IP Library › Granted Patent US 9,591,775
Granted Patent B2
US 9,591,775 · App. 14/480,033 · Granted Mar 7, 2017

Mezzanine-style structure with integrated wiring harness

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Quick Facts
Patent No.
US 9,591,775
App. No.
14/480,033
Granted
Mar 7, 2017
Kind
B2
Abstract

In accordance with these and other embodiments of the present disclosure, a system may include a top plate, a bottom plate mechanically coupled to the top plate; a plurality of first connectors and a second connector. The plurality of first connectors may be located on an exterior surface of the top plate such that each of the plurality of first connectors is configured to electrically couple to a corresponding connector of an information handling resource as the information handling resource is mechanically supported by the top plate. The second connector may be electrically coupled to each of the plurality of first connectors and may be located on an exterior surface of the bottom plate such that the second connector is configured to electrically couple to a circuit board.

Claims (34)

1. A system, comprising:

a motherboard;

a top plate;

a bottom plate, intermediate between the top plate and the motherboard, mechanically coupled to the top plate and to the motherboard;

a motherboard mechanically coupled to the bottom plate;

a plurality of first connectors located on an exterior surface of the top plate such that each of the plurality of first connectors is configured to electrically couple to a corresponding connector of an information handling resource as the information handling resource is mechanically supported by the top plate; and

a second connector electrically coupled to each of the plurality of first connectors and located on an exterior surface of the bottom plate such that the second connector is configured to electrically couple to a circuit board.

2. The system of claim 1 , further comprising a plurality of wires coupling the second connector to the plurality of first connectors, wherein the top plate and the bottom plate form a plenum to house the plurality of wires.

3. The system of claim 1 , the plurality of first connectors each comprising a hot-pluggable connector.

4. The system of claim 1 , the plurality of first connectors each comprising a blind-mate connector.

5. The system of claim 1 , the plurality of first connectors each configured to couple to an air mover.

6. A method, comprising:

providing a top plate;

mechanically coupling a bottom plate to the top plate;

mechanically coupling the bottom plate to a motherboard, wherein the bottom plate is intermediate between the top plate and the motherboard;

locating a plurality of first connectors on an exterior surface of the top plate such that each of the plurality of first connectors is configured to electrically couple to a corresponding connector of an information handling resource as the information handling resource is mechanically supported by the top plate; and

electrically coupling a second connector to each of the plurality of first connectors and locating the second connector on an exterior surface of the bottom plate such that the second connector is configured to electrically couple to a circuit board.

7. The method of claim 6 , further comprising:

coupling the second connector to the plurality of first connectors via a plurality of wires; and

housing the plurality of wires in a plenum formed by the top plate and the bottom plate.

8. The method of claim 6 , the plurality of first connectors each comprising a hot-pluggable connector.

9. The method of claim 6 , the plurality of first connectors each comprising a blind-mate connector.

10. The method of claim 6 , the plurality of first connectors each configured to couple to an air mover.

11. An information handling system, comprising:

a motherboard; and

a subsystem comprising:

a top plate;

a bottom plate, between the top plate and the motherboard, mechanically coupled to the top plate and to the motherboard;

a plurality of first connectors located on an exterior surface of the top plate such that each of the plurality of first connectors is configured to electrically couple to a corresponding connector of an information handling resource as the information handling resource is mechanically supported by the top plate; and

a second connector electrically coupled to each of the plurality of first connectors and located on an exterior surface of the bottom plate such that the second connector electrically couples to the motherboard.

12. The information handling system of claim 11 , the subsystem further comprising a plurality of wires coupling the second connector to the plurality of first connectors, wherein the top plate and the bottom plate form a plenum to house the plurality of wires.

13. The information handling system of claim 11 , the plurality of first connectors each comprising a hot-pluggable connector.

14. The information handling system of claim 11 , the plurality of first connectors each comprising a blind-mate connector.

15. The information handling system of claim 11 , the plurality of first connectors each configured to couple to an air mover.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL USA L.P.; ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF REEL 034591 FRAME 0391 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040027/0719 →
RELEASE OF REEL 034590 FRAME 0731 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040027/0070 →
RELEASE OF REEL 034590 FRAME 0696 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040016/0964 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 034591/0391 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (NOTES) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 034590/0731 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 034590/0696 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2014
From: MARCADE, MICHAEL DENNIS; HARTMAN, COREY DEAN; PAV, DARREN B.
To: DELL PRODUCTS L.P.
Reel/Frame 033691/0720 →