IP Library › Granted Patent US 9,350,098
Granted Patent B2
US 9,350,098 · App. 14/467,807 · Granted May 24, 2016

Systems and methods for stacking compression connectors

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Quick Facts
Patent No.
US 9,350,098
App. No.
14/467,807
Granted
May 24, 2016
Kind
B2
Abstract

In accordance with embodiments of the present disclosure, a circuit board comprising may include a substrate, a primary compression connector, and a second compression connector. The substrate may have a first side and a second side and may have formed therein a substrate retention channel. The primary compression connector may be coupled to the first side and have formed thereon a primary connector retention channel aligned with the substrate retention channel. The second compression connector may be coupled to the second side opposite from the first compression connector and may have formed thereon a secondary connector retention channel aligned with the substrate retention channel and the primary connector retention channel to define a circuit board retention channel.

Claims (42)

1. A circuit board comprising:

a substrate having a first side and a second side and having formed therein a substrate retention channel;

a primary compression connector coupled to the first side having formed thereon a primary connector retention channel aligned with the substrate retention channel; and

a second compression connector coupled to the second side opposite from the first compression connector and having formed thereon a secondary connector retention channel aligned with the substrate retention channel and the primary connector retention channel to define a circuit board retention channel.

2. The circuit board of claim 1 , wherein the primary compression connector and second compression connector are substantially directly aligned in a direction perpendicular to the first side.

3. The circuit board of claim 1 , wherein:

the primary compression connector is configured to couple to a corresponding primary connector of a first component other than the circuit board, the first component having a first component retention channel;

the second compression connector is configured to couple to a corresponding secondary connector of a second component other than the circuit board and the first component, the second component having a second component retention channel; and

the circuit board retention channel, the first component retention channel, and the second component retention channel are configured to align and receive a retention element to:

mechanically couple the circuit board, the first component, and the second component to one another;

electrically couple the primary compression connector to the corresponding primary connector; and

electrically couple the second compression connector to the corresponding secondary connector.

4. The circuit board of claim 3 , wherein at least one of the first component and the second component comprises a second circuit board.

5. The circuit board of claim 3 , wherein at least one of the first component and the second component comprises a cabling system.

6. A system comprising:

a first component having a first component connector and a first component retention channel;

a second component comprising:

a substrate having a first side and a second side and having formed therein a substrate retention channel;

a primary compression connector coupled to the first side having formed thereon a primary connector retention channel aligned with the substrate retention channel; and

a second compression connector coupled to the second side opposite from the first compression connector and having formed thereon a secondary connector retention channel aligned with the substrate retention channel and the primary connector retention channel to define a second component retention channel aligned with the first component retention channel;

a third component having a third component connector and a third component retention channel aligned with the first component retention channel and the second component retention channel; and

a retention element configured to be received in the first component retention channel, the second component retention channel, and the third component retention channel, and further configured to:

mechanically couple the first component, the second component, and the third component to one another;

electrically couple the primary compression connector to the first component connector; and

electrically couple the second compression connector to the third component connector.

7. The system of claim 6 , wherein the primary compression connector and second compression connector are substantially directly aligned in a direction perpendicular to the first side.

8. The system of claim 6 , wherein at least one of the first component, the second component, and the third component comprises a circuit board.

9. The system of claim 6 , wherein at least one of the first component and the third component comprises a cabling system.

10. A method for coupling information handling resources, comprising:

providing a first component having a first component connector and a first component retention channel;

providing a second component comprising:

a substrate having a first side and a second side and having formed therein a substrate retention channel;

a primary compression connector coupled to the first side having formed thereon a primary connector retention channel aligned with the substrate retention channel; and

a second compression connector coupled to the second side opposite from the first compression connector and having formed thereon a secondary connector retention channel aligned with the substrate retention channel and the primary connector retention channel to define a second component retention channel aligned with the first component retention channel;

providing a third component having a third component connector and a third component retention channel aligned with the first component retention channel and the second component retention channel;

coupling a retention element within the first component retention channel, the second component retention channel, and the third component retention channel configured to:

mechanically couple the first component, the second component, and the third component to one another;

electrically couple the primary compression connector to the first component connector; and

electrically couple the second compression connector to the third component connector.

11. The method of claim 10 , wherein the primary compression connector and second compression connector are substantially directly aligned in a direction perpendicular to the first side.

12. The method of claim 10 , wherein at least one of the first component, the second component, and the third component comprises a circuit board.

13. The method of claim 10 , wherein at least one of the first component and the third component comprises a cabling system.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
RELEASE OF REEL 034590 FRAME 0731 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040027/0070 →
RELEASE OF REEL 034591 FRAME 0391 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040027/0719 →
RELEASE OF REEL 034590 FRAME 0696 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040016/0964 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 034590/0696 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (NOTES) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 034590/0731 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 034591/0391 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2014
From: FARKAS, SANDOR; HARTMAN, COREY DEAN; BROCKLESBY, BRANDON JOEL; TARANTOLO, JOSEPH
To: DELL PRODUCTS L.P.
Reel/Frame 033603/0868 →