Method of manufacturing a printable composition of a liquid or gel suspension of diodes
An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary method of making a liquid or gel suspension of diodes comprises: adding a viscosity modifier to a plurality of diodes in a first solvent; and mixing the plurality of diodes, the first solvent and the viscosity modifier to form the liquid or gel suspension of the plurality of diodes. Various exemplary diodes have a lateral dimension between about 10 to 50 microns and about 5 to 25 microns in height. Other embodiments may also include a plurality of substantially chemically inert particles having a range of sizes between about 10 to about 50 microns.
1. A method of making a liquid or gel suspension of diodes, the method comprising:
adding at least one viscosity modifier to a plurality of diodes in at least one solvent; and
mixing the plurality of diodes, the at least one solvent and the at least one viscosity modifier to form the liquid or gel suspension of the plurality of diodes, each diode of the plurality of diodes comprising:
a light emitting or absorbing region having a lateral dimension between 10 microns to 40 microns and a height between 2 to 7 microns;
a first terminal coupled to the light emitting or absorbing region on a first side, the first terminal having a height less than 6 microns; and
a second terminal coupled to the light emitting or absorbing region on a second side opposite the first side, the second terminal having a height less than 6 microns;
wherein each diode of the plurality of diodes has a lateral dimension between 10 to 50 microns and a height between 5 to 25 microns; and
wherein each diode of the plurality of diodes comprises at least one inorganic semiconductor selected from the group consisting essentially of: silicon, gallium arsenide (GaAs), gallium nitride (GaN), GaP, InAlGaP, AlInGaAs, InGaNAs, and AlInGaSb, and mixtures or combinations thereof.
2. The method of claim 1 , wherein the liquid or gel suspension of the plurality of diodes is mixed until the viscosity is at least about 100 centipoise (cps) measured at 25° C.
3. The method of claim 1 , further comprising:
adding a plurality of substantially chemically inert and substantially optically transmissive particles to the mixture of the plurality of diodes, the at least one solvent and the at least one viscosity modifier, wherein each particle of the plurality of substantially chemically inert particles has a size between 10 microns to 70 microns in any dimension.
4. The method of claim 1 , wherein the at least one solvent comprises one or more solvents selected from the group consisting essentially of: water; alcohols, cyclic alcohols, ethers, esters, glycols, glycerols, carbonates, acetonitrile, tetrahydrofuran (THF), dimethyl formamide (DMF), N-methyl formamide (NMF), dimethyl sulfoxide (DMSO), and mixtures thereof.
5. The method of claim 1 , wherein the at least one viscosity modifier comprises one or more viscosity modifiers selected from the group consisting essentially of: clays, saccharides, polysaccharides, celluloses, modified celluloses, acrylate polymers and copolymers, (meth)acrylate polymers and copolymers, polyvinyl polymers and copolymers, polyethylene polymers and copolymers, ethers, esters, acetates, glycols, glycerols, fumed silica, silica powders, modified ureas, and mixtures thereof.
6. The method of claim 1 , wherein each diode of the plurality of diodes has a lateral dimension less than 30 microns and a height less than 15 microns.
7. The method of claim 1 , wherein prior to the step of adding a viscosity modifier, the method further comprising:
releasing the plurality of diodes from a wafer.
8. The method of claim 1 , wherein each diode of the plurality of diodes has a plurality of lateral sides which are substantially sigmoidal and terminate in a curved point.
9. The method of claim 1 , wherein the light emitting or absorbing region of the diode comprises GaN and has a shape selected from the group consisting of: substantially hexagonal, substantially square, substantially triangular, substantially rectangular, substantially lobed, substantially stellate, substantially toroidal, and combinations thereof.
10. The method of claim 1 , wherein the light emitting or absorbing region of each diode of the plurality of diodes has a surface texture.
11. The method of claim 1 , wherein the viscosity modifier, when dried or cured, forms a polymer or resin lattice or structure substantially about the periphery of each diode of the plurality of diodes.
12. The method of claim 1 , wherein the liquid or gel suspension of the plurality of diodes is visually opaque when wet and substantially optically clear when dried or cured.
13. A method of making a liquid or gel suspension of diodes for printing, the method comprising:
adding a second solvent to a plurality of diodes in a first solvent, the second solvent different from the first solvent, each diode of the plurality of diodes comprising:
a light emitting or absorbing region having a lateral dimension between 10 microns to 40 microns and a height between 2 to 7 microns;
a first terminal coupled to the light emitting or absorbing region on a first side, the first terminal having a height less than 6 microns; and
a second terminal coupled to the light emitting or absorbing region on a second side opposite the first side, the second terminal having a height less than 6 microns;
wherein each diode of the plurality of diodes has a lateral dimension between 10 to 50 microns and a height between 5 to 25 microns;
adding a viscosity modifier to the plurality of diodes, the first solvent and the second solvent;
adding a plurality of substantially chemically inert particles to the plurality of diodes, the first solvent, the second solvent and the viscosity modifier; and
mixing the plurality of diodes, the first solvent, the second solvent, the viscosity modifier, and the plurality of substantially chemically inert particles until the viscosity is at least 100 centipoise (cps) measured at 25° C. to form the liquid or gel suspension of the plurality of diodes.
14. The method of claim 13 , wherein the plurality of diodes comprise at least one inorganic semiconductor selected from the group consisting essentially of: silicon, gallium arsenide (GaAs), gallium nitride (GaN), GaP, InAlGaP, AlInGaAs, InGaNAs, and AlInGaSb, and mixtures or combinations thereof.
15. The method of claim 13 , wherein the plurality of diodes comprise at least one organic semiconductor selected from the group consisting essentially of: π-conjugated polymers, poly(acetylene)s, poly(pyrrole)s, poly(thiophene)s, polyanilines, polythiophenes, poly(p-phenylene sulfide), poly(para-phenylene vinylene)s (PPV) and PPV derivatives, poly(3-alkylthiophenes), polyindole, polypyrene, polycarbazole, polyazulene, polyazepine, poly(fluorene)s, polynaphthalene, polyaniline, polyaniline derivatives, polythiophene, polythiophene derivatives, polypyrrole, polypyrrole derivatives, polythianaphthene, polythianaphthane derivatives, polyparaphenylene, polyparaphenylene derivatives, polyacetylene, polyacetylene derivatives, polydiacethylene, polydiacetylene derivatives, polyparaphenylenevinylene, polyparaphenylenevinylene derivatives, polynaphthalene, polynaphthalene derivatives, polyisothianaphthene (PITN), polyheteroarylenvinylene (ParV) in which the heteroarylene group is thiophene, furan or pyrrol, polyphenylene-sulphide (PPS), polyperinaphthalene (PPN), polyphthalocyanine (PPhc), and their derivatives, copolymers thereof, and mixtures or combinations thereof.
16. The method of claim 13 , wherein the at least one solvent comprises one or more solvents selected from the group consisting essentially of: water; alcohols, cyclic alcohols, ethers, esters, glycols, glycerols, carbonates, acetonitrile, tetrahydrofuran (THF), dimethyl formamide (DMF), N-methyl formamide (NMF), dimethyl sulfoxide (DMSO), and mixtures thereof.
17. The method of claim 13 , wherein the at least one viscosity modifier comprises one or more viscosity modifiers selected from the group consisting essentially of: clays, saccharides, polysaccharides, celluloses, modified celluloses, acrylate polymers and copolymers, (meth)acrylate polymers and copolymers, polyvinyl polymers and copolymers, polyethylene polymers and copolymers, ethers, esters, acetates, glycols, glycerols, fumed silica, silica powders, modified ureas, and mixtures thereof.
18. The method of claim 13 , wherein prior to the step of adding a second solvent, the method further comprises:
releasing the plurality of diodes from a wafer into a third solvent.
19. The method of claim 18 , wherein the step of releasing the plurality of diodes from the wafer further comprises using a laser to perform a laser lift-off of the plurality of diodes from a second, back of the wafer.
20. The method of claim 18 , further comprising:
substantially removing the third solvent; and
adding the first solvent; and
repeating the steps of substantially removing the third solvent and adding the first solvent until the amount of the third solvent remaining is under 1.0% by weight of the mixture of the plurality of diodes and the first solvent.
21. A method of making a liquid or gel suspension of diodes, the method comprising:
adding at least one viscosity modifier to a plurality of diodes in at least one solvent;
adding a plurality of substantially chemically inert and substantially optically transmissive particles to the plurality of diodes, the at least one solvent and the at least one viscosity modifier, wherein each particle of the plurality of substantially chemically inert particles has a size between 10 microns to 70 microns in any dimension;
and
mixing the plurality of diodes, the plurality of substantially chemically inert and substantially optically transmissive particles, the at least one solvent and the at least one viscosity modifier until the viscosity is at least 100 centipoise (cps) measured at 25° C. to form the liquid or gel suspension of the plurality of diodes, each diode of the plurality of diodes comprising:
a light emitting or absorbing region having a lateral dimension between 10 microns to 40 microns and a height between 2 to 7 microns;
a first terminal coupled to the light emitting or absorbing region on a first side, the first terminal having a height less than 6 microns; and
a second terminal coupled to the light emitting or absorbing region on a second side opposite the first side, the second terminal having a height less than 6 microns;
wherein each diode of the plurality of diodes has a lateral dimension between 10 to 50 microns and a height between 5 to 25 microns; and
wherein each diode of the plurality of diodes comprises at least one inorganic semiconductor selected from the group consisting essentially of: silicon, gallium arsenide (GaAs), gallium nitride (GaN), GaP, InAlGaP, AlInGaAs, InGaNAs, and AlInGaSb, and mixtures or combinations thereof.