Substrate processing method and substrate processing apparatus
A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off a liquid remaining on the substrate, and a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate.
1. A substrate processing method comprising:
a chemical liquid supplying step of supplying a chemical liquid having a first temperature to a major surface of a substrate;
a rinse liquid supplying step of supplying, after the chemical liquid supplying step, a rinse liquid having a second temperature lower than the first temperature to the major surface of the substrate to rinse off the liquid remaining on the substrate;
a reaction liquid supplying step of discharging, after the chemical liquid supplying step and before the rinse liquid supplying step, a reaction-liquid-containing liquid, which contains, at least at a start of discharge of itself, a reaction liquid, causing an exothermic reaction upon mixing with the chemical liquid supplied to the substrate in the chemical liquid supplying step, and a heat generating liquid, generating heat upon mixing with the reaction liquid, and has a liquid temperature not more than the first temperature and not less than the second temperature, toward the major surface of the substrate in a state where the chemical liquid supplied to the substrate in the chemical liquid supplying step remains on the substrate; and
a reaction liquid concentration changing step of reducing, in parallel to the reaction liquid supplying step, a proportion of the heat generating liquid contained in the reaction-liquid-containing liquid discharged toward the substrate such that a liquid temperature of the reaction-liquid-containing liquid discharged toward the substrate decreases to a temperature lower than a liquid temperature of the reaction-liquid-containing liquid at the start of discharge of the reaction-liquid-containing liquid.
2. The substrate processing method according to claim 1 , wherein the reaction liquid concentration changing step includes a step of changing a mixing ratio of the reaction liquid and the heat generating liquid from a first mixing ratio, in which the proportion of the heat generating liquid is greater than the proportion of the reaction liquid, to a second mixing ratio, in which the proportion of the heat generating liquid is less than the proportion of the reaction liquid, to reduce the proportion of the heat generating liquid contained in the reaction-liquid-containing liquid discharged toward the substrate and decrease the temperature of the reaction-liquid-containing liquid discharged toward the substrate to lower than the temperature of the reaction-liquid-containing liquid at the start of discharge of itself.
3. The substrate processing method according to claim 1 , wherein the reaction liquid concentration changing step includes a step of reducing the proportion of the heat generating liquid contained in the reaction-liquid-containing liquid discharged toward the substrate to zero to decrease the temperature of the reaction-liquid-containing liquid discharged toward the substrate to lower than a temperature of the reaction-liquid-containing liquid at the start of discharge of itself.
4. The substrate processing method according to claim 1 , wherein the chemical liquid supplied to the substrate in the chemical liquid supplying step is a mixed liquid of a reaction chemical liquid and a heat generating chemical liquid that is higher in temperature than the reaction chemical liquid and generates heat upon mixing with the reaction chemical liquid, and
the reaction-liquid-containing liquid at the start of discharge of itself is a mixed liquid of the reaction chemical liquid as the reaction liquid and the heat generating chemical liquid as the heat generating liquid.
5. The substrate processing method according to claim 1 , wherein the chemical liquid supplied to the substrate in the chemical liquid supplying step is a mixed liquid of a reaction chemical liquid and a heat generating chemical liquid that is higher in temperature than the reaction chemical liquid and generates heat upon mixing with the reaction chemical liquid, and
the reaction-liquid-containing liquid at the start of discharge of itself is a mixed liquid of the reaction liquid that causes the exothermic reaction upon mixing with the chemical liquid supplied to the substrate in the chemical liquid supplying step and a heat-generating-chemical-liquid-containing liquid containing the heat generating chemical liquid and serving as the heat generating liquid.
6. The substrate processing method according to claim 1 , wherein the reaction liquid is a liquid that is the same in composition as the rinse liquid supplied to the substrate in the rinse liquid supplying step and causes the exothermic reaction upon mixing with the chemical liquid supplied to the substrate in the chemical liquid supplying step, and
the reaction liquid concentration changing step includes a step of reducing the proportion of the heat generating liquid contained in the reaction-liquid-containing liquid discharged toward the substrate to zero to decrease the temperature of the reaction-liquid-containing liquid discharged toward the substrate to lower than the temperature of the reaction-liquid-containing liquid at the start of discharge of itself and make a composition of the reaction-liquid-containing liquid discharged toward the substrate match a composition of the rinse liquid supplied to the substrate in the rinse liquid supplying step.