IP Library Granted Patent US 9,099,613
Granted Patent B2
US 9,099,613 · App. 14/456,935 · Granted Aug 4, 2015

LEDs with efficient electrode structures

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Quick Facts
Patent No.
US 9,099,613
App. No.
14/456,935
Granted
Aug 4, 2015
Kind
B2
Abstract

Aspects include Light Emitting Diodes that have a GaN-based light emitting region and a metallic electrode. The metallic electrode can be physically separated from the GaN-based light emitted region by a layer of porous dielectric, which provides a reflecting region between at least a portion of the metallic electrode and the GaN-based light emitting region.

Claims (10)

1. A Light Emitting Diode (LED) device, comprising:

a semiconductor structure comprising an active region, the active region being in electrical contact with a P doped region formed to have a generally planar surface, through which light generated in the active region can be emitted;

a first bond pad structure comprising a first cutout formed in the semiconductor structure, a first dielectric layer disposed partially within the first cutout and partially over the semiconductor structure, and a first bond pad disposed partially over the first dielectric layer and partially over the first cutout; and

a second bond pad structure comprising a second cutout formed in the semiconductor structure, a second dielectric layer disposed partially within the second cutout and partially over the semiconductor structure, and a second bond pad disposed partially over the second dielectric layer and partially over the second cutout.

2. The device of claim 1 further including a doped wiring extension extending from the second bond pad and into the semiconductor structure.

3. The device of claim 2 wherein the first bond pad structure is an n-bond structure.

4. The device of claim 3 wherein the second bond pad structure is a p-bond structure.

5. The device of claim 4 wherein the wiring extension is a p-wiring extension.

6. The device of claim 4 wherein the first dielectric layer extends in the first cutout from an n-layer of the semiconductor structure to a p-layer.

7. The device of claim 4 wherein the second bond pad extends partially onto the semiconductor structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2015
From: SHUM, FRANK T.; SO, WILLIAM W.; LESTER, STEVEN D.
To: BRIDGELUX, INC.
Reel/Frame 035815/0417 →