Systems and methods for heat management of an information handling resource in an information handling system
View Patent ↗In accordance with embodiments of the present disclosure, a system may include a structural element and a heat pipe. The structural element may be for mechanically supporting an information handling resource. The heat pipe may be thermally and mechanically coupled to the structural element, such that the heat pipe conducts heat generated by an information handling resource supported by the structural element to the structural element.
1. An information handling resource assembly comprising:
a riser assembly suitable for being received in a bay of an information handling system chassis, the riser assembly comprising:
a riser board wherein a primary side of the riser board includes slots for receiving information handling resource modules and wherein an integrated circuit is affixed to secondary side of the riser board;
a riser caddy, comprising:
a base comprising a structural element affixed to and mechanically supporting the riser board wherein the secondary side of the riser board faces, and is substantially parallel with, a primary side of the base structural element; and
a handle, coupled to the base, configured to insert the riser board into the bay and remove the riser board from the bay; and
a heat pipe assembly mechanically coupled to the secondary side of the base wherein the heat pipe assembly includes a thermally conductive heat pipe thermally coupled to the integrated circuit.
2. The system of claim 1 , wherein a primary side of the handle faces, and is substantially parallel to the secondary side of the base.
3. The system of claim 1 , wherein the handle comprises a U-shaped handle defining a central void and wherein the heat pipe assembly is affixed to the base within a central region of the base defined by projecting the central void onto the base.
4. The system of claim 3 , wherein the central region of the base includes an opening aligned to the integrated circuit affixed to the riser board.
5. The system of claim 4 , wherein the heat pipe assembly includes a thermally conductive block mechanically affixed to the heat pipe and aligned to the opening of the base, wherein the thermally conductive block is sized in accordance with the integrated circuit to form a thermally conductive interface between the integrated circuit and the heat pipe assembly.
6. The system of claim 4 , wherein the base comprises a thermally conductive base and wherein the base dissipates heat from the heat pipe assembly.
7. The system of claim 1 , wherein the riser board comprises a memory riser, the slots comprise slots for receiving memory modules, and the integrated circuit comprises a memory controller.
8. The system of claim 1 , further comprising a heat sink protection screen mechanically coupled to the base such that the base and the heat sink protection screen physically enclose the heat pipe.
9. A method comprising:
providing a riser board wherein a primary side of the riser board includes slots for receiving information handling resource modules and wherein an integrated circuit is affixed to a secondary side of the riser board;
affixing a base of a riser caddy to the riser board to provide a structural element mechanically supporting the riser board wherein the secondary side of the riser board faces a primary side of the base structural element; and
coupling a handle of the riser caddy to the base, wherein the handle is configured to insert the riser board into a bay of an information handling system chassis and remove the riser board from the bay; and
mechanically coupling a heat pipe assembly to the secondary side of the base wherein the heat pipe assembly includes a heat pipe thermally coupled to the integrated circuit.
10. The method of claim 9 , wherein a primary side of the handle faces, and is substantially parallel to the secondary side of the base.
11. The method of claim 9 , wherein the handle comprises a U-shaped handle defining a central void and wherein the heat pipe assembly is affixed to the base within a central region of the base defined by projecting the central void onto the base.
12. The method of claim 11 , wherein the central region of the base includes an opening aligned to the integrated circuit affixed to the riser board.
13. The method of claim 9 , wherein the heat pipe assembly includes a thermally conductive block mechanically affixed to the heat pipe and aligned to the opening of the base, wherein the thermally conductive block is sized in accordance with the integrated circuit to form a thermally conductive interface between the integrated circuit and the heat pipe assembly.
14. The method of claim 12 , wherein the base comprises a thermally conductive base and wherein the base dissipates heat from the heat pipe assembly.
15. The method of claim 9 , wherein the riser board comprises a memory riser, the slots comprise slots for receiving memory modules, and the integrated circuit comprises a memory controller.
16. The method of claim 9 , further comprising mechanically coupling a heat sink protection screen to the structural element such that the structural element and the heat sink protection screen physically enclose the heat pipe.
17. An information handling system comprising:
a chassis comprising one or more bays each configured to receive an information handling resource assembly; and
a riser assembly disposed in one of the one or more bays, the riser assembly comprising:
a riser board wherein a primary side of the riser board includes slots for receiving information handling resource modules and wherein an integrated circuit is affixed to a secondary side of the riser board;
a riser caddy comprising:
a base comprising a structural element affixed to and mechanically supporting the riser board wherein the secondary side of the riser board faces a primary side of the base structural element; and
a handle, coupled to the base, configured to insert the riser board into a bay and remove the riser board from the bay; and
a heat pipe assembly mechanically coupled to the secondary side of the base wherein the heat pipe assembly includes a heat pipe thermally coupled to the integrated circuit.
18. The information handling system of claim 17 , wherein the handle comprises a U-shaped handle defining a central void and the heat pipe assembly is affixed to the base within a central region of the base defined by projecting the central void onto the base and wherein the central region of the base includes an opening aligned to the integrated circuit affixed to the riser board.
19. The information handling system of claim 18 , wherein the heat pipe assembly includes a thermally conductive block mechanically affixed to the heat pipe and aligned to the opening of the base, wherein the thermally conductive block is sized in accordance with the integrated circuit to form a thermally conductive interface between the integrated circuit and the heat pipe assembly.
20. The information handling system of claim 17 , wherein the base comprises a thermally conductive base constructed of steel or aluminum and wherein the base dissipates heat from the heat pipe assembly.