IP Library Granted Patent US 9,533,398
Granted Patent B2
US 9,533,398 · App. 14/463,587 · Granted Jan 3, 2017

Positive relief forming of polycrystalline diamond structures and resulting cutting tools

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Quick Facts
Patent No.
US 9,533,398
App. No.
14/463,587
Granted
Jan 3, 2017
Kind
B2
Abstract

Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.

Claims (12)

1. A method of making a polycrystalline diamond (“PCD”) structure, the method comprising:

providing a substrate having a surface;

positioning at least one diamond material flute volume including at least one diamond material tube including diamond particles, the at least one diamond material tube in contact with a portion of the surface of the substrate; and

subjecting the substrate and the at least one diamond material flute volume to a high-pressure/high-temperature (“HPHT”) process effective to sinter the diamond particles to form a PCD flute volume and bond the PCD flute volume.

2. The method of claim 1 , wherein the at least one diamond material tube includes a cobalt-containing tube.

3. The method of claim 1 , further comprising attaching at least one portion of the PCD flute volume to the substrate using at least one of induction heating, laser tacking, adhesive, or a binder material.

4. The method of claim 1 , wherein the at least one diamond material flute volume includes a plurality of shear compacted diamond particles.

5. The method of claim 1 , wherein positioning the at least one diamond material flute volume includes positioning at least one preformed diamond volume generally helically around at least a portion of the substrate.

6. The method of claim 1 , further comprising:

removing mold material from around the PCD flute volume and the substrate;

processing the PCD flute volume to a final dimension using at least one of milling, grinding, lapping, electro-discharge machining, or lasing; and

at least partially leaching the PCD flute volume to a selected depth therein.

Assignments (6)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded May 9, 2018
From: APERGY (DELAWARE) FORMATION, INC.; APERGY BMCS ACQUISITION CORP.; APERGY ENERGY AUTOMATION, LLC; HARBISON-FISCHER, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 046117/0015 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 19, 2014
From: MIESS, DAVID P.
To: US SYNTHETIC CORPORATION
Reel/Frame 033567/0805 →