Mounting structure and method for dissipating heat from a computer expansion card
View Patent ↗A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure.
1. A mounting structure configured for mounting an expansion card within a computer enclosure and for absorbing and conducting heat from a heat source on the expansion card to an ambient atmosphere surrounding the computer enclosure, the mounting structure comprising:
a mounting bracket configured to support the expansion card within the computer enclosure;
a means for securing the mounting bracket to the computer enclosure;
a heat sink adapted to contact a surface of the heat source on the expansion card;
an extension interconnecting the heat sink and the mounting bracket; and
a means for conducting the heat from the heat sink to the mounting bracket and then dissipating the heat from the mounting bracket to the ambient atmosphere surrounding an exterior of the computer enclosure by a phase change medium within at least one heat pipe that contacts the heat sink and the mounting bracket of the mounting structure.
2. The mounting structure of claim 1 , wherein the mounting structure is an assembled structure in which the heat sink is assembled with the extension and the mounting bracket.
3. The mounting structure of claim 1 , wherein the heat sink is received within a frame defined by the extension.
4. The mounting structure of claim 3 , further comprising a means for biasing the heat sink away from the frame.
5. The mounting structure of claim 1 , wherein the means for conducting the heat from the heat sink to the mounting bracket and then dissipating the heat to the ambient atmosphere further comprises fins contacting the at least one heat pipe and disposed on a side of the mounting bracket opposite the heat sink.
6. The mounting structure of claim 5 , wherein the heat is transferred from the heat sink to the fins by the phase change medium within the at least one heat pipe.
7. The mounting structure of claim 1 , wherein the heat sink and the extension are oriented so as to be substantially parallel to the expansion card when the expansion card is mounted to the mounting structure.
8. In a computer system having an enclosure for mounting an expansion card therein, the computer system comprising a mounting structure mounting the expansion card within the enclosure, the mounting structure comprising:
a mounting bracket secured to the enclosure and configured to support the expansion card within the enclosure;
a heat sink contacting a surface of an integrated circuit chip on the expansion card;
an extension interconnecting the heat sink and the mounting bracket;
a means for conducting heat from the heat sink to the mounting bracket and then dissipating the heat from the mounting bracket directly to an ambient atmosphere surrounding an exterior of the enclosure by a phase change medium within at least one heat pipe that contacts the heat sink and the mounting bracket of the mounting structure.
9. The computer system of claim 8 , wherein the mounting structure is an assembled structure in which the heat sink is assembled with the extension and the mounting bracket.
10. The computer system of claim 9 , wherein the heat sink is received within a frame defined by the extension.
11. The computer system of claim 10 , further comprising a means for biasing the heat sink away from the frame.
12. The computer system of claim 8 , wherein the means for conducting the heat from the heat sink to the mounting bracket and then dissipating the heat to the ambient atmosphere further comprises fins contacting the heat pipe and disposed on a side of the mounting bracket opposite the heat sink.
13. The computer system of claim 12 , wherein the heat is transferred from the heat sink to the fins by the phase change medium within the at least one heat pipe.
14. A method of mounting an expansion card within a computer enclosure and for absorbing and conducting heat from a heat source on the expansion card to an ambient atmosphere surrounding the computer enclosure, the method comprising:
providing a mounting structure;
securing the expansion card to a mounting bracket of the mounting structure so that a heat sink extending from the mounting bracket contacts a surface of the heat source;
securing the mounting bracket to the computer enclosure, the mounting bracket supporting the expansion card within the computer enclosure;
conducting the heat from the heat sink to the mounting bracket; and
dissipating the heat from the mounting bracket to the ambient atmosphere surrounding an exterior of the computer enclosure by a phase change medium within at least one heat pipe that contacts the heat sink and the mounting bracket of the mounting structure.