Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
View Patent ↗Systems and methods in accordance with embodiments of the invention implement graphene-based thermal management cores and printed wiring boards incorporating graphene-based thermal management cores. In one embodiment, a graphene-based thermal management core includes: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; where the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer.
1. A graphene-based thermal management core comprising:
a layer including at least one sheet of graphene;
a first reinforcement layer; and
a second reinforcement layer;
wherein the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer; and
wherein at least either the first reinforcement layer or the second reinforcement layer comprises a substrate impregnated with a non-dielectric resin.
2. The graphene-based thermal management core of claim 1 , wherein the at least one sheet of graphene is implemented via at least one graphene nanoplatelet.
3. The graphene-based thermal management core of claim 2 , wherein the layer including at least one sheet of graphene includes a plurality of graphene nanoplatelets.
4. The graphene-based thermal management core of claim 3 , wherein at least two of the plurality of graphene nanoplatelets have a thickness of between approximately 1 nm and approximately 20 nm.
5. The graphene-based thermal management core of claim 4 , wherein at least two of the plurality of graphene nanoplatelets have a width between approximately 1 micron and approximately 50 microns.
6. The graphene-based thermal management core of claim 3 , wherein at least two of the plurality of graphene nanoplatelets are characterized by a thermal conductivity of between approximately 500 W/mK and approximately 2,500 W/mK.
7. The graphene-based thermal management core of claim 1 , wherein at least either the first reinforcement layer or second reinforcement layer comprises a resin that is one of: a phenolic based resin, a Bismaleimide Triazine (BT) epoxy based resin, a Cyanate Ester based resin, and a polyimide based resin.
8. The graphene-based thermal management core of claim 1 , wherein the substrate comprises carbon.
9. The graphene-based thermal management core of claim 8 , wherein the substrate comprises one of: carbon fibers, carbon plates, carbon flakes, and mixtures thereof.
10. The graphene-based thermal management core of claim 9 , wherein the substrate comprises carbon fibers that comprise graphite.
11. The graphene-based thermal management core of claim 10 , wherein the carbon fibers are unidirectional.
12. The graphene-based thermal management core of claim 10 , wherein the carbon fibers are woven.
13. The graphene-based thermal management core of claim 1 , further comprising:
a first electrically conductive layer bound to the first reinforcement layer; and
a second electrically conductive layer bound to the second reinforcement layer.
14. The graphene-based thermal management core of claim 13 , wherein at least one of the first electrically conductive layer and second electrically conductive layer comprises copper.
15. A printed wiring board comprising:
a graphene-based thermal management core that itself comprises:
a layer including at least one sheet of graphene;
a first reinforcement layer; and
a second reinforcement layer;
wherein the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer; and
wherein at least either the first reinforcement layer or the second reinforcement layer comprises a substrate impregnated with a non-dielectric resin;
at least one dielectric layer; and
at least one electrically conductive layer that includes a circuit trace;
wherein at least one dielectric layer is disposed between the graphene-based thermal management core and at least one electrically conductive layer.
16. The printed wiring board of claim 15 , wherein the graphene-based thermal management core is electrically isolated from any circuit traces.
17. The printed wiring board of claim 15 , wherein the graphene-based thermal management core is electrically connected to at least one circuit trace.
18. The printed wiring board of claim 15 , wherein the graphene-based thermal management core is electrically connected to the circuit trace by a via.
19. The printed wiring board of claim 17 , wherein the graphene-based thermal management core is configured to act as one of: a ground plane; a power plane; and a split power and ground plane.
20. The printed wiring board of claim 19 , wherein the layer including at least one sheet of graphene comprises at least one graphene nanoplatelet.
21. The printed wiring board of claim 20 , wherein the substrate comprises carbon.