IP Library Granted Patent US 9,401,192
Granted Patent B2
US 9,401,192 · App. 14/479,025 · Granted Jul 26, 2016

Ferroelectric memory device and timing circuit to control the boost level of a word line

Inventors: Masaki Okuda (Shinjuku, JP); Keizo Morita (Sagamihara, JP); Tomohisa Hirayama (Kawasaki, JP)
Assignee: FUJITSU SEMICONDUCTOR LIMITED
G11C8/08G11C8/10G11C8/18
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,401,192
App. No.
14/479,025
Granted
Jul 26, 2016
Kind
B2
Abstract

A semiconductor memory device includes a memory cell array, a word line decoder, a time determination signal generation circuit, and a timing circuit. The memory cell array is configured to include a plurality of memory cells, and the word line decoder is configured to control selection and a voltage level of a word line connected to each of the memory cells. The time determination signal generation circuit is configured to generate a time determination signal indicating a determination time, the determination time being a reference by which a change in a command is determined, and the timing circuit is configured to determine the change in the command from the time determination signal and generate a control signal which controls whether or not a selected word line is pre-charged.

Claims (33)

1. A semiconductor memory device, comprising:

a memory cell array configured to include a plurality of memory cells;

a word line decoder configured to control selection and a voltage level of a word line connected to each of the memory cells;

a time determination signal generation circuit configured to generate a time determination signal indicating a determination time, the determination time being a reference by which a change in a command is determined; and

a timing circuit configured to determine the change in the command from the time determination signal and generate a control signal which controls whether or not a selected word line is pre-charged,

wherein the control of whether or not a selected word line is pre-charged is carried out when, after a write command is output, the write command to write first data is output by setting a potential of a bit line connected to the memory cell to a power supply voltage and setting a potential of a plate line connected to the memory cell to a ground potential, and

wherein the control of whether or not a selected word line is pre-charged is carried out when the first data is written after second data that are different from the first data have been written to all of the memory cells.

2. The semiconductor memory device according to claim 1 , wherein the time determination signal generation circuit is installed in the timing circuit.

3. The semiconductor memory device according to claim 1 , wherein the control signal controls a decoder circuit in the word line decoder.

4. The semiconductor memory device according to claim 1 , wherein the change in a command corresponds to a cycle time with which the memory cell is accessed.

5. The semiconductor memory device according to claim 1 , wherein the semiconductor memory device further comprises a column line decoder configured to control selection of a bit line connected to each of the memory cells.

6. The semiconductor memory device according to claim 5 , wherein:

the semiconductor memory device is a ferroelectric memory, and

the semiconductor memory device further comprises a plate line decoder configured to control selection of a plate line connected to each of the memory cells.

7. The semiconductor memory device according to claim 6 , wherein the memory cells each comprise a 1T1C-type ferroelectric memory cell which contains a transistor and a capacitor.

8. The semiconductor memory device according to claim 1 , wherein the command is a chip enable signal.

9. A semiconductor memory device, comprising:

a memory cell array configured to include a plurality of memory cells;

a word line decoder configured to control selection and a voltage level of a word line connected to each of the memory cells;

a time determination signal generation circuit configured to generate a time determination signal indicating a determination time, the determination time being a reference by which a change in a command is determined; and

a timing circuit configured to determine the change in the command from the time determination signal and generate a control signal which controls whether or not a selected word line is pre-charged, wherein the timing circuit compares a chip enable signal with the time determination signal and pre-charges the selected word line when an enable time by the chip enable signal is longer than the determination time by the time determination signal.

10. A semiconductor memory device, comprising:

a memory cell array configured to include a plurality of memory cells;

a word line decoder configured to control selection and a voltage level of a word line connected to each of the memory cells;

a time determination signal generation circuit configured to generate a time determination signal indicating a determination time, the determination time being a reference by which a change in a command is determined; and

a timing circuit configured to determine the change in the command from the time determination signal and generate a control signal which controls whether or not a selected word line is pre-charged, wherein the time determination signal generation circuit further comprises a word line decoder monitoring circuit configured to monitor a leakage current in the word line decoder, and generate the time determination signal by using an output signal of the word line decoder monitoring circuit.

11. A semiconductor memory device, comprising:

a memory cell array configured to include a plurality of memory cells;

a word line decoder configured to control selection and a voltage level of a word line connected to each of the memory cells;

a time determination signal generation circuit configured to generate a time determination signal indicating a determination time, the determination time being a reference by which a change in a command is determined; and

a timing circuit configured to determine the change in the command from the time determination signal and generate a control signal which controls whether or not a selected word line is pre-charged, wherein the time determination signal generation circuit further comprises a differential amplifier configured to define the determination time in the time determination signal by comparing a gate voltage of a transfer gate transistor connected to the word line with a reference voltage, the word line being monitored by the word line decoder monitoring circuit.

12. The semiconductor memory device according to claim 11 , wherein a potential of the reference voltage is configured to be adjustable.

13. The semiconductor memory device according to claim 1 , wherein the word line decoder is configured to boost a gate voltage of a transfer gate transistor connected to the selected word line in a plurality of steps.

Assignments (4)
CHANGE OF NAME Recorded Jan 29, 2025
From: FUJITSU SEMICONDUCTOR MEMORY SOLUTION LIMITED
To: RAMXEED LIMITED
Reel/Frame 070054/0242 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2020
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR MEMORY SOLUTION LIMITED
Reel/Frame 053195/0249 →
CHANGE OF ADDRESS Recorded Dec 23, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 041188/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2014
From: OKUDA, MASAKI; MORITA, KEIZO; HIRAYAMA, TOMOHISA
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 033703/0454 →
Priority Claims (1)
JP 2013-216500 · Oct 17, 2013 · national
Continuity (1)
Related Publication 20150109875A1 · Apr 23, 2015