Semiconductor device
A plurality of unit MISFET elements connected in parallel with each other to make up a power MISFET are formed in an LDMOSFET forming region on a main surface of a semiconductor substrate. A control circuit that controls a gate voltage of the power MISFET is formed in a driver circuit region on the main surface of the semiconductor substrate. A wiring structure having a plurality of wiring layers made of the same metal material is formed on the semiconductor substrate. The gate electrodes of the plurality of unit MISFET elements formed in the LDMOSFET forming region are electrically connected to each other via gate wirings formed in all of the plurality of wiring layers made of the same metal material.
1. A semiconductor device comprising:
a semiconductor substrate;
a plurality of unit MISFET elements formed in a first MISFET forming region on a main surface of the semiconductor substrate and connected in parallel with each other to make up a power MISFET;
a control circuit formed in a first control circuit forming region on the main surface of the semiconductor substrate and controlling a gate voltage of the power MISFET; and
a wiring structure formed on the semiconductor substrate and having a plurality of wiring layers made of the same metal material,
wherein gate electrodes of the plurality of unit MISFET elements formed in the first MISFET forming region are electrically connected to each other via gate wirings which are respectively formed in all of the plurality of wiring layers.
2. The semiconductor device according to claim 1 ,
wherein a wiring thickness of an uppermost wiring layer among the plurality of wiring layers is larger than a wiring thickness of any one of the plurality of wiring layers other than the uppermost wiring layer.
3. The semiconductor device according to claim 2 ,
wherein the gate wiring formed in the uppermost wiring layer functions as a conductive path from the control circuit to at least some of the plurality of gate electrodes formed in the first MISFET forming region.
4. The semiconductor device according to claim 3 ,
wherein each of the plurality of wiring layers is an aluminum wiring layer.
5. The semiconductor device according to claim 1 ,
wherein the gate wiring formed in any one of the plurality of wiring layers is connected to the control circuit.
6. The semiconductor device according to claim 1 ,
wherein source regions of the plurality of unit MISFET elements formed in the first MISFET forming region are electrically connected to each other via source wirings respectively formed in all of the plurality of wiring layers, and
drain regions of the plurality of unit MISFET elements formed in the first MISFET forming region are electrically connected to each other via drain wirings respectively formed in all of the plurality of wiring layers.
7. The semiconductor device according to claim 6 ,
wherein the gate wiring is disposed between the source wiring and the drain wiring in the uppermost wiring layer.
8. The semiconductor device according to claim 6 , further comprising:
a source bump electrode and a drain bump electrode each functioning as an external terminal,
wherein the source bump electrode is electrically connected to the source regions of the plurality of unit MISFET elements via the source wirings respectively formed in the plurality of wiring layers, and
the drain bump electrode is electrically connected to the drain regions of the plurality of unit MISFET elements via the drain wirings respectively formed in the plurality of wiring layers.
9. The semiconductor device according to claim 8 ,
wherein the wiring structure has a dissimilar wiring layer which is an upper layer than the uppermost wiring layer and is made of a metal material different from the metal material of the plurality of wiring layers,
the source bump electrode is formed on a source dissimilar wiring formed in the dissimilar wiring layer and is electrically connected to the source wiring formed in the uppermost wiring layer among the plurality of wiring layers via the source dissimilar wiring, and
the drain bump electrode is formed on a drain dissimilar wiring formed in the dissimilar wiring layer and is electrically connected to the drain wiring formed in the uppermost wiring layer among the plurality of wiring layers via the drain dissimilar wiring.
10. The semiconductor device according to claim 9 ,
wherein the dissimilar wiring layer is a copper wiring layer.
11. The semiconductor device according to claim 9 ,
wherein the source bump electrode overlaps a wiring formed in the uppermost wiring layer and having a different potential from the source bump electrode when seen in a plan view.
12. The semiconductor device according to claim 9 ,
wherein the drain bump electrode overlaps a wiring formed in the uppermost wiring layer and having a different potential from the drain bump electrode when seen in a plan view.
13. The semiconductor device according to claim 9 ,
wherein the source bump electrode does not overlap a connection region between the source dissimilar wiring and the source wiring formed in the uppermost wiring layer when seen in a plan view, and
the drain bump electrode does not overlap a connection region between the drain dissimilar wiring and the drain wiring formed in the uppermost wiring layer when seen in a plan view.
14. The semiconductor device according to claim 1 ,
wherein the plurality of wiring layers includes a first wiring layer which is a lowermost wiring layer, a second wiring layer which is an upper layer than the first wiring layer, and a third wiring layer which is an upper layer than the second wiring layer,
the uppermost wiring layer is the third wiring layer,
the first wiring layer includes a first gate wiring which is the gate wiring formed in the first wiring layer, a first source wiring which is the source wiring formed in the first wiring layer, and a first drain wiring which is the drain wiring formed in the first wiring layer,
the second wiring layer includes a second gate wiring which is the gate wiring formed in the second wiring layer, a second source wiring which is the source wiring formed in the second wiring layer, and a second drain wiring which is the drain wiring formed in the second wiring layer,
the third wiring layer includes a third gate wiring which is the gate wiring formed in the third wiring layer, a third source wiring which is the source wiring formed in the third wiring layer, and a third drain wiring which is the drain wiring formed in the third wiring layer,
the gate electrodes of the plurality of unit MISFET elements formed in the first MISFET forming region are electrically connected to each other via the first gate wiring, the second gate wiring, and the third gate wiring,
the source regions of the plurality of unit MISFET elements formed in the first MISFET forming region are electrically connected to each other via the first source wiring, the second source wiring, and the third source wiring, and
the drain regions of the plurality of unit MISFET elements formed in the first MISFET forming region are electrically connected to each other via the first drain wiring, the second drain wiring, and the third drain wiring.
15. The semiconductor device according to claim 14 ,
wherein, in the first MISFET forming region, the gate electrodes of the plurality of unit MISFET elements extend in a first direction and are arranged in a second direction intersecting the first direction, and
the third gate wiring is disposed between the third source wiring and the third drain wiring so as to extend in the first direction.