiconductor component mounting area being next to the first semiconductor component mounting area; and
a third semiconductor component including a third semiconductor chip that controls the first and second semiconductor chips and being mounted on a third semiconductor component mounting area of the mounting substrate, the third semiconductor component mounting area being next to the first and the second semiconductor component mounting areas,
wherein the third semiconductor component is electrically coupled to the first semiconductor component and the second semiconductor component via a main wiring provided on the mounting substrate and a first branch wiring which is branched from the main wiring at a first branch point of the main wiring and the main wiring, and a second branch wiring which is branched from the main wiring at a second branch point of the main wiring, respectively, a third branch wiring of the main wiring extending between and connecting the first branch point and the second branch point,
wherein the first branch point and the second branch point are arranged outside the first semiconductor component mounting area and the second semiconductor component mounting area, respectively,
wherein a first chip resistor and a second chip resistor are coupled in series to the first branch wiring and the second branch wiring, respectively, and
wherein a wiring length from the first branch point to the second branch point is longer than a wiring length from the control device to the first branch point.
2. The electronic device according to claim 1 , wherein the first semiconductor component and the second semiconductor component include a first memory device and a second memory device which are operated in synchronization with a clock signal, and
wherein the third semiconductor component comprises a control device that controls the first memory device and the second memory device.
3. The electronic device according to claim 1 , wherein the main wiring connects the third semiconductor component to the second semiconductor component through the first branch point and the second branch point.
4. The electronic device according to claim 1 , wherein the first branch point and the second branch point are connected in series through the main wiring.
5. The electronic device according to claim 1 , wherein the third semiconductor component is connected to the second semiconductor component only through the first branch point.
6. The electronic device according to claim 2 , wherein the main wiring includes a command signal main wiring or an address signal main wiring, and
wherein the branch wirings include command signal main wirings or address signal branch wirings.
7. The electronic device according to claim 3 , wherein the third semiconductor component is connected to the second semiconductor component only through the first branch point.
8. The electronic device according to claim 6 , wherein a clock signal is supplied from the control device to the first memory device and the second memory device via a clock signal main wiring provided on the mounting substrate and clock signal branch wirings branched from the clock signal main wiring at first and second branch points of the clock signal main wiring, respectively.
9. The electronic device according to claim 6 , wherein a control signal is supplied from the control device to the first memory device and the second memory device via a control signal main wiring provided on the mounting substrate and control signal branch wirings branched from the control signal main wiring at first and second branch points of the control signal main wiring, respectively.
10. The electronic device according to claim 8 , wherein the control device outputs a signal to the command signal main wiring or the address signal main wiring for each cycle of the clock signal to be output to the clock signal main wiring.
11. The electronic device according to claim 10 , wherein the mounting substrate includes a first data system wiring that couples the control device to the first memory device and a second data system wiring that couples the control device to the second memory device, and
wherein the control device performs data input or output among the control device, and the first memory device and the second memory device which are activated by the control signal.