Polycrystalline diamond composite compact elements and tools incorporating same
View Patent ↗A polycrystalline diamond (PCD) composite compact element 100 comprising a substrate 130 , a PCD structure 120 bonded to the substrate 130 , and a bond material in the form of a bond layer 140 bonding the PCD structure 120 to the substrate 130 ; the PCD structure 120 being thermally stable and having a mean Young's modulus of at least about 800 GPa, the PCD structure 120 having an interstitial mean free path of at least about 0.05 microns and at most about 1.5 microns; the standard deviation of the mean free path being at least about 0.05 microns and at most about 1.5 microns. Embodiments of the PCD composite compact element may be for a tool for cutting, milling, grinding, drilling, earth boring, rock drilling or other abrasive applications, such as the cutting and machining of metal.
1. A PCD composite compact element comprising a substrate, a sintered PCD structure bonded to the substrate, and a bond material bonding the PCD structure to the substrate; the PCD structure being thermally stable and having a mean Young's modulus of at least about 800 GPa, the PCD structure having an interstitial mean free path of at least about 0.05 microns and at most about 1.5 microns; the standard deviation of the mean free path being at least about 0.05 microns and at most about 1.5 microns: the bond material being a braze alloy in the form of a braze layer between the PCD structure and the substrate: wherein the PCD structure comprises braze material to a depth of at least about 2 microns from an interface with the braze layer.
2. A PCD composite compact element as claimed in claim 1 , in which the braze alloy has a melting onset temperature of at most about 1,050 degrees centigrade and contains at least one element selected from the group consisting of Ti, V, Cr, Mn, Zr, Nb, Mo, Hf, Ta, W and Re.
3. A PCD composite compact element as claimed in claim 2 , in which the substrate comprises PCD material.
4. A PCD composite compact element as claimed in claim 2 , in which there is less than about 5 volume percent of solvent/catalyst for diamond in the PCD structure.
5. A PCD composite compact element as claimed in claim 2 , in which the PCD structure has a mean diamond grain contiguity of at least about 60 percent.
6. A PCD composite compact element as claimed in claim 2 , in which the PCD structure has transverse rupture strength of at least about 900 MPa.
7. A PCD composite compact element as claimed in claim 2 , in which the PCD structure is not substantially entirely porous and has a mean Young's modulus of at least about 900 GPa, and a transverse rupture strength of least about 1,000 MPa.
8. A PCD composite compact element as claimed in claim 1 , in which the bond material comprises an epoxy material for joining ceramic materials.
9. A PCD composite compact element as claimed in claim 1 , in which the PCD structure is at least partially porous.
10. A PCD composite compact element as claimed in claim 1 , in which the substrate includes diamond particles dispersed within it.
11. A PCD composite compact element as claimed in claim 1 , secured to a drill bit or other earth boring tool.
12. A PCD composite compact element comprising a sintered PCD structure bonded to a substrate by means of a bond material; the sintered PCD structure being thermally stable and having a mean Young's modulus of at least about 800 GPa and a mean diamond grain contiguity greater than about 60 percent; the bond material being a braze alloy in the form of a braze layer between the sintered PCD structure and the substrate; wherein the PCD structure comprises braze material to a depth of at least about 2 microns from an interface with the braze layer.
13. A PCD composite compact element as claimed in claim 12 , in which the braze alloy has a melting onset temperature of at most about 1,050 degrees centigrade and contains at least one element selected from the group consisting of Ti, V, Cr, Mn, Zr, Nb, Mo, Hf, Ta, W and Re.
14. A PCD composite compact element as claimed in claim 13 , in which there is less than about 5 volume percent of solvent/catalyst for diamond in the PCD structure.
15. A PCD composite compact element as claimed in claim 13 , secured to a drill bit or other earth boring tool.
16. A PCD composite compact element as claimed in claim 13 , in which the PCD structure has an interstitial mean free path in the range from about 0.05 micron to about 1.5 microns; and the standard deviation of the mean free path is in the range from about 0.05 micron to about 1.5 microns.
17. A PCD composite compact element as claimed in claim 13 , in which the PCD structure has transverse rupture strength of at least about 900 MPa.
18. A PCD composite compact element as claimed in claim 12 , in which the bond material comprises an epoxy material for joining ceramic materials.
19. A PCD composite compact element as claimed in claim 12 , in which the PCD structure is at least partially porous.
20. A PCD composite compact element as claimed in claim 12 , in which the substrate includes diamond particles dispersed within it.
21. A PCD composite compact element as claimed in claim 12 , in which the PCD structure is not substantially entirely porous and has a mean Young's modulus of at least about 900 GPa, and a transverse rupture strength of least about 1,000 MPa.