IP Library Granted Patent US 9,432,560
Granted Patent B2
US 9,432,560 · App. 14/452,635 · Granted Aug 30, 2016

Image capturing module for saving focusing time and increasing assembly flatness and method of assembling the same

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,432,560
App. No.
14/452,635
Granted
Aug 30, 2016
Kind
B2
Abstract

An image capturing module for saving focusing time and increasing assembly flatness and a method of assembling the same are disclosed. The image sensing chip has a first horizontal top surface, the optical filter has a second horizontal top surface, and the first horizontal top surface and second horizontal top surface are obtained by a horizontal correction system using a laser light source. The distance from the second horizontal top surface to the first horizontal top surface is defined as a predetermined fixed focusing distance. Whereby, the movable lens assembly is directly disposed on the second horizontal top surface to save the focusing time of the movable lens assembly relative to the image sensing chip, and the first horizontal top surface and the second horizontal top surface are horizontal to each other for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip.

Claims (28)

1. An image capturing module for saving focusing time and increasing assembly flatness, comprising:

an image sensing unit including a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, wherein the image sensing chip has a first horizontal top surface on the top side thereof, and the first horizontal top surface is obtained by a horizontal correction system using a laser light source;

a housing frame disposed on the carrier substrate to surround the image sensing chip;

an actuator structure disposed on the housing frame and above the image sensing chip, wherein the actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly disposed inside the lens holder and above the image sensing chip, the lens holder includes a surrounding movable member movably disposed therein, the movable lens assembly is fixed inside the surrounding movable member through at least two separate bonding glue, and the movable lens assembly is movably disposed inside the lens holder through the surrounding movable member; and

an optical filter disposed on the housing frame and between the image sensing chip and the movable lens assembly, wherein the optical filter has a second horizontal top surface on the top side thereof, and the second horizontal top surface is obtained by the horizontal correction system using the laser light source, and the distance from the second horizontal top surface of the optical filter to the first horizontal top surface of the image sensing chip is defined as a predetermined fixed focusing distance;

wherein the movable lens assembly is directly disposed on the second horizontal top surface of the optical filter to save the focusing time of the movable lens assembly relative to the image sensing chip;

wherein the first horizontal top surface of the image sensing chip and the second horizontal top surface of the optical filter are parallel to each other for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip.

2. The image capturing module of claim 1 , wherein the housing frame has a top opening disposed on the top side thereof and between the image sensing chip and the movable lens assembly, and the top opening of the housing frame is enclosed by the optical filter, wherein the movable lens assembly has a bottom plane on the bottom side thereof for directly contacting the second horizontal top surface of the optical filter, and the predetermined fixed focusing distance from the second horizontal top surface of the optical filter to the first horizontal top surface of the image sensing chip is substantially the same as an adjustable focusing distance from the bottom plane of the movable lens assembly to the first horizontal top surface of the image sensing chip, wherein the surrounding movable member has an inner surrounding surface as a threadless surface, and the movable lens assembly has an outer perimeter surface as a threadless surface.

3. The image capturing module of claim 1 , wherein the laser light source is disposed at a predetermined position above the image sensing chip to generate a first laser light beam that is directly projected onto the first horizontal top surface of the image sensing chip, and the first laser light beam generated by the laser light source is reflected by the first horizontal top surface of the image sensing chip to form a first reflecting light beam that is directly projected onto the predetermined position or very close to the predetermined position.

4. The image capturing module of claim 1 , wherein the laser light source is disposed at a predetermined position above the optical filter to generate a second laser light beam that is directly projected onto the second horizontal top surface of the optical filter, and the second laser light beam generated by the laser light source is reflected by the second horizontal top surface of the optical filter to form a second reflecting light beam that is directly projected onto the predetermined position or very close to the predetermined position.

5. An image capturing module for saving focusing time and increasing assembly flatness, comprising:

an image sensing unit including a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, wherein the image sensing chip has a first horizontal top surface on the top side thereof;

a housing frame disposed on the carrier substrate to surround the image sensing chip;

an actuator structure disposed on the housing frame and above the image sensing chip, wherein the actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder and above the image sensing chip; and

an optical filter disposed on the housing frame and between the image sensing chip and the movable lens assembly, wherein the optical filter has a second horizontal top surface on the top side thereof, and the distance from the second horizontal top surface of the optical filter to the first horizontal top surface of the image sensing chip is defined as a predetermined fixed focusing distance;

wherein the movable lens assembly is directly disposed on the second horizontal top surface of the optical filter to save the focusing time of the movable lens assembly relative to the image sensing chip;

wherein the first horizontal top surface of the image sensing chip and the second horizontal top surface of the optical filter are parallel to each other for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip.

6. The image capturing module of claim 5 , wherein the housing frame has a top opening disposed on the top side thereof and between the image sensing chip and the movable lens assembly, and the top opening of the housing frame is enclosed by the optical filter, wherein the movable lens assembly has a bottom plane on the bottom side thereof for directly contacting the second horizontal top surface of the optical filter, and the predetermined fixed focusing distance from the second horizontal top surface of the optical filter to the first horizontal top surface of the image sensing chip is substantially the same as an adjustable focusing distance from the bottom plane of the movable lens assembly to the first horizontal top surface of the image sensing chip.

7. A method of assembling an image capturing module for saving focusing time and increasing assembly flatness, comprising:

providing an image sensing unit and a housing frame, wherein the image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, and the housing frame is disposed on the carrier substrate to surround the image sensing chip;

obtaining a first horizontal top surface on the top side of the image sensing chip by a horizontal correction system using a laser light source;

placing an optical filter on the housing frame and above the image sensing chip;

obtaining a second horizontal top surface on the top side of the optical filter by the horizontal correction system using the laser light source, wherein the distance from the second horizontal top surface of the optical filter to the first horizontal top surface of the image sensing chip is defined as a predetermined fixed focusing distance;

providing an actuator structure disposed on the housing frame and above the image sensing chip, wherein the actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly disposed inside the lens holder and above the image sensing chip, and the lens holder includes a surrounding movable member movably disposed therein, wherein the movable lens assembly is directly disposed on the second horizontal top surface of the optical filter to save the focusing time of the movable lens assembly relative to the image sensing chip, and the first horizontal top surface of the image sensing chip and the second horizontal top surface of the optical filter are horizontal to each other for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip; and

fixing the movable lens assembly inside the surrounding movable member through at least two separate bonding glue, wherein the movable lens assembly is movably disposed inside the lens holder through the surrounding movable member.

8. The method of claim 7 , wherein the housing frame has a top opening disposed on the top side thereof and between the image sensing chip and the movable lens assembly, and the top opening of the housing frame is enclosed by the optical filter, wherein the movable lens assembly has a bottom plane on the bottom side thereof for directly contacting the second horizontal top surface of the optical filter, and the predetermined fixed focusing distance from the second horizontal top surface of the optical filter to the first horizontal top surface of the image sensing chip is substantially the same as an adjustable focusing distance from the bottom plane of the movable lens assembly to the first horizontal top surface of the image sensing chip, wherein the surrounding movable member has an inner surrounding surface as a threadless surface, and the movable lens assembly has an outer perimeter surface as a threadless surface.

9. The method of claim 7 , wherein the laser light source is disposed at a predetermined position above the image sensing chip to generate a first laser light beam that is directly projected onto the first horizontal top surface of the image sensing chip, and the first laser light beam generated by the laser light source is reflected by the first horizontal top surface of the image sensing chip to form a first reflecting light beam that is directly projected onto the predetermined position or very close to the predetermined position.

10. The method of claim 7 , wherein the laser light source is disposed at a predetermined position above the optical filter to generate a second laser light beam that is directly projected onto the second horizontal top surface of the optical filter, and the second laser light beam generated by the laser light source is reflected by the second horizontal top surface of the optical filter to form a second reflecting light beam that is directly projected onto the predetermined position or very close to the predetermined position.

Assignments (6)
CHANGE OF NAME Recorded Jan 6, 2026
From: GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
To: LUXVISIONS INNOVATION TECHNOLOGY CORP. LIMITED
Reel/Frame 074245/0396 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2020
From: LUXVISIONS INNOVATION LIMITED
To: GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
Reel/Frame 053250/0724 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 13, 2018
From: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED; LITE-ON TECHNOLOGY CORPORATION
To: LUXVISIONS INNOVATION LIMITED
Reel/Frame 047490/0121 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 19, 2016
From: LITE-ON TECHNOLOGY CORPORATION
To: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED; LITE-ON TECHNOLOGY CORPORATION
Reel/Frame 038647/0419 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2014
From: LARVIEW TECHNOLOGIES CORP.
To: LITE-ON TECHNOLOGY CORPORATION
Reel/Frame 033634/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2014
From: JAO, CHING-LUNG; CHUANG, CHIANG-YUAN; CHOU, YU-TE
To: LARVIEW TECHNOLOGIES CORP.
Reel/Frame 033473/0260 →