Semiconductor device and method for fabricating the same
View Patent ↗A semiconductor device including a conductive layer, a diffusion barrier layer formed over the conductive layer, including a refractory metal compound, and acquired after a surface treatment, and a metal silicide layer formed over the diffusion barrier layer. The adhesion between a diffusion barrier layer and a metal silicide layer may be improved by increasing the surface energy of the diffusion barrier layer through a surface treatment. Therefore, although the metal silicide layer is fused in a high-temperature process, it is possible to prevent a void from being caused at the interface between the diffusion barrier layer and the metal silicide layer. Moreover, it is possible to increase the adhesion between a conductive layer and the diffusion barrier layer by increasing the surface energy of the conductive layer through the surface treatment.
1. A method for fabricating a semiconductor device, comprising:
forming a conductive layer;
forming a diffusion barrier layer including a refractory metal compound over the conductive layer;
performing a surface treatment onto an upper portion of the diffusion barrier layer so that the upper portion of the diffusion barrier layer is physically different from a lower portion of the diffusion barrier layer; and
forming a metal silicide layer over the diffusion barrier layer.
2. The method of claim 1 , further comprising: performing a surface treatment onto the conductive layer.
3. The method of claim 1 , wherein the performing of the surface treatment onto the upper portion of the diffusion barrier layer increases a surface energy of the upper portion of the diffusion barrier layer.
4. The method of claim 1 , wherein the surface treatment onto the upper portion of the diffusion barrier layer is performed through an energy ion implantation process or a plasma treatment.
5. The method of claim 1 , wherein the surface treatment onto the upper portion of the diffusion barrier layer is performed using an inert gas.
6. The method of claim 1 , wherein an interface between the diffusion barrier layer and the metal silicide layer achieves an ohmic contact due to the surface treatment.
7. The method of claim 1 , wherein the diffusion barrier layer includes a metal layer containing nitrogen.