Cleaning liquid for semiconductor device and method for cleaning substrate for semiconductor device
View Patent ↗An object of the present invention is to provide a good cleaning liquid for semiconductor device which is used after a CMP step, and the present invention relates to a cleaning liquid for semiconductor device containing the following components (1) to (5) or (1)′ to (4)′: (1) an inorganic alkali; (2) a chelating agent; (3) an anionic surfactant selected from sulfonic acid type and sulfuric acid type anionic surfactants; (4) an amine oxide type surfactant; and (5) water, or (1)′ an inorganic alkali; (2)′ a carboxyl group-containing chelating agent; (3)′ an anionic surfactant selected from a benzenesulfonic acid substituted with an alkyl group having from 8 to 20 carbon atoms and a salt thereof; and (4)′ water.
1. A cleaning liquid for a semiconductor device, comprising the following components (1)′ to (4)′:
(1)′ an inorganic alkali;
(2)′ a carboxyl group-containing chelating agent, which is at least one amino acid selected from the group consisting of cysteine and histidine;
(3)′ an anionic surfactant which is at least one of a benzenesulfonic acid substituted with an alkyl group having from 8 to 20 carbon atoms and a salt thereof; and
(4)′ water,
wherein the cleaning liquid has a pH of 9 or more.
2. The cleaning liquid according to claim 1 , wherein the inorganic alkali is contained in a concentration of from 0.005 to 0.1% by mass, and the chelating agent is contained in a concentration of from 0.005 to 0.1% by mass.
3. The cleaning liquid according to claim 1 , wherein the inorganic alkali is potassium hydroxide.
4. The cleaning liquid according to claim 1 , wherein the anionic surfactant is dodecylbenzenesulfonic acid.
5. A stock solution of the cleaning liquid according to claim 1 , wherein the inorganic alkali is contained in a concentration of from 0.1 to 10% by mass, and the chelating agent is contained in a concentration of from 0.1 to 10% by mass.
6. A method for cleaning a substrate for semiconductor device, comprising contacting a substrate for semiconductor device having a Cu wiring and a low-dielectric constant insulating film on a surface thereof, the substrate being one after conducting chemical mechanical polishing, with the cleaning liquid according to claim 1 .
7. The cleaning liquid according to claim 1 , comprising:
(1) 0.005 to 0.1% by mass of potassium hydroxide;
(2) 0.005 to 0.1% by mass of the carboxyl group-containing chelating agent;
(3) 0.0005 to 0.01% by mass of dodecylbenzenesulfonic acid; and
(4) water.
8. The cleaning liquid according to claim 1 , comprising:
(1) 0.02 to 0.08% by mass of potassium hydroxide;
(2) 0.02 to 0.08% by mass of the carboxyl group-containing chelating agent;
(3) 0.002 to 0.008% by mass of dodecylbenzenesulfonic acid; and
(4) water.