Method of manufacturing semiconductor device and semiconductor device

1. A method of manufacturing a semiconductor device, the method comprising:

mounting a plurality of semiconductor chips on a surface of a wiring board;

enclosing the plurality of semiconductor chips on the surface of the wiring board in a sealing resin comprising an inorganic filler and an organic resin;

cutting the wiring board and the sealing resin into a plurality of sealing resin layers each having at least one semiconductor chip therein;

placing a separated sealing resin layer in a vacuum environment;

removing a portion of the separated sealing resin layer by dry etching such that a portion of inorganic filler exposed at front and side surfaces of the sealing resin layer to form irregularities on the front and side surfaces of the sealing resin, the dry etching being carried out by sputter etching the surfaces of the at least one separated sealing resin layer within the vacuum environment; and

forming a shield layer on the separated sealing resin layer by sputter deposition in the vacuum environment, the shield layer contacting the exposed portion of the inorganic filler on the front and side surfaces of the separated sealing resin layer, the shield layer being formed without removing the separated sealing resin layer from the vacuum environment after the dry etching.

2. The method according to claim 1 , further comprising forming a protective layer on the shield layer after forming the shield layer.

3. The method of claim 2 , wherein the protective layer comprises a material having a greater corrosion resistance and electro-migration resistance than a material comprising the shield layer.

4. The method of claim 1 , further comprising depositing wherein the shield layer is deposited such that a sheet resistance value thereof is 0.5Ω or less, the sheet resistance value being a value obtained by dividing an electrical resistivity of the shield layer by a thickness of the shield layer.

5. The method of claim 1 , wherein the shield layer comprises copper.

6. The method of claim 1 , wherein

the semiconductor chip is mounted on the wiring board such that the semiconductor chip is electrically connected to a via extending through a thickness of the wiring board, the via being connected to a conductor of the wiring board extending to an edge of the wiring board; and

the shield layer is electrically connected to the conductor of the wiring board at the edge of the wiring board.

7. The method of claim 6 , wherein the conductor of the wiring board is a conductive mesh extending to the edge of the wiring board.

8. The method of claim 6 , wherein the conductor of the wiring board is a solid film extending to the edge of the wiring board.

9. The method of claim 7 , wherein the conductor is within an interior of the wiring board.

10. The method of claim 8 , wherein the conductor is within an interior of the wiring board.

11. The method of claim 1 , wherein the inorganic filler is a particulate.

12. The method of claim 1 , wherein the dry etching is performed for at least 100 seconds, but less than 300 seconds.

13. A method of manufacturing a semiconductor device, the method comprising:

mounting a plurality of semiconductor chips on a surface of a substrate, the substrate including an inner conductive layer electrically connected to a ground terminal of each semiconductor chip using at least one via exposed at the surface of the substrate;

covering the plurality of semiconductor chips on the surface of the substrate with a sealing resin comprising an inorganic filler and an organic resin;

cutting the sealing resin and the substrate to form a plurality of sealing resin layers, each having a semiconductor chip therein, the inner conductive layer of the substrate being exposed at a side edge of each sealing resin layer;

placing a separated sealing resin layer in a vacuum environment;

reverse sputter etching the front and side surfaces of the separated sealing layer in the vacuum environment to remove portions of the separated sealing layer to a depth between 2.5 nm and 7.5 nm such that a portion of the inorganic filler is exposed at the front and side surfaces of the separated sealing resin layer and irregularities are formed on the front and side surfaces of the separated sealing resin layer; and

forming a shield layer on the separated sealing resin layer by sputter deposition in the vacuum environment, the shield layer contacting the exposed portion of the inorganic filler and being electrically connected to the inner conductive layer at the side edge of the separated sealing resin layer, the shield layer being formed without removing the separated sealing resin layer from the vacuum environment after reverse sputter etching the separated sealing resin layer.

14. The method of claim 13 , further comprising:

ashing an entire surface of the separated sealing resin layer in the vacuum environment after the reverse sputter etching.

15. The method of to claim 13 , further comprising forming a protective layer on the shield layer.

16. The method of claim 13 , wherein the shield layer is deposited such that a sheet resistance value thereof is 0.5Ω or less, the sheet resistance value being a value obtained by dividing an electrical resistivity of the shield layer by a thickness of the shield layer.

17. The method of claim 13 , wherein the inorganic filler is a particulate.

18. The method of claim 13 , wherein the inner conductive layer is a mesh embedded within the substrate.

19. The method of claim 13 , wherein the vacuum environment is a sputter chamber.