Semiconductor device, method of manufacturing the semiconductor device, and electronic device
View Patent ↗The upper end of a gate electrode is situated below the surface of a semiconductor substrate. An insulating layer is formed over the gate electrode and over the semiconductor substrate situated at the periphery thereof. The insulating layer has a first insulating film and a low oxygen permeable insulating film. The first insulating film is, for example, an NSG film and the low oxygen permeable insulating film is, for example, an SiN film. Further, a second insulating film is formed over the low oxygen permeable insulating film. The second insulating film is, for example, a BPSG film. The TDDB resistance of a vertical MOS transistor is improved by processing with an oxidative atmosphere after forming the insulating layer. Further since the insulating layer has the low oxygen permeable insulating film, fluctuation of the threshold voltage of the vertical MOS transistor can be suppressed.
1. A method of manufacturing a semiconductor device comprising:
(a) forming a concave portion on an upper surface of a semiconductor substrate having a drain layer on a side of a lower surface of the semiconductor substrate;
(b) forming a gate insulating film on the inner wall of the concave portion;
(c) burying a gate electrode in the concave portion;
(d) forming a source layer to the semiconductor substrate on the side of the surface;
(e) forming a first insulating film directly over the gate electrode and over the upper surface of the semiconductor substrate after forming the gate insulating film and after burying the gate electrode;
(f) forming a second insulating film directly over the first insulating film,
(g) forming a third insulating film directly over the second insulating film; and
(h) performing a treatment with an oxidative atmosphere from above the first insulating film and from above the second insulating film,
wherein the second insulating film having an oxygen permeability lower than that of the third insulating film, and
wherein in the step (f), the second insulating film is formed such that the entire second insulating film is higher than the entire lower surface of the first insulating film and higher than the entire upper surface of the semiconductor substrate.
2. The method of manufacturing the semiconductor device according to claim 1 ,
wherein the second insulating film having an oxygen permeability lower than that of the first insulating film.
3. The method of manufacturing the semiconductor device according to claim 2 ,
wherein in the step (c), the gate electrode is formed such that the upper end of the gate electrode is lower than the surface of the semiconductor substrate.
4. The method of manufacturing the semiconductor device according to claim 3 ,
wherein in the step (e), the first insulating film is formed such that the upper surface of the first insulating film is higher than the surface of the semiconductor substrate.
5. The method of manufacturing the semiconductor device according to claim 2 ,
wherein a thickness of the first insulating film is greater than that of the second insulating film.
6. The method of manufacturing the semiconductor device according to claim 1 ,
wherein a thickness of the third insulating film is greater than that of the second insulating film.
7. The method of manufacturing the semiconductor device according to claim 1 ,
wherein the first insulating film is at least one of an SiN film, an SiC film, and an SiCN film.
8. The method of manufacturing the semiconductor device according to claim 1 ,
wherein the second insulting film is an SiN film and a thickness thereof is between 6 nm and 7 nm.
9. The method of manufacturing the semiconductor device according to claim 1 ,
wherein the third insulating film is at least one of an NSG (Non doped Silicate Glass) film, a BPSG (Boron phosphorus Silicate Glass) film, and an SOG (Spin on Glass).
10. The method of manufacturing the semiconductor device according to claim 2 ,
wherein the first insulating film is at least one of an NSG film and an SOG film.
11. The method of manufacturing the semiconductor device according to claim 1 ,
wherein the method further comprises the step of, after the step (h), (i) forming a source interconnect is formed over the third insulating film such that the source interconnect is coupled to the source layer.
12. The method of manufacturing the semiconductor device according to claim 11 ,
wherein the source interconnect is Al film.
13. The method of manufacturing the semiconductor device according to claim 1 , wherein the first insulating film, the second insulating film and the third insulating film are formed in a stacked manner directly over above the gate electrode so as to cover the entire top surface of the gate electrode.