IP Library Granted Patent US 9,206,337
Granted Patent B2
US 9,206,337 · App. 14/483,140 · Granted Dec 8, 2015

Methods of manufacturing abrasive particle and polishing slurry

Inventor: Seung Won Jung (Anyang-Si, KR)
Assignee: INDUSTRIAL BANK OF KOREA
C09G1/02C01F17/0043C09K3/1409C09K3/1445C09K3/1463C01P2004/40
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Quick Facts
Patent No.
US 9,206,337
App. No.
14/483,140
Granted
Dec 8, 2015
Kind
B2
Abstract

Provided is a method of manufacturing an abrasive particle including a mother particle and a plurality of auxiliary particles formed on a surface of the mother particle, and a method of manufacturing a polishing slurry in which the abrasive particle is mixed with a polishing accelerating agent and a pH adjusting agent.

Claims (33)

1. A method of manufacturing an abrasive particle, comprising:

mixing a first precursor material aqueous solution and a diluted alkaline solution and thermally treating the mixture solution to prepare a mother particle having a polyhedral crystal face; and

adding an alkaline solution to a mixture solution in which the mother particle is mixed, mixing a second precursor material aqueous solution and thermally treating the resultant mixture solution to form a plurality of auxiliary particles protruded outward from a surface of the mother particle.

2. The method of claim 1 , wherein the plurality of auxiliary particles are formed so as to cover a portion of each of crystal faces centered on an edge portion where at least three crystal faces among the polyhedral crystal faces meet.

3. The method of claim 1 , wherein the preparing of the mother particle comprises:

mixing a precursor material with deionized water to prepare the first precursor material aqueous solution;

preparing a diluted alkaline solution and loading and stirring the prepared alkaline solution in a reaction container;

mixing the first precursor material aqueous solution in the reaction container and thermal treating the resultant mixture solution; and

cooling the thermally treated mixture solution.

4. The method of claim 3 , further comprising mixing an acidic solution to the first precursor material aqueous solution.

5. The method of claim 3 , wherein the thermally treating is conducted at a temperature higher than 60° C. and not higher than 100° C. for approximately 2 hours to approximately 24 hours.

6. The method of claim 5 , wherein the thermally treating temperature rises at a rate of approximately 0.2° C./min to approximately 1° C./min.

7. The method of claim 1 , wherein the forming of the auxiliary particles comprises:

adding and stirring an alkaline solution in a mixture solution in which the mother particle is mixed;

mixing the second precursor material aqueous solution prepared by mixing a precursor material with deionized water in the mixture solution in which the mother particle is mixed;

thermally treating the mixture solution; and

cooling the thermally treated mixture solution.

8. The method of claim 7 , wherein the thermally treating is conducted at a temperature higher than 60° C. and not higher than 100° C. for approximately 2 hours to approximately 24 hours.

9. The method of claim 8 , wherein the thermally treating temperature rises at a rate of approximately 0.2° C./min to approximately 1° C./min.

10. The method of claim 2 , further comprising repeating the adjusting of the size of the auxiliary particles at least one time.

11. The method of claim 10 , wherein the adjusting of the size of the auxiliary particles comprises:

adding and stirring an alkaline solution in a mixture solution in which an abrasive particle including the mother particle and the auxiliary particles formed on the surface of the mother particle is mixed;

mixing a third precursor material aqueous solution prepared by mixing a precursor material with deionized water in the mixture solution in which the abrasive particle is mixed;

thermally treating the mixture solution; and

cooling the thermally treated mixture solution.

12. The method of claim 11 , wherein the thermally treating is conducted at a temperature higher than 60° C. and not higher than 100° C. for approximately 2 hours to approximately 24 hours.

13. The method of claim 12 , wherein the thermally treating temperature rises at a rate of approximately 0.2° C./min to approximately 1° C./min.

14. The method of any of claim 1 , wherein the auxiliary particles adjacent to each other are spaced apart from each other or contact each other.

15. The method of claim 14 , wherein the plurality of auxiliary particles contacting each other have an overlapping height ranging from approximately 0% to approximately 70% to a maximum height thereof.

16. The method of claim 14 , wherein each of the mother particle and the auxiliary particles comprises a ceria particle.

17. The method of claim 1 , wherein the auxiliary particle to the mother particle is formed at a size ratio of approximately 100:1 to approximately 5:1.

18. The method of claim 17 , wherein the abrasive particle is formed to have an average particle diameter ranging from approximately 6 nm to approximately 350 nm.

19. The method of claim 18 , wherein the mother particle has an average particle diameter of approximately 5 nm to approximately 300 nm and the auxiliary particle has an average particle diameter of approximately 1 nm to approximately 50 nm.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2022
From: SHIN-ETSU CHEMICAL CO., LTD.
To: UBMATERIALS INC.
Reel/Frame 059318/0078 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2017
From: INDUSTRIAL BANK OF KOREA
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 042117/0571 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2015
From: UBMATERIALS INC.
To: INDUSTRIAL BANK OF KOREA
Reel/Frame 034902/0211 →
LICENSE Recorded Feb 3, 2015
From: UB MATERIALS, INC.
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 034874/0855 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2014
From: JUNG, SEUNG WON
To: UBMATERIALS INC.
Reel/Frame 033715/0632 →
Priority Claims (1)
KR 10-2013-0109872 · Sep 12, 2013 · national
Continuity (1)
Related Publication 20150069291A1 · Mar 12, 2015