Power semiconductor package with non-contiguous, multi-section conductive carrier
In one implementation, a power semiconductor package includes a non-contiguous, multi-section conductive carrier. A control transistor with a control transistor terminal is coupled to a first section of the multi-section conductive carrier, while a sync transistor with a sync transistor terminal is coupled to a second section of the multi-section conductive carrier. The first and second sections of the multi-section conductive carrier sink heat generated by the control and sync transistors. The first and second sections of the multi-section conductive carrier are electrically connected only through a mounting surface attached to the power semiconductor package. Another implementation of the power semiconductor package includes a driver IC coupled to a third section of the multi-section conductive carrier. A method for fabricating the power semiconductor package is also disclosed. The power semiconductor package according to the present disclosure results in effective thermal protection, current carrying capability, and a relatively small size.
1. A power semiconductor package comprising:
a non-contiguous, multi-section conductive carrier;
a control transistor with a control transistor terminal coupled to a first section of said multi-section conductive carrier;
a sync transistor with a sync transistor terminal coupled to a second section of said multi-section conductive carrier;
said first and second sections of said multi-section conductive carrier sinking heat generated by said control and sync transistors;
said first and second sections of said multi-section conductive carrier being electrically connected only through a mounting surface attached to said power semiconductor package.
2. The power semiconductor package of claim 1 , wherein said control transistor and said sync transistor form a power switching stage of a voltage converter.
3. The power semiconductor package of claim 1 , wherein said multi-section conductive carrier is made from a patterned lead frame.
4. The power semiconductor package of claim 1 , wherein said control transistor is a control FET, and said control transistor terminal is a drain of said control FET.
5. The power semiconductor package of claim 1 , wherein said control transistor is a control FET, and said control transistor terminal is a source of said control FET.
6. The power semiconductor package of claim 1 , wherein said sync transistor is a sync FET, and said sync transistor terminal is a drain of said sync FET.
7. The power semiconductor package of claim 1 , wherein said sync transistor is a sync FET, and said sync transistor terminal is a source of said sync FET.
8. The power semiconductor package of claim 1 , wherein said control transistor is a control FET, and said sync transistor is a sync FET, and wherein a source of said control FET is coupled to a drain of said sync FET through a switch node section of said multi-section conductive carrier.
9. The power semiconductor package of claim 1 , further comprising a patterned dielectric situated between a plurality of sections of said multi-section conductive carrier.
10. The power semiconductor package of claim 1 , further comprising an insulator layer overlying said multi-section conductive carrier.
11. The power semiconductor package of claim 1 , wherein said mounting surface is a printed circuit board (PCB).
12. The power semiconductor package of claim 1 , wherein said power semiconductor package is attached to said mounting surface by solder bodies.
13. A method for fabricating a power semiconductor package comprising:
providing a non-contiguous, multi-section conductive carrier;
attaching a control FET and a sync FET to said multi-section conductive carrier;
forming a dielectric layer over said multi-section conductive carrier and said control FET and sync FET;
patterning said dielectric layer to form a patterned dielectric situated between a plurality of sections of said multi-section conductive carrier;
fabricating conductive layers of said multi-section conductive carrier over said patterned dielectric and said control FET and said sync FET.
14. The method of claim 13 further comprising forming an insulator layer after said fabricating said conductive layers.
15. The method of claim 13 , wherein said control FET and said sync FET form a power switching stage of a voltage converter.
16. The method of claim 13 , wherein said multi-section conductive carrier is made by patterning a lead frame.
17. A power semiconductor package comprising:
a non-contiguous, multi-section conductive carrier;
a control transistor with a control transistor terminal coupled to a first section of said multi-section conductive carrier;
a sync transistor with a sync transistor terminal coupled to a second section of said multi-section conductive carrier;
a driver IC coupled to a third section of said multi-section conductive carrier;
said first, second, and third sections of said multi-section conductive carrier sinking heat generated by said control and sync transistors;
said first, second, and third sections of said multi-section conductive carrier being electrically connected only through a mounting surface attached to said power semiconductor package.
18. The power semiconductor package of claim 17 , wherein said control transistor and said sync transistor form a power switching stage of a voltage converter.
19. The power semiconductor package of claim 17 , wherein said multi-section conductive carrier is made from a patterned lead frame.
20. The power semiconductor package of claim 17 , wherein said control transistor is a control FET, and said sync transistor is a sync FET, and wherein a source of said control FET is coupled to a drain of said sync FET through a switch node section of said multi-section conductive carrier.