Semiconductor device
In a semiconductor device using a transistor including an oxide semiconductor, a change in electrical characteristics is suppressed and reliability is improved. The semiconductor device includes a gate electrode over an insulating surface; an oxide semiconductor film overlapping with the gate electrode; a gate insulating film that is between the gate electrode and the oxide semiconductor film and in contact with the oxide semiconductor film; a protective film in contact with a surface of the oxide semiconductor film that is an opposite side of a surface in contact with the gate insulating film; and a pair of electrodes in contact with the oxide semiconductor film. The spin density of the gate insulating film or the protective film measured by electron spin resonance spectroscopy is lower than 1×10 18 spins/cm 3 , preferably higher than or equal to 1×10 17 spins/cm 3 and lower than 1×10 18 spins/cm 3 .
1. A semiconductor device comprising:
a gate insulating film;
an oxide semiconductor film; and
a protective film,
wherein the oxide semiconductor film is provided between the gate insulating film and the protective film,
wherein at least one of the gate insulating film and the protective film has a spin density obtained by an electron spin resonance spectrum, and
wherein the spin density is higher than or equal to 1×10 17 spins/cm 3 and lower than 1×10 18 spins/cm 3 .
2. The semiconductor device according to claim 1 , wherein the spin density is attributed to nitrogen oxide.
3. The semiconductor device according to claim 2 , wherein the nitrogen oxide is nitrogen monoxide or nitrogen dioxide.
4. The semiconductor device according to claim 1 , further comprising a gate electrode,
wherein the gate electrode is under the gate insulating film.
5. The semiconductor device according to claim 1 , further comprising a gate electrode,
wherein the gate electrode is over the gate insulating film.
6. The semiconductor device according to claim 1 , further comprising a pair of electrodes,
wherein the pair of electrodes are provided between the oxide semiconductor film and the protective film.
7. The semiconductor device according to claim 1 , further comprising a pair of electrodes,
wherein the pair of electrodes are provided between the oxide semiconductor film and the gate insulating film.
8. The semiconductor device according to claim 1 , wherein the oxide semiconductor film comprises indium, gallium, and zinc.
9. The semiconductor device according to claim 1 , wherein the oxide semiconductor film comprises indium, tin, and zinc.
10. A semiconductor device comprising:
a gate insulating film;
an oxide semiconductor film; and
a protective film,
wherein the oxide semiconductor film is provided between the gate insulating film and the protective film, and
wherein at least one of the gate insulating film and the protective film has a spin density obtained by an electron spin resonance spectrum of lower than 1×10 18 spins/cm 3 ,
wherein the electron spin resonance spectrum comprises a first signal, a second signal, and a third signal,
wherein a first signal appears at a g-factor of greater than or equal to 2.037 and smaller than or equal to 2.039,
wherein a second signal appears at a g-factor of greater than or equal to 2.001 and smaller than or equal to 2.003, and
wherein a third signal appears at a g-factor of greater than or equal to 1.964 and smaller than or equal to 1.966.
11. The semiconductor device according to claim 10 , wherein a split width of the first and second signals and a split width of the second and third signals are each 5 mT.
12. The semiconductor device according to claim 10 , wherein the spin density is higher than or equal to 1×10 17 spins/cm 3 and lower than 1×10 18 spins/cm 3 .
13. The semiconductor device according to claim 10 , wherein the spin density is attributed to nitrogen oxide.
14. The semiconductor device according to claim 13 , wherein the nitrogen oxide is nitrogen monoxide or nitrogen dioxide.
15. The semiconductor device according to claim 10 , further comprising a gate electrode,
wherein the gate electrode is under the gate insulating film.
16. The semiconductor device according to claim 10 , further comprising a gate electrode,
wherein the gate electrode is over the gate insulating film.
17. The semiconductor device according to claim 10 , further comprising a pair of electrodes,
wherein the pair of electrodes are provided between the oxide semiconductor film and the protective film.
18. The semiconductor device according to claim 10 , further comprising a pair of electrodes,
wherein the pair of electrodes are provided between the oxide semiconductor film and the gate insulating film.
19. The semiconductor device according to claim 10 , wherein the oxide semiconductor film comprises indium, gallium, and zinc.
20. The semiconductor device according to claim 10 , wherein the oxide semiconductor film comprises indium, tin, and zinc.