Bellows interconnect
A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.
1. An interconnect comprising a stress relieving member configured to interface between an electronic component hosting substrate and a PCB board, wherein the stress relieving member includes a bellows structure and a layer of metal on the bellows structure.
2. The interconnect of claim 1 , wherein the stress relieving member comprises a substantially cylindrical structure.
3. The interconnect of claim 1 , wherein the stress relieving member comprises a cylindrical bellows structure.
4. The interconnect of claim 1 , wherein the stress relieving member is configured to reduce a stress.
5. The interconnect of claim 4 , wherein the stress comprises a CTE (coefficient of thermal expansion) mismatch between the substrate and the PCB board.
6. The interconnect of claim 4 , wherein the stress comprises a strain that is caused by a physical movement.
7. The interconnect of claim 6 , wherein the physical movement comprises shocking, vibration, translational movement, or a combination thereof.
8. A method of forming an interconnect comprising placing a stress relieving member between an electronic component hosting substrate and a PCB board, wherein the stress relieving member includes a bellows structure and a layer of metal on the bellows structure.
9. The method of claim 8 , wherein the bellows structure comprises a cylindrical structure.
10. The method of claim 8 , further comprising forming the bellows structure on a cylindrical object.
11. The method of claim 10 , wherein the cylindrical object comprises a water soluble polymer.
12. The method of claim 10 , wherein the cylindrical object comprises a metal.
13. The method of claim 12 , wherein the metal comprises aluminum, nickel, or a combination thereof.
14. The method of claim 10 , further comprising dissolving the cylindrical object.
15. The method of claim 8 , further comprising soldering the stress relieving member to the substrate.
16. The method of claim 8 , further comprising compressing the interconnect by a clamping force.
17. A method of forming an interconnect for electronic components comprising:
a. forming a mandrel with a cylindrical bellows structure using a cylindrical object;
b. electroplating a layer of metal on the mandrel;
c. dissolving the mandrel, such that a connecting member with a cylindrical bellows structure is formed; and
d. soldering the connecting member to substrate of the electronic components.
18. The method of claim 17 , wherein the cylindrical object comprises a water soluble polymer.
19. The method of claim 17 , wherein the cylindrical object comprises a metal.
20. The method of claim 17 , wherein the metal comprises aluminum, nickel, or a combination thereof.