Antenna structure and method for manufacturing antenna
A method for manufacturing an antenna includes the steps of: providing a ferrite sheet; forming a via hole through the ferrite sheet, wherein the via hole is connected between a first surface and a second surface of the ferrite sheet; forming a nonconductive ink layer on the first surface and the second surface and in the via hole of the ferrite sheet; applying a displacement process to the nonconductive ink layer so as to form a first metal layer on the nonconductive ink layer; and applying a thickening process to the first metal layer so as to form a second metal layer on the first metal layer, wherein the first metal layer and the second metal layer both extend from the first surface through the via hole to the second surface of the ferrite sheet.
1. A method for manufacturing an antenna, comprising the steps of:
providing a ferrite sheet;
forming at least one via hole through the ferrite sheet, wherein the via hole is connected between a first surface and a second surface of the ferrite sheet;
forming a nonconductive ink layer on the first surface and the second surface and in the via hole of the ferrite sheet;
applying a displacement process to the nonconductive ink layer so as to form a first metal layer on the nonconductive ink layer; and
applying a thickening process to the first metal layer so as to form a second metal layer on the first metal layer, wherein the first metal layer and the second metal layer extend from the first surface through the via hole to the second surface of the ferrite sheet,
wherein the nonconductive ink layer comprises base metal powder, and
wherein the displacement process includes placing the ferrite sheet and the nonconductive ink layer into aqueous solution which includes precious metal ions.
2. The method as claimed in claim 1 , wherein the ferrite sheet comprises a first PET (Polyethylene Terephthalate, PET) layer, a second PET layer, a first gel layer, a second gel layer, and a ferrite layer, the first gel layer is configured to adhere the first PET layer to the ferrite sheet, the second gel layer is configured to adhere the second PET layer to the ferrite sheet, and the ferrite layer is disposed between the first PET layer and the second PET layer.
3. The method as claimed in claim 1 , wherein the nonconductive ink layer further comprises epoxy.
4. The method as claimed in claim 1 , wherein the first metal layer and the second metal layer each comprise copper, nickel, silver, palladium, platinum, and/or gold.
5. The method as claimed in claim 1 , wherein the thickening process is a chemical-plating process or an electroplating process.
6. The method as claimed in claim 1 , further comprising:
forming a pad on the first surface of the ferrite sheet by using the first metal layer and the second metal layer.
7. The method as claimed in claim 1 , further comprising:
forming an antenna branch on the second surface of the ferrite sheet by using the first metal layer and the second metal layer.
8. The method as claimed in claim 7 , further comprising:
applying a fitting process or a printing process so as to form a first protection layer on the antenna branch.
9. The method as claimed in claim 8 , further comprising:
applying a surface treatment process so as to form a second protection layer on the second metal layer, wherein the first protection layer and the second protection layer are configured to cover the first metal layer and the second metal layer completely.
10. The method as claimed in claim 9 , wherein the second protection layer is a nickel/gold-plated board or an OSP (Organic Solderability Preservative) film.
11. The method as claimed in claim 9 , further comprising:
adhering the first protection layer to a case by using an adhesion layer.
12. A method for manufacturing an antenna, comprising the steps of:
providing a ferrite sheet;
forming at least one via hole through the ferrite sheet, wherein the via hole is connected between a first surface and a second surface of the ferrite sheet;
forming a nonconductive ink layer on the first surface and the second surface and in the via hole of the ferrite sheet;
applying a reduction-oxidation process to the nonconductive ink layer so as to form a metal atomic layer on the nonconductive ink layer; and
applying a chemical-plating process to the metal atomic layer so as to form a metal layer on the metal atomic layer, wherein the metal atomic layer and the metal layer extend from the first surface through the via hole to the second surface of the ferrite sheet.
13. The method as claimed in claim 12 , wherein the reduction-oxidation process comprises soaking the nonconductive ink layer in a reducing agent.
14. The method as claimed in claim 13 , wherein the reducing agent comprises at least one of sodium borohydride, hypophosphite, and amine compounds.
15. The method as claimed in claim 12 , wherein the metal atomic layer comprises palladium.
16. The method as claimed in claim 12 , wherein the metal layer comprises copper.
17. The method as claimed in claim 12 , wherein the nonconductive ink layer comprises catalytic metal ions and epoxy.
18. The method as claimed in claim 12 , wherein the chemical-plating process comprises using at least one of copper sulfate, formaldehyde, sodium hydroxide, and ethylenediamine tetraacetic acid.