Method and system for a photonic interposer

1. A method for communication, the method comprising:

in an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer:

receiving one or more continuous wave (CW) optical signals in said silicon photonic interposer from an optical source external to said silicon photonic interposer;

processing said one or more received CW optical signals based on electrical signals received from said one or more CMOS electronics die;

receiving modulated optical signals in said silicon photonic interposer via one or more optical couplers on said silicon photonic interposer;

generating electrical signals in said silicon photonic interposer based on said received modulated optical signals; and

communicating said generated electrical signals to said one or more CMOS electronics die.

2. The method according to claim 1 , comprising communicating said generated electrical signals to said one or more CMOS electronics die via copper pillars.

3. The method according to claim 1 , comprising receiving said one or more CW optical signals in said silicon photonic interposer from an optical source assembly coupled to said silicon photonic interposer.

4. The method according to claim 1 , comprising receiving said one or more CW optical signals from one or more optical fibers coupled to said silicon photonic interposer.

5. The method according to claim 1 , comprising processing said one or more received CW optical signals utilizing one or more optical modulators in said silicon photonic interposer.

6. The method according to claim 5 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

7. The method according to claim 1 , comprising generating said electrical signals in said silicon photonic interposer utilizing one or more photodetectors integrated in said silicon photonic interposer.

8. The method according to claim 1 , wherein said one or more optical couplers on said silicon photonic interposer comprise grating couplers.

9. The method according to claim 1 , wherein said one or more electronics die comprise one or more of: a processor core, a switch core, or router.

10. The method according to claim 1 , wherein said integrated optical communication system comprises a plurality of transceivers.

11. A system for communication, the system comprising:

an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to:

receive one or more continuous wave (CW) optical signals in said silicon photonic interposer from an optical source external to said silicon photonic interposer;

process said one or more received CW optical signals based on electrical signals received from said one or more CMOS electronics die;

receive modulated optical signals in said silicon photonic interposer via optical couplers on said silicon photonic interposer;

generate electrical signals in said silicon photonic interposer based on said received modulated optical signals; and

communicate said generated electrical signals to said one or more CMOS electronics die.

12. The system according to claim 11 , wherein said integrated optical communication system is operable to communicate said generated electrical signals to said one or more CMOS electronics die via copper pillars.

13. The system according to claim 11 , wherein said hybrid integration optical communication system is operable to receive said one or more CW optical signals in said silicon photonic interposer from an optical source assembly coupled to said silicon photonic interposer.

14. The system according to claim 11 , wherein said hybrid integration optical communication system is operable to receive said one or more CW optical signals from one or more optical fibers coupled to said silicon photonic interposer.

15. The system according to claim 11 , wherein said hybrid integration optical communication system is operable to process said one or more received CW optical signals utilizing one or more optical modulators in said silicon photonic interposer.

16. The system according to claim 15 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

17. The system according to claim 11 , wherein said hybrid integration optical communication system is operable to generate said electrical signals in said silicon photonic interposer utilizing one or more photodetectors integrated in said silicon photonic interposer.

18. The system according to claim 11 , wherein said one or more optical couplers on said silicon photonic interposer comprise grating couplers.

19. The system according to claim 11 , wherein said one or more electronics die comprise one or more of: a processor core, a switch core, or router.

20. A system for communication, the system comprising:

an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to:

receive one or more continuous wave (CW) optical signals in said photonics die from an optical source coupled to said silicon photonic interposer via one or more optical fibers;

process said one or more received CW optical signals based on electrical signals received from said one or more CMOS electronics die;

receive modulated optical signals in said silicon photonic interposer via optical couplers on said silicon photonic interposer;

generate electrical signals in said silicon photonic interposer based on said received modulated optical signals; and

communicate said generated electrical signals to said one or more CMOS electronics die.