IP Library Granted Patent US 9,316,767
Granted Patent B2
US 9,316,767 · App. 14/480,984 · Granted Apr 19, 2016

Method of manufacturing microlens array substrate, microlens array substrate, electro-optic device, and electronic

Inventor: Yoshikazu Eguchi (Fujimi-machi, JP)
Assignee: Seiko Epson Corporation
G02B3/0018G02B3/0025G02F1/133526G03B21/006G03B21/208G03B21/2073G03B33/12
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Quick Facts
Patent No.
US 9,316,767
App. No.
14/480,984
Granted
Apr 19, 2016
Kind
B2
Abstract

There is provided a method of manufacturing a microlens array substrate with improved manufacturing yield and high quality, the method including: forming a groove part along an outer edge of a first area on a surface of a substrate; forming a mask layer to cover a side of the surface, forming a plurality of openings in the first area, and forming openings along the outer edge of the first area; performing isotropic etching on the substrate through the mask layer, forming a plurality of recesses in the first area, and forming recesses across a boundary part between the first area and the groove part; removing the mask layer from the substrate; forming a light transmission material layer that has a refractive index, which is different from a refractive index of the substrate, to cover the side of the surface of the substrate and to bury the plurality of recesses; and planarizing an upper surface of the light transmission material layer.

Claims (37)

1. A method of manufacturing a microlens array substrate in which a plurality of microlenses are arranged in a first area, the method comprising:

forming a groove part along an outer edge of the first area on a first surface of a substrate;

forming a first mask layer to cover a side of the first surface of the substrate, forming a plurality of first openings corresponding to the plurality of microlenses in the first area of the first mask layer, and forming second openings along the outer edge of the first area;

performing isotropic etching on the substrate through the first mask layer, forming a plurality of first recesses corresponding to the plurality of first openings in the first area, and forming second recesses corresponding to the second openings across an edge part on a side of the first area of the groove part;

removing the first mask layer from the substrate;

forming a light transmission material layer that has a refractive index, which is different from a refractive index of the substrate, to cover the side of the first surface of the substrate and to bury the plurality of first recesses and the second recesses; and

planarizing an upper surface of the light transmission material layer.

2. The method of manufacturing a microlens array substrate according to claim 1 ,

wherein the forming of the groove part includes:

forming a second mask layer that covers the first area of the first surface of the substrate;

forming the groove part by performing anisotropic etching on the substrate through the second mask layer; and

removing the second mask layer.

3. The method of manufacturing a microlens array substrate according to claim 1 ,

wherein the removing of the first mask layer includes performing anisotropic etching on the first mask layer.

4. The method of manufacturing a microlens array substrate according to claim 1 ,

wherein the second openings are arranged to extend along the outer edge of the first area.

5. The method of manufacturing a microlens array substrate according to claim 1 ,

wherein the forming of the second openings includes forming a plurality of second openings along the outer edge of the first area, and

wherein an interval between the plurality of second openings is smaller than an interval between the plurality of first openings.

6. The method of manufacturing a microlens array substrate according to claim 1 ,

wherein the second openings are arranged in an area which is overlapped with the groove part in a planar view.

7. The method of manufacturing a microlens array substrate according to claim 6 ,

wherein a distance between a boundary part and the second openings is equal to or less than a difference between a step of the first surface and the groove part and a depth of the first recess.

8. The method of manufacturing a microlens array substrate according to claim 1 ,

wherein the second openings are arranged in the first area.

9. A microlens array substrate comprising:

a substrate;

a plurality of first recesses that are provided in a first area of a first surface of the substrate;

a groove part that is provided along an outer edge of the first area;

second recesses that are provided across a boundary part between the first area and the groove part; and

a light transmission layer that has a refractive index, which is different from a refractive index of the substrate, and that is provided to cover the first surface of the substrate and to bury the plurality of first recesses and the second recesses.

10. An electro-optic device comprising:

a first substrate;

a second substrate that is arranged to face the first substrate;

an electro-optic layer that is arranged between the first substrate and the second substrate; and

the microlens array substrate according to claim 9 that is provided on at least one of the first substrate and the second substrate.

11. An electronic apparatus comprising the electro-optic device according to claim 10 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2014
From: EGUCHI, YOSHIKAZU
To: SEIKO EPSON CORPORATION
Reel/Frame 033699/0343 →
Priority Claims (1)
JP 2013-201053 · Sep 27, 2013 · national
Continuity (1)
Related Publication 20150092139A1 · Apr 2, 2015