Shielding with integrated cooling

1. An apparatus for cooling an electrical component, the apparatus comprising:

a circuit board on which the electrical component is disposed; and

a cover disposed on the circuit board;

wherein the cover and the circuit board form a closed cavity in which the electronic component is located; and

wherein the closed cavity has a first opening for introducing a fluid and a second opening for discharging the fluid, wherein the first and second openings are formed in walls of the closed cavity, the first and second openings having a smaller cross-section relative to a direction of flow than the walls and the closed cavity.

2. The apparatus of claim 1 , further comprising a further cover disposed on a surface of the circuit board opposing the first-named cover, wherein the further cover and the circuit board form a further closed cavity.

3. The apparatus of claim 2 , wherein the first-named cover and the further cover are in contact with the circuit board at opposing locations on surfaces of the circuit board.

4. The apparatus of claim 2 , wherein the first-named cover, the further cover, or both the first-named cover and the further cover are made of an electrically conductive material.

5. The apparatus of claim 2 , wherein the first-named cover, the further cover, or both the first-named cover and the further cover are formed from several individual elements.

6. The apparatus of claim 5 , wherein an electrically conductive seal is disposed between the individual elements of the first-named cover, the further cover, or both the first-named cover and the further cover.

7. The apparatus of claim 5 , wherein electrically conductive seals are disposed between the circuit board and the first-named cover, the further cover, or both the first-named cover and the further cover.

8. The apparatus of claim 1 , wherein the first-named cover bounds a further cavity with the circuit board, the further cavity being delimited from the first-named cavity by a wall element.

9. The apparatus of claim 8 , wherein a further electrical component is disposed on the wall element in the further cavity and is in thermal contact with the wall element.

10. The apparatus of claim 1 , wherein the circuit board is coated in the cavity with an electrically insulating material such that a fluid in the cavity does not come into contact with an electrically conductive contact of the circuit board or of the electrical component.

11. The apparatus of claim 1 , further comprising an electrically insulating material covering the electrical component in the closed cavity, wherein the fluid contacts the electrically insulating material in the cavity.

12. A magnetic resonance tomography system comprising an electrical unit, the electrical unit comprising an apparatus for cooling the electrical unit, the apparatus comprising:

a circuit board on which the electrical unit is arranged; and

a cover disposed on the circuit board;

wherein the cover and the circuit board form a closed cavity in which the electronic component is located;

wherein the closed cavity has a first opening for introducing a fluid and a second opening for discharging the fluid; and

an electrically insulating material covering the electrical component in the closed cavity, wherein the fluid contacts the electrically insulating material in the cavity.

13. The magnetic resonance tomography system of claim 12 , wherein the apparatus further comprises a further cover disposed on a surface of the circuit board opposing the first-named cover, wherein the further cover and the circuit board form a further closed cavity.

14. The magnetic resonance tomography system of claim 13 , wherein the first-named cover and the further cover are in contact with the circuit board at opposing locations on surfaces of the circuit board.

15. The magnetic resonance tomography system of claim 13 , wherein the first-named cover, the further cover, or both the first-named cover and the further cover are made of an electrically conductive material.

16. The magnetic resonance tomography system of claim 12 , wherein the first and second openings are formed in walls of the closed cavity, the first and second openings having a smaller cross-section relative to a direction of flow than the walls and the closed cavity.

17. The magnetic resonance tomography system of claim 12 , wherein the electrical component is within the closed cavity.

18. An apparatus for cooling an electrical component, the apparatus comprising:

a circuit board on which the electrical component is disposed; and

a cover disposed on the circuit board;

wherein the cover and the circuit board form a closed cavity in which the electronic component is located, wherein the electrical component is within the closed cavity; and

wherein the closed cavity has a first opening for introducing a fluid and a second opening for discharging the fluid.