PROXIMITY SENSING DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
The embodiments of the present invention provide a proximity sensing device and a method for manufacturing the same, and an electronic device. The proximity sensing device includes: a window; a signal transmitting element integrated at an inner side of the window, to transmit an optical signal to an outer side of the window; and a signal sensing element integrated at the inner side of the window and disposed side by side with the signal transmitting element, to sense an object at the outer side of the window by receiving the optical signal reflected by the object. Through the embodiments of the present invention, the gap between the signal transmitting element, the signal sensing element and the window needs not to be considered too much, the integration process becomes easily controllable, and the light leakage is greatly reduced.
1 . A proximity sensing device, comprising:
a window;
a signal transmitting element, integrated at an inner side of the window, to transmit an optical signal to an outer side of the window; and
a signal sensing element, integrated at the inner side of the window and disposed side by side with the signal transmitting element, to sense an object at the outer side of the window by receiving the optical signal reflected by the object.
2 . The proximity sensing device according to claim 1 , wherein pads are encapsulated on the surfaces of the signal transmitting element and the signal sensing element connected to the window, and the signal transmitting element and the signal sensing element are bonded on the inner surface of the window by using the pads.
3 . The proximity sensing device according to claim 1 , wherein the signal transmitting element and the signal sensing element have pins integrated to the window, respectively, and signal lines of the signal transmitting element and the signal sensing element are connected to the window via the pins.
4 . The proximity sensing device according to claim 3 , wherein the pins are welded to the surface of the window using an Anisotropic Conductive Film (ACF) bonding technology.
5 . The proximity sensing device according to claim 3 , wherein the window is integrated with a Sensor On Lens (SOL), and the signal lines of the signal transmitting element and the signal sensing element are connected to the SOL via the pins.
6 . The proximity sensing device according to claim 1 , further comprising:
a printed circuit board, disposed at sides of the signal transmitting element and the signal sensing element opposite the window.
7 . The proximity sensing device according to claim 6 , wherein signal lines of the signal transmitting element and the signal sensing element are connected to the printed circuit board.
8 . An electronic device, comprising the proximity sensing device according to claim 1 .
9 . An electronic device, comprising the proximity sensing device according to claim 2 .
10 . An electronic device, comprising the proximity sensing device according to claim 3 .
11 . An electronic device, comprising the proximity sensing device according to claim 4 .
12 . An electronic device, comprising the proximity sensing device according to claim 5 .
13 . An electronic device, comprising the proximity sensing device according to claim 6 .
14 . An electronic device, comprising the proximity sensing device according to claim 7 .
15 . A method for manufacturing a proximity sensing device, comprising:
disposing a window;
integrating a signal transmitting element at an inner side of the window, the signal transmitting element transmitting an optical signal to an outer side of the window; and
integrating a signal sensing element at the inner side of the window and disposing the signal sensing element side by side with the signal transmitting element, the signal sensing element sensing an object at the outer side of the window by receiving the optical signal reflected by the object.
16 . The method for manufacturing a proximity sensing device according to claim 15 , further comprising:
encapsulating pads on the surfaces of the signal transmitting element and the signal sensing element connected to the window, and bonding the signal transmitting element and the signal sensing element on the inner surface of the window by using the pads.
17 . The method for manufacturing a proximity sensing device according to claim 15 , wherein the signal transmitting element and the signal sensing element have pins integrated to the window, respectively, and signal lines of the signal transmitting element and the signal sensing element are connected to the window via the pins.
18 . The method for manufacturing a proximity sensing device according to claim 17 , wherein the window is integrated with a Sensor On Lens (SOL), the method further comprising:
welding the pins to the surface of the window using an Anisotropic Conductive Film (ACF) bonding technology, wherein the signal lines of the signal transmitting element and the signal sensing element are connected to the SOL via the pins.