Plasma source and methods for depositing thin film coatings using plasma enhanced chemical vapor deposition
View Patent ↗The present invention provides novel plasma sources useful in the thin film coating arts and methods of using the same. More specifically, the present invention provides novel linear and two dimensional plasma sources that produce linear and two dimensional plasmas, respectively, that are useful for plasma-enhanced chemical vapor deposition. The present invention also provides methods of making thin film coatings and methods of increasing the coating efficiencies of such methods.
1. A method of forming a coating using plasma enhanced chemical vapor deposition (PECVD), comprising:
a) providing a plasma source comprising a first hollow cathode and a second hollow cathode disposed adjacently and separated by a space;
b) producing, with the plasma source, a plasma that is linear and that is made substantially uniform over its length in the substantial absence of Hall current;
c) providing a substrate with at least one surface to be coated proximate to the plasma;
d) flowing a precursor gas through the space;
e) energizing, partially decomposing, or fully decomposing the precursor gas by contacting the plasma with the precursor gas; and
f) depositing the coating on the at least one surface of the substrate using PECVD;
wherein the depositing includes one of bonding and condensing a chemical fragment of the precursor gas containing a desired chemical element for coating on the at least one surface of the substrate.
2. The method of claim 1 , wherein the space separating the first hollow cathode and the second hollow cathode comprises a dark space.
3. The method of claim 2 , wherein the precursor gas is not energized, partially decomposed, or fully decomposed in the dark space.
4. The method of claim 2 , wherein the energizing, partially decomposing, or fully decomposing of the precursor gas is proximate to the substrate.
5. The method of claim 2 , wherein the precursor gas flows through the dark space towards the substrate.
6. The method of claim 1 , wherein a reactant gas is provided directly into a region of electron oscillation within at least one of the first hollow cathode and the second hollow cathode.
7. The method of claim 6 , wherein the reactant gas is an electrically conductive gas.
8. The method of claim 1 , wherein the first hollow cathode and the second hollow cathode each comprise two facing surfaces at the same electric potential, and wherein a reactant gas flows along the two facing surfaces of the first hollow cathode and the second hollow cathode.
9. The method of claim 1 , wherein each of the first hollow cathode and the second hollow cathode is comprised of a porous material, and
further wherein a reactant gas is provided through the pores of the porous material.
10. The method of claim 1 , wherein the precursor gas is provided through a manifold or tube.
11. The method of claim 1 , wherein a mixture comprising the precursor gas and a reactant gas is provided into the space separating the first hollow cathode and the second hollow cathode.
12. The method of claim 1 , wherein the method is performed at a pressure from about atmospheric pressure to about 10 −4 millibar.
13. The method of claim 1 , wherein the method is performed at a pressure from about 1 millibar to about 10 −3 millibar.
14. A method of forming a coating using plasma enhanced chemical vapor deposition (PECVD), comprising:
a) providing a plasma source comprising a first hollow cathode and a second hollow cathode disposed adjacently and separated by a space;
b) producing, with the plasma source, a plasma that is linear and that is made substantially uniform over its length in the substantial absence of Hall current;
c) providing a substrate with at least one surface to be coated proximate to the plasma;
d) flowing a precursor gas through the space;
e) energizing, partially decomposing, or fully decomposing the precursor gas by contacting the plasma with the precursor gas; wherein the energizing, partially decomposing, or fully decomposing the precursor gas forms condensable molecular entities which adhere to the at least one surface of the substrate.
15. The method of claim 14 , wherein the space separating the first hollow cathode and the second hollow cathode comprises a dark space.
16. The method of claim 15 , wherein the precursor gas is not energized, partially decomposed, or fully decomposed in the dark space.
17. The method of claim 15 , wherein the energizing, partially decomposing, or fully decomposing of the precursor gas is proximate to the substrate.
18. The method of claim 15 , wherein the precursor gas flows through the dark space towards the substrate.
19. The method of claim 14 , wherein a reactant gas is provided directly into a region of electron oscillation within at least one of the first hollow cathode and the second hollow cathode.
20. The method of claim 19 , wherein the reactant gas is an electrically conductive gas.
21. The method of claim 14 , wherein the first hollow cathode and the second hollow cathode each comprise two facing surfaces at the same electric potential, and wherein a reactant gas flows along the facing surfaces of the first hollow cathode and the second hollow cathode.
22. The method of claim 14 , wherein each of the first hollow cathode and the second hollow cathode is comprised of a porous material, and
further wherein a reactant gas is provided through the pores of the porous material.
23. The method of claim 14 , wherein the precursor gas is provided through a manifold or tube.
24. The method of claim 14 , wherein a mixture comprising the precursor gas and a reactant gas is provided into the space separating the first hollow cathode and the second hollow cathode.
25. The method of claim 14 , wherein the method is performed at a pressure from about atmospheric pressure to about 10 −4 millibar.
26. The method of claim 14 , wherein the method is performed at a pressure from about 1 millibar to about 10 −3 millibar.